HAU-YI HSIAO

Person

CHIAYI CITY, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Protective wafer grooving structure for wafer thinning and methods...
- Patent number 12,087,756
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Damage prevention during wafer edge trimming
- Patent number 11,951,569
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protective wafer grooving structure for wafer thinning and methods...
- Patent number 11,552,066
- Issue date Jan 10, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for wafer stack processing
- Patent number 11,545,395
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Lung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for wafer stack processing
- Patent number 11,127,635
- Issue date Sep 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Lung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and manufacturing met...
- Patent number 11,087,971
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yung-Lung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and manufacturing met...
- Patent number 10,504,716
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yung-Lung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUPPORTING SEALANT LAYER STRUCTURE FOR STACKED DIE APPLICATION
- Publication number 20240339422
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che Wei YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PATTERN IN-PAD SURFACE FOR POLISH RATE CONTROL
- Publication number 20240316724
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hau-Yi HSIAO
- B24 - GRINDING POLISHING
Information Patent Application
DAMAGE PREVENTION DURING WAFER EDGE TRIMMING
- Publication number 20240198455
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ming Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE PARTICULATES FOR USE AS PART OF A SUPPORTING FILL MIXTURE...
- Publication number 20240162051
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ming WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20230411227
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Nan. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT STRUCTURE TO REINFORCE STACKED SEMICONDUCTOR WAFERS
- Publication number 20230352438
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER SEAL RING
- Publication number 20230187294
- Publication date Jun 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS...
- Publication number 20230129760
- Publication date Apr 27, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Ming WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR WAFER STACK PROCESSING
- Publication number 20230101989
- Publication date Mar 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Lung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS TOOL FOR ANALYZING BONDED WORKPIECE INTERFACE
- Publication number 20230069432
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hau-Yi Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAMAGE PREVENTION DURING WAFER EDGE TRIMMING
- Publication number 20220362887
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ming Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH REFLECTANCE ISOLATION STRUCTURE TO INCREASE IMAGE SENSOR PERFO...
- Publication number 20220310678
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Chan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS...
- Publication number 20220271023
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Ming WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR WAFER STACK PROCESSING
- Publication number 20210384078
- Publication date Dec 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Lung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MANUFACTURING MET...
- Publication number 20210358740
- Publication date Nov 18, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- YUNG-LUNG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MANUFACTURING MET...
- Publication number 20200083036
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- YUNG-LUNG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MANUFACTURING MET...
- Publication number 20190287788
- Publication date Sep 19, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- YUNG-LUNG LIN
- H01 - BASIC ELECTRIC ELEMENTS

HAU-YI HSIAO

Person

Patents Grantslast 30 patents

Protective wafer grooving structure for wafer thinning and methods...

Damage prevention during wafer edge trimming

Protective wafer grooving structure for wafer thinning and methods...

Techniques for wafer stack processing

Techniques for wafer stack processing

Method for manufacturing semiconductor device and manufacturing met...

Method for manufacturing semiconductor device and manufacturing met...

Patents Applicationslast 30 patents

SUPPORTING SEALANT LAYER STRUCTURE FOR STACKED DIE APPLICATION

MULTI-PATTERN IN-PAD SURFACE FOR POLISH RATE CONTROL

DAMAGE PREVENTION DURING WAFER EDGE TRIMMING

COMPOSITE PARTICULATES FOR USE AS PART OF A SUPPORTING FILL MIXTURE...

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

SUPPORT STRUCTURE TO REINFORCE STACKED SEMICONDUCTOR WAFERS

SEMICONDUCTOR WAFER SEAL RING

PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS...

TECHNIQUES FOR WAFER STACK PROCESSING

PROCESS TOOL FOR ANALYZING BONDED WORKPIECE INTERFACE

DAMAGE PREVENTION DURING WAFER EDGE TRIMMING

HIGH REFLECTANCE ISOLATION STRUCTURE TO INCREASE IMAGE SENSOR PERFO...

PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS...

TECHNIQUES FOR WAFER STACK PROCESSING

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MANUFACTURING MET...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MANUFACTURING MET...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MANUFACTURING MET...