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Harry Sax
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Straubing, DE
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Patents Grants
last 30 patents
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Patent Grant
Chip package and method of forming a chip package
Patent number
12,040,288
Issue date
Jul 16, 2024
Infineon Technologies AG
Harry Walter Sax
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package and method of forming a chip package
Patent number
11,735,534
Issue date
Aug 22, 2023
Infineon Technologies AG
Harry Walter Sax
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a layer structure, layer structure, method of for...
Patent number
11,328,935
Issue date
May 10, 2022
Infineon Technologies AG
Johann Gatterbauer
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
Publication number
20240371796
Publication date
Nov 7, 2024
INFINEON TECHNOLOGIES AG
Harry Walter SAX
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
Publication number
20230395532
Publication date
Dec 7, 2023
INFINEON TECHNOLOGIES AG
Harry Walter SAX
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE, DIE, AND DIE PACKAGE
Publication number
20220230919
Publication date
Jul 21, 2022
INFINEON TECHNOLOGIES AG
Fabian CRAES
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
Publication number
20210375792
Publication date
Dec 2, 2021
INFINEON TECHNOLOGIES AG
Harry Walter SAX
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Providing Coated Leadframes or for Measuring an Adhesion...
Publication number
20200381314
Publication date
Dec 3, 2020
INFINEON TECHNOLOGIES AG
Wu Hu Li
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Method of Forming a Layer Structure, Layer Structure, Method of For...
Publication number
20200227278
Publication date
Jul 16, 2020
Johann Gatterbauer
H01 - BASIC ELECTRIC ELEMENTS