This is a continuation of application Ser. No. 07/203,568, filed May 27, 1988 abandoned which was a continuation of application Ser. No. 06/895,090, filed Aug. 11, 1986, abandoned.
Number | Name | Date | Kind |
---|---|---|---|
3531852 | Slemmons et al. | Oct 1970 | |
3821785 | Rose | Jun 1974 | |
3886585 | Konantz et al. | May 1975 | |
4000842 | Burns | Jan 1977 | |
4263606 | Yorikane | Apr 1981 | |
4551912 | Marks et al. | Nov 1985 | |
4600600 | Pammer et al. | Jul 1986 | |
4609936 | Scharr et al. | Sep 1986 |
Number | Date | Country |
---|---|---|
52-23281 | Feb 1977 | JPX |
53-33057 | Mar 1978 | JPX |
Entry |
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Liu, Tien-Shih et al., "Metallurgical Considerations in Tin-Gold Inner Lead Bonding Technology", Int. J. for Hybrid Microelectronics, vol. (12), 1978, pp. 69-76. |
Lassus, Marc, "Semiconductors with Bump Contacts . . .", Microelectronique, Jan. 12, 1976, pp. 23-25. |
Castrucci et al., IBM Tech. Discl. Bulletin, vol. 9, No. 12, May 1967, p. 1805. |
Gniewek et al., IBM Tech. Discl. Bulletin, vol. 13, No. 5, Oct. 1970, p. 1124. |
Wittmer, Appl. Physics Lett. 37(6), Sep. 15, 1980, pp. 540-542. |
Electronique & Microelectronique, No. 229, Dec. 1, 1976, pp. 23-25, M. Lassus: "Les semi-conducteurs; a protuberances". |
Number | Date | Country | |
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Parent | 203568 | May 1988 | |
Parent | 895090 | Aug 1986 |