Haruo Shimamoto

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,475,829
- Issue date Nov 5, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Kazushi Hatauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic molded semiconductor package and method of manufacturing th...
- Patent number 6,046,071
- Issue date Apr 4, 2000
- Mitsubishi Denki Kabushiki Kaisha
- Akiyoshi Sawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic molded semiconductor package and method of manufacturing th...
- Patent number 5,834,340
- Issue date Nov 10, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Akiyoshi Sawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic molded semiconductor package and method of manufacturing th...
- Patent number 5,710,062
- Issue date Jan 20, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Akiyoshi Sawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic molded semiconductor package
- Patent number 5,554,887
- Issue date Sep 10, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Akiyoshi Sawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit apparatus including clamped heat sink
- Patent number 5,548,482
- Issue date Aug 20, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Kazushi Hatauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,412,157
- Issue date May 2, 1995
- Mitsubishi Denki Kabushiki Kaisha
- Hideya Yagoura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser OLB apparatus and method of mounting semiconductor device
- Patent number 5,359,203
- Issue date Oct 25, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuya Hashii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having particular power distribution interconn...
- Patent number 5,309,021
- Issue date May 3, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Haruo Shimamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,220,196
- Issue date Jun 15, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 5,166,099
- Issue date Nov 24, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape automated bonding packaged semiconductor device incorporating...
- Patent number 5,157,478
- Issue date Oct 20, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier tape including molten resin flow path element for resin pac...
- Patent number 5,064,706
- Issue date Nov 12, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape carrier for tape automated bonding process and a method of pro...
- Patent number 4,865,193
- Issue date Sep 12, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Haruo Shimamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for semiconductor device
- Patent number 4,839,713
- Issue date Jun 13, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Yasuhiro Teraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Outer lead bonding device utilizing tape carriers
- Patent number 4,826,068
- Issue date May 2, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Hideya Yagoura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20020135074
- Publication date Sep 26, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Kazushi Hatauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and semiconductor device
- Publication number 20020100963
- Publication date Aug 1, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Yasuhito Suzuki
- H01 - BASIC ELECTRIC ELEMENTS

Haruo Shimamoto

Person

Patents Grantslast 30 patents

Semiconductor device and manufacturing method thereof

Plastic molded semiconductor package and method of manufacturing th...

Plastic molded semiconductor package and method of manufacturing th...

Plastic molded semiconductor package and method of manufacturing th...

Plastic molded semiconductor package

Semiconductor integrated circuit apparatus including clamped heat sink

Semiconductor device

Laser OLB apparatus and method of mounting semiconductor device

Semiconductor device having particular power distribution interconn...

Semiconductor device

Manufacturing method for semiconductor device

Tape automated bonding packaged semiconductor device incorporating...

Carrier tape including molten resin flow path element for resin pac...

Tape carrier for tape automated bonding process and a method of pro...

Package structure for semiconductor device

Outer lead bonding device utilizing tape carriers

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Semiconductor package and semiconductor device