Harry Hedler

Person

Germering, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Infrared sensor, thermal imaging camera and method for producing a...
- Patent number 9,887,339
- Issue date Feb 6, 2018
- Siemens Aktiengesellschaft
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelement including a three-dimensional microstructure, and met...
- Patent number 9,884,759
- Issue date Feb 6, 2018
- Siemens Aktiengesellschaft
- Harry Hedler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing garnet interfaces and articles containing t...
- Patent number 9,650,569
- Issue date May 16, 2017
- Siemens Medical Solutions USA, Inc.
- Peter Carl Cohen
- G01 - MEASURING TESTING
Information Patent Grant
Micromechanical measuring element and method for producing a microm...
- Patent number 9,506,831
- Issue date Nov 29, 2016
- EPCOS AG
- Michael Schiffer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Force transducer forming a capacitive load cell
- Patent number 9,335,226
- Issue date May 10, 2016
- Siemens Aktiengesellschaft
- Karlheinz Amtmann
- G01 - MEASURING TESTING
Information Patent Grant
Micromechanical substrate for a diaphragm with a diffusion barrier...
- Patent number 9,170,226
- Issue date Oct 27, 2015
- Siemens Aktiengesellschaft
- Maximilian Fleischer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Radiation detector and imaging system
- Patent number 9,151,850
- Issue date Oct 6, 2015
- Siemens Aktiengesellschaft
- Harry Hedler
- G01 - MEASURING TESTING
Information Patent Grant
Radiation detector and imaging system
- Patent number 9,097,808
- Issue date Aug 4, 2015
- Siemens Aktiengesellschaft
- Harry Hedler
- G01 - MEASURING TESTING
Information Patent Grant
Device and system for selectively detecting gas components or conce...
- Patent number 8,916,827
- Issue date Dec 23, 2014
- Siemens Aktiengesellschaft
- Alexander Frey
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor chip with integrated via
- Patent number 8,912,654
- Issue date Dec 16, 2014
- Qimonda AG
- Franz Kreupl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component and method for producing a component
- Patent number 8,742,563
- Issue date Jun 3, 2014
- Intel Mobile Communications GmbH
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus having stacked semiconductor components
- Patent number 8,598,716
- Issue date Dec 3, 2013
- Qimonda AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing chip packages, and chip package produced in th...
- Patent number 8,487,448
- Issue date Jul 16, 2013
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with semiconductor chips, electronic assembly...
- Patent number 8,350,364
- Issue date Jan 8, 2013
- Qimonda AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for producing a device
- Patent number 8,188,585
- Issue date May 29, 2012
- Infineon Technologies AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical through contact
- Patent number 8,124,521
- Issue date Feb 28, 2012
- Qimonda AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced-stress through-chip feature and method of making the same
- Patent number 8,106,511
- Issue date Jan 31, 2012
- Qimonda AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit, circuit system, and method of manufacturing
- Patent number 8,072,084
- Issue date Dec 6, 2011
- Qimonda AG
- Roland Irsigler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for placing material onto a target board by means of a trans...
- Patent number 8,048,479
- Issue date Nov 1, 2011
- Qimonda AG
- Harry Hedler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with an interconnect element and method for ma...
- Patent number 8,049,310
- Issue date Nov 1, 2011
- Qimonda AG
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging device
- Patent number 8,035,220
- Issue date Oct 11, 2011
- Qimonda AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing chip packages, and chip package produced in th...
- Patent number 8,012,807
- Issue date Sep 6, 2011
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging systems and methods
- Patent number 8,004,072
- Issue date Aug 23, 2011
- Qimonda AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement and method of manufacturing a chip arrangement
- Patent number 7,960,843
- Issue date Jun 14, 2011
- Qimonda AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with re-route layer and stacked die assembly
- Patent number 7,948,071
- Issue date May 24, 2011
- Qimonda AG
- Jochen Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with a heat dissipation device
- Patent number 7,928,590
- Issue date Apr 19, 2011
- Qimonda AG
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier substrate and integrated circuit
- Patent number 7,919,868
- Issue date Apr 5, 2011
- Qimonda AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component and method for producing a component
- Patent number 7,911,068
- Issue date Mar 22, 2011
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with improved contact pad and method for fo...
- Patent number 7,884,488
- Issue date Feb 8, 2011
- Qimonda AG
- Harry Hedler
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for manufacturing a wafer level package
- Patent number 7,867,817
- Issue date Jan 11, 2011
- Qimonda AG
- Stephan Dobritz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRECONCENTRATOR FOR ABSORBING/DESORBING AT LEAST ONE COMPONENT OF GAS
- Publication number 20170189882
- Publication date Jul 6, 2017
- Ignaz EISELE
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
METHOD OF MANUFACTURING GARNET INTERFACES AND ARTICLES CONTAINING T...
- Publication number 20170145305
- Publication date May 25, 2017
- Siemens Medical Solutions USA, Inc.
- Peter Carl Cohen
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
Infrared Sensor Having a Microstructure with a Plurality of Thermoc...
- Publication number 20150316418
- Publication date Nov 5, 2015
- Harry Hedler
- G01 - MEASURING TESTING
Information Patent Application
INFRARED SENSOR, THERMAL IMAGING CAMERA AND METHOD FOR PRODUCING A...
- Publication number 20150048249
- Publication date Feb 19, 2015
- Siemens Aktiengesellschaft
- Harry Hedler
- G01 - MEASURING TESTING
Information Patent Application
Micromechanical Measuring Element and Method for Producing a Microm...
- Publication number 20150027224
- Publication date Jan 29, 2015
- EPCOS AG
- Michael Schiffer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RADIATION DETECTOR AND IMAGING SYSTEM
- Publication number 20140124676
- Publication date May 8, 2014
- Harry Hedler
- G01 - MEASURING TESTING
Information Patent Application
FORCE TRANSDUCER FORMING A CAPACITIVE LOAD CELL
- Publication number 20140123772
- Publication date May 8, 2014
- Karlheinz Amtmann
- G01 - MEASURING TESTING
Information Patent Application
RADIATION DETECTOR AND IMAGING SYSTEM
- Publication number 20140103219
- Publication date Apr 17, 2014
- Harry Hedler
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT WITH ELECTRICAL THROUGH-CONTACT AND METHOD FOR P...
- Publication number 20140084428
- Publication date Mar 27, 2014
- SIEMENS AKTIENGESELLSCHAFT
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND SYSTEM FOR SELECTIVELY DETECTING GAS COMPONENTS OR CONCE...
- Publication number 20130284928
- Publication date Oct 31, 2013
- Alexander Frey
- B82 - NANO-TECHNOLOGY
Information Patent Application
MICROMECHANICAL SUBSTRATE FOR A DIAPHRAGM WITH A DIFFUSION BARRIER...
- Publication number 20130264660
- Publication date Oct 10, 2013
- Siemens Aktiengesellschaft
- Maximilian Fleischer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SILICON PHOTOMULTIPLIER AND RADIATION DETECTOR
- Publication number 20130249035
- Publication date Sep 26, 2013
- Harry Hedler
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR PRODUCING A DEVICE
- Publication number 20120235298
- Publication date Sep 20, 2012
- INFINEON TECHNOLOGIES AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MICRO-STRUCTURE, ARRANGEMENT WITH AT LEAST TWO TH...
- Publication number 20120183732
- Publication date Jul 19, 2012
- Siemens Aktiengesellschaft
- Harry Hedler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THERMO-ELECTRIC ENERGY CONVERTER HAVING A THREE-DIMENSIONAL MICRO-S...
- Publication number 20120180839
- Publication date Jul 19, 2012
- Harry Hedler
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR PRODUCING CHIP PACKAGES, AND CHIP PACKAGE PRODUCED IN TH...
- Publication number 20110285030
- Publication date Nov 24, 2011
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING SAME WITH AN I...
- Publication number 20110217812
- Publication date Sep 8, 2011
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT AND METHOD FOR PRODUCING A COMPONENT
- Publication number 20110068485
- Publication date Mar 24, 2011
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Systems and Methods
- Publication number 20100090322
- Publication date Apr 15, 2010
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Substrate Conductors
- Publication number 20100072579
- Publication date Mar 25, 2010
- Andreas Thies
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Chips with Through Substrate Vias
- Publication number 20100065949
- Publication date Mar 18, 2010
- Andreas Thies
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing a Multichip Module Assembly
- Publication number 20100013101
- Publication date Jan 21, 2010
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Arrangement and Method of Manufacturing a Chip Arrangement
- Publication number 20090321959
- Publication date Dec 31, 2009
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component with Contact Pad
- Publication number 20090273097
- Publication date Nov 5, 2009
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH INTEGRATED VIA
- Publication number 20090256258
- Publication date Oct 15, 2009
- Franz Kreupl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device With an Interconnect Element and Method for Ma...
- Publication number 20090243047
- Publication date Oct 1, 2009
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reduced-Stress Through-Chip Feature and Method of Making the Same
- Publication number 20090218690
- Publication date Sep 3, 2009
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING SAME
- Publication number 20090212420
- Publication date Aug 27, 2009
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE COMPRISING CONDUCTIVE VIAS AND METHOD OF...
- Publication number 20090212438
- Publication date Aug 27, 2009
- Franz Kreupl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing a Wafer Level Package
- Publication number 20090194881
- Publication date Aug 6, 2009
- Stephan Dobritz
- H01 - BASIC ELECTRIC ELEMENTS

Harry Hedler

Person

Patents Grantslast 30 patents

Infrared sensor, thermal imaging camera and method for producing a...

Thermoelement including a three-dimensional microstructure, and met...

Method of manufacturing garnet interfaces and articles containing t...

Micromechanical measuring element and method for producing a microm...

Force transducer forming a capacitive load cell

Micromechanical substrate for a diaphragm with a diffusion barrier...

Radiation detector and imaging system

Radiation detector and imaging system

Device and system for selectively detecting gas components or conce...

Semiconductor chip with integrated via

Component and method for producing a component

Semiconductor apparatus having stacked semiconductor components

Method for producing chip packages, and chip package produced in th...

Electronic component with semiconductor chips, electronic assembly...

Electronic device and method for producing a device

Electrical through contact

Reduced-stress through-chip feature and method of making the same

Integrated circuit, circuit system, and method of manufacturing

Method for placing material onto a target board by means of a trans...

Semiconductor device with an interconnect element and method for ma...

Semiconductor packaging device

Method for producing chip packages, and chip package produced in th...

Packaging systems and methods

Chip arrangement and method of manufacturing a chip arrangement

Integrated circuit with re-route layer and stacked die assembly

Integrated circuit package with a heat dissipation device

Carrier substrate and integrated circuit

Component and method for producing a component

Semiconductor component with improved contact pad and method for fo...

Method for manufacturing a wafer level package

Patents Applicationslast 30 patents

PRECONCENTRATOR FOR ABSORBING/DESORBING AT LEAST ONE COMPONENT OF GAS

METHOD OF MANUFACTURING GARNET INTERFACES AND ARTICLES CONTAINING T...

Infrared Sensor Having a Microstructure with a Plurality of Thermoc...

INFRARED SENSOR, THERMAL IMAGING CAMERA AND METHOD FOR PRODUCING A...

Micromechanical Measuring Element and Method for Producing a Microm...

RADIATION DETECTOR AND IMAGING SYSTEM

FORCE TRANSDUCER FORMING A CAPACITIVE LOAD CELL

RADIATION DETECTOR AND IMAGING SYSTEM

INTEGRATED CIRCUIT WITH ELECTRICAL THROUGH-CONTACT AND METHOD FOR P...

DEVICE AND SYSTEM FOR SELECTIVELY DETECTING GAS COMPONENTS OR CONCE...

MICROMECHANICAL SUBSTRATE FOR A DIAPHRAGM WITH A DIFFUSION BARRIER...

SILICON PHOTOMULTIPLIER AND RADIATION DETECTOR

ELECTRONIC DEVICE AND METHOD FOR PRODUCING A DEVICE

THREE-DIMENSIONAL MICRO-STRUCTURE, ARRANGEMENT WITH AT LEAST TWO TH...

THERMO-ELECTRIC ENERGY CONVERTER HAVING A THREE-DIMENSIONAL MICRO-S...

METHOD FOR PRODUCING CHIP PACKAGES, AND CHIP PACKAGE PRODUCED IN TH...

INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING SAME WITH AN I...

COMPONENT AND METHOD FOR PRODUCING A COMPONENT

Packaging Systems and Methods

Through Substrate Conductors

Stacked Semiconductor Chips with Through Substrate Vias

Method for Manufacturing a Multichip Module Assembly

Chip Arrangement and Method of Manufacturing a Chip Arrangement

Semiconductor Component with Contact Pad

SEMICONDUCTOR CHIP WITH INTEGRATED VIA

Semiconductor Device With an Interconnect Element and Method for Ma...

Reduced-Stress Through-Chip Feature and Method of Making the Same

INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING SAME

INTEGRATED CIRCUIT DEVICE COMPRISING CONDUCTIVE VIAS AND METHOD OF...

Method for Manufacturing a Wafer Level Package