Hassan S. Hashemi

Person

Mirandela, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Antenna on integrated circuit package
- Patent number 9,899,341
- Issue date Feb 20, 2018
- Atmel Corporation
- Hassan Hashemi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for fabricating a leadless chip carrier
- Patent number 7,247,516
- Issue date Jul 24, 2007
- Skyworks Solutions, Inc.
- Hassan S. Hashemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity down no lead package
- Patent number 6,995,458
- Issue date Feb 7, 2006
- Mindspeed Technologies, Inc.
- Hassan S. Hashemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabrication of a leadless chip carrier
- Patent number 6,960,824
- Issue date Nov 1, 2005
- Skyworks Solutions, Inc.
- Hassan S. Hashemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless chip carrier design and structure
- Patent number 6,921,972
- Issue date Jul 26, 2005
- Skyworks Solutions, Inc.
- Hassan S. Hashemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip module with integrated RF capabilities
- Patent number 6,885,561
- Issue date Apr 26, 2005
- Skyworks Solutions, Inc.
- Hassan Hashemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabrication of a leadless multi-die carrier
- Patent number 6,867,493
- Issue date Mar 15, 2005
- Skyworks Solutions, Inc.
- Hassan S. Hashemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Off-chip inductor
- Patent number 6,803,665
- Issue date Oct 12, 2004
- Skyworks Solutions, Inc.
- Mohamed A. Megahed
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadless chip carrier for reduced thermal resistance
- Patent number 6,787,895
- Issue date Sep 7, 2004
- Skyworks Solutions, Inc.
- Michael J. Jarcy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Molded shield structures and method for their fabrication
- Patent number 6,757,181
- Issue date Jun 29, 2004
- Skyworks Solutions, Inc.
- Roberto U. Villanueva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip leadframe package
- Patent number 6,750,546
- Issue date Jun 15, 2004
- Skyworks Solutions, Inc.
- Robbie U. Villanueva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless chip carrier with embedded inductor
- Patent number 6,710,433
- Issue date Mar 23, 2004
- Skyworks Solutions, Inc.
- Mohamed Megahed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled impedance transmission lines in a redistribution layer
- Patent number 6,674,174
- Issue date Jan 6, 2004
- Skyworks Solutions, Inc.
- Surasit Chungpaiboonpatana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage regulation for semiconductor dies and related structure
- Patent number 6,674,646
- Issue date Jan 6, 2004
- Skyworks Solutions, Inc.
- Khosrow Golshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless flip chip carrier design and structure
- Patent number 6,611,055
- Issue date Aug 26, 2003
- Skyworks Solutions, Inc.
- Hassan S. Hashemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabrication of a leadless chip carrier wit...
- Patent number 6,582,979
- Issue date Jun 24, 2003
- Skyworks Solutions, Inc.
- Roberto Coccioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled impedance leads in a leadframe for high frequency applic...
- Patent number 6,576,983
- Issue date Jun 10, 2003
- Skyworks Solutions, Inc.
- Siamak Fazelpour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin grid array package with controlled impedance pins
- Patent number 6,534,854
- Issue date Mar 18, 2003
- Conexant Systems, Inc.
- Siamak Fazelpour
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High inductance inductor in a semiconductor package
- Patent number 6,512,285
- Issue date Jan 28, 2003
- Skyworks Solutions, Inc.
- Hassan S. Hashemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip module with integrated RF capabilities
- Patent number 6,377,464
- Issue date Apr 23, 2002
- Conexant Systems, Inc.
- Hassan Hashemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bonding anchors in build-up layers
- Patent number 6,252,178
- Issue date Jun 26, 2001
- Conexant Systems, Inc.
- Hassan S. Hashemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless chip carrier design and structure
- Patent number 6,191,477
- Issue date Feb 20, 2001
- Conexant Systems, Inc.
- Hassan S. Hashemi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ANTENNA ON INTEGRATED CIRCUIT PACKAGE
- Publication number 20180019216
- Publication date Jan 18, 2018
- ATMEL CORPORATION
- Hassan Hashemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLED IMPEDANCE TRANSMISSION LINES IN A REDISTRIBUTION LAYER
- Publication number 20030193078
- Publication date Oct 16, 2003
- Conexant Systems, Inc.
- Surasit Chungpaiboonpatana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for fabrication of a leadless chip carrier wit...
- Publication number 20020172025
- Publication date Nov 21, 2002
- Mohamed Megahed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for fabrication of a leadless chip carrier wit...
- Publication number 20020167084
- Publication date Nov 14, 2002
- Conexant Systems, Inc.
- Roberto Coccioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for fabrication of a leadless multi-die carrier
- Publication number 20020149102
- Publication date Oct 17, 2002
- Conexant Systems, Inc.
- Hassan S. Hashemi
- H01 - BASIC ELECTRIC ELEMENTS

Hassan S. Hashemi

Person

Patents Grantslast 30 patents

Antenna on integrated circuit package

Method for fabricating a leadless chip carrier

Cavity down no lead package

Structure and method for fabrication of a leadless chip carrier

Leadless chip carrier design and structure

Multiple chip module with integrated RF capabilities

Structure and method for fabrication of a leadless multi-die carrier

Off-chip inductor

Leadless chip carrier for reduced thermal resistance

Molded shield structures and method for their fabrication

Flip-chip leadframe package

Leadless chip carrier with embedded inductor

Controlled impedance transmission lines in a redistribution layer

Voltage regulation for semiconductor dies and related structure

Leadless flip chip carrier design and structure

Structure and method for fabrication of a leadless chip carrier wit...

Controlled impedance leads in a leadframe for high frequency applic...

Pin grid array package with controlled impedance pins

High inductance inductor in a semiconductor package

Multiple chip module with integrated RF capabilities

Semiconductor device with bonding anchors in build-up layers

Leadless chip carrier design and structure

Patents Applicationslast 30 patents

ANTENNA ON INTEGRATED CIRCUIT PACKAGE

CONTROLLED IMPEDANCE TRANSMISSION LINES IN A REDISTRIBUTION LAYER

Structure and method for fabrication of a leadless chip carrier wit...

Structure and method for fabrication of a leadless chip carrier wit...

Structure and method for fabrication of a leadless multi-die carrier