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Harry J. Fogelson
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Tempa, AZ, US
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last 30 patents
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Patent Grant
Lead frame with plated end leads
Patent number
7,183,630
Issue date
Feb 27, 2007
Amkor Technology, Inc.
Harry J. Fogelson
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Grant
Reduced copper lead frame for saw-singulated chip package
Patent number
6,885,086
Issue date
Apr 26, 2005
Amkor Technology, Inc.
Harry J. Fogelson
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Lead frame with plated end leads
Patent number
6,608,366
Issue date
Aug 19, 2003
Harry J. Fogelson
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR