Harry Randall Bickford

Person

Ossining, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Variable voltage CMOS off-chip driver and receiver circuits
- Patent number 8,604,828
- Issue date Dec 10, 2013
- International Business Machines Corporation
- Harry Randall Bickford
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Variable voltage, variable impedance CMOS off-chip driver and recei...
- Patent number 6,060,905
- Issue date May 9, 2000
- International Business Machines Corporation
- Harry Randall Bickford
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Bidirectional off-chip driver with receiver bypass
- Patent number 5,949,272
- Issue date Sep 7, 1999
- International Business Machines Corporation
- Harry Randall Bickford
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Structure including a partially electrochemically reduced halogenat...
- Patent number 5,874,154
- Issue date Feb 23, 1999
- International Business Machines Corporation
- Harry Randall Bickford
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for conditioning halogenated polymeric materials and structu...
- Patent number 5,800,858
- Issue date Sep 1, 1998
- International Business Machines Corporation
- Harry Randall Bickford
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for conditioning halogenated polymeric materials and structu...
- Patent number 5,730,890
- Issue date Mar 24, 1998
- Internationl Business Machines Corporation
- Harry Randall Bickford
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for conditioning halogenated polymeric materials and structu...
- Patent number 5,709,906
- Issue date Jan 20, 1998
- International Business Machines Corporation
- Harry Randall Bickford
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process of multilayer conductor chip packaging
- Patent number 5,480,841
- Issue date Jan 2, 1996
- International Business Machines Corporation
- Harry R. Bickford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip packaging structure including a ground plane
- Patent number 5,399,902
- Issue date Mar 21, 1995
- International Business Machines Corporation
- Harry R. Bickford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for conditioning halogenated polymeric materials and structu...
- Patent number 5,374,454
- Issue date Dec 20, 1994
- International Business Machines Incorporated
- Harry R. Bickford
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Conditioning of a substrate for electroless plating thereon
- Patent number 5,318,803
- Issue date Jun 7, 1994
- International Business Machines Corporation
- Harry R. Bickford
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for fluxless solder bonding
- Patent number 5,205,461
- Issue date Apr 27, 1993
- International Business Machines Corporation
- Harry R. Bickford
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aluminum bump, reworkable bump, and titanium nitride structure for...
- Patent number 5,134,460
- Issue date Jul 28, 1992
- International Business Machines Corporation
- Michael J. Brady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilevel integrated circuit packaging structures
- Patent number 5,028,983
- Issue date Jul 2, 1991
- International Business Machines Corporation
- Harry R. Bickford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tab mounted chip burn-in apparatus
- Patent number 4,956,605
- Issue date Sep 11, 1990
- International Business Machines Corporation
- Harry R. Bickford
- G01 - MEASURING TESTING
Information Patent Grant
High power, pluggable tape automated bonding package
- Patent number 4,939,570
- Issue date Jul 3, 1990
- International Business Machines, Corp.
- Harry R. Bickford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for fluxless solder bonding
- Patent number 4,937,006
- Issue date Jun 26, 1990
- International Business Machines Corporation
- Harry R. Bickford
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Double electronic device structure having beam leads solderlessly b...
- Patent number 4,862,322
- Issue date Aug 29, 1989
- Harry R. Bickford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Precision solder transfer method and means
- Patent number 4,832,255
- Issue date May 23, 1989
- International Business Machines Corporation
- Harry R. Bickford
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Harry Randall Bickford

Person

Patents Grantslast 30 patents

Variable voltage CMOS off-chip driver and receiver circuits

Variable voltage, variable impedance CMOS off-chip driver and recei...

Bidirectional off-chip driver with receiver bypass

Structure including a partially electrochemically reduced halogenat...

Method for conditioning halogenated polymeric materials and structu...

Method for conditioning halogenated polymeric materials and structu...

Method for conditioning halogenated polymeric materials and structu...

Process of multilayer conductor chip packaging

Semiconductor chip packaging structure including a ground plane

Method for conditioning halogenated polymeric materials and structu...

Conditioning of a substrate for electroless plating thereon

Method and apparatus for fluxless solder bonding

Aluminum bump, reworkable bump, and titanium nitride structure for...

Multilevel integrated circuit packaging structures

Tab mounted chip burn-in apparatus

High power, pluggable tape automated bonding package

Method and apparatus for fluxless solder bonding

Double electronic device structure having beam leads solderlessly b...

Precision solder transfer method and means