Hayato Takasago

Person

Amagasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Rigid circuit board for liquid crystal display including cut out fo...
- Patent number 6,104,464
- Issue date Aug 15, 2000
- Mitsubishi Denki Kabushiki Kaisha
- Kohei Adachi
- G02 - OPTICS
Information Patent Grant
Serial sampling video signal driving apparatus with improved color...
- Patent number 5,604,513
- Issue date Feb 18, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Seiki Takahashi
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Liquid crystal display device having heat-insulating members and dr...
- Patent number 5,293,262
- Issue date Mar 8, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Kohei Adachi
- G02 - OPTICS
Information Patent Grant
Method for separating bonded substrates, in particular disassemblin...
- Patent number 5,269,868
- Issue date Dec 14, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Eishi Gofuku
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Integrated circuit device having a metal substrate
- Patent number 5,173,844
- Issue date Dec 22, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Kohei Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Matrix-type color liquid crystal display device
- Patent number 5,113,274
- Issue date May 12, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Seiki Takahashi
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Circuit board with high heat dissipations characteristic
- Patent number 5,081,562
- Issue date Jan 14, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Kohei Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for preparing a combined wiring substrate
- Patent number 5,069,745
- Issue date Dec 3, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Hirofumi Ohuchida
- G02 - OPTICS
Information Patent Grant
Multilayer interconnection circuit board
- Patent number 5,034,569
- Issue date Jul 23, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Eishi Gofuku
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid crystal display device
- Patent number 5,029,984
- Issue date Jul 9, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Kohei Adachi
- G02 - OPTICS
Information Patent Grant
Method of manufacturing a circuit board
- Patent number 4,993,148
- Issue date Feb 19, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Kohei Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape carrier for assembling an IC chip on a substrate
- Patent number 4,967,261
- Issue date Oct 30, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Kenichi Niki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing hybrid integrated circuit substrate
- Patent number 4,963,389
- Issue date Oct 16, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuyuki Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating hybrid integrated circuit
- Patent number 4,946,709
- Issue date Aug 7, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuyuki Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing device for electrical circuit boards
- Patent number 4,943,768
- Issue date Jul 24, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Kenichi Niki
- G01 - MEASURING TESTING
Information Patent Grant
Method of packaging semiconductor device
- Patent number 4,942,140
- Issue date Jul 17, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Hideaki Ootsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing hybrid integrated circuits
- Patent number 4,914,815
- Issue date Apr 10, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuyuki Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating hybrid integrated circuit
- Patent number 4,898,805
- Issue date Feb 6, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuyuki Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing device for electrical circuit boards
- Patent number 4,887,030
- Issue date Dec 12, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Kenichi Niki
- G01 - MEASURING TESTING
Information Patent Grant
Screen printing apparatus
- Patent number 4,854,230
- Issue date Aug 8, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Kenichi Niki
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method for controlling electric resistance of a compound-type resis...
- Patent number 4,785,157
- Issue date Nov 15, 1988
- Mitsubishi Denki Kabushiki Kaisha
- Eishi Gofuku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit substrate and method of manufacturing the...
- Patent number 4,783,642
- Issue date Nov 8, 1988
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuyuki Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit substrate and method of manufacturing the...
- Patent number 4,685,203
- Issue date Aug 11, 1987
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuyuki Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite having conductive layer on resin layer and method of manu...
- Patent number 4,645,734
- Issue date Feb 24, 1987
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuyuki Takada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composite and circuit board having conductive layer on resin layer...
- Patent number 4,643,798
- Issue date Feb 17, 1987
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuyuki Takada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing multilayer circuit board
- Patent number 4,629,681
- Issue date Dec 16, 1986
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuyuki Takada
- H01 - BASIC ELECTRIC ELEMENTS

Hayato Takasago

Person

Patents Grantslast 30 patents

Rigid circuit board for liquid crystal display including cut out fo...

Serial sampling video signal driving apparatus with improved color...

Liquid crystal display device having heat-insulating members and dr...

Method for separating bonded substrates, in particular disassemblin...

Integrated circuit device having a metal substrate

Matrix-type color liquid crystal display device

Circuit board with high heat dissipations characteristic

Process for preparing a combined wiring substrate

Multilayer interconnection circuit board

Liquid crystal display device

Method of manufacturing a circuit board

Tape carrier for assembling an IC chip on a substrate

Method for producing hybrid integrated circuit substrate

Method for fabricating hybrid integrated circuit

Testing device for electrical circuit boards

Method of packaging semiconductor device

Method for manufacturing hybrid integrated circuits

Method for fabricating hybrid integrated circuit

Testing device for electrical circuit boards

Screen printing apparatus

Method for controlling electric resistance of a compound-type resis...

Hybrid integrated circuit substrate and method of manufacturing the...

Hybrid integrated circuit substrate and method of manufacturing the...

Composite having conductive layer on resin layer and method of manu...

Composite and circuit board having conductive layer on resin layer...

Method of manufacturing multilayer circuit board