He REN

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fluorine-free tungsten ALD for dielectric selectivity improvement
- Patent number 12,062,545
- Issue date Aug 13, 2024
- Applied Materials, Inc.
- Ilanit Fisher
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of dielectric material fill and treatment
- Patent number 12,046,508
- Issue date Jul 23, 2024
- Applied Materials, Inc.
- Shi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for forming backside power rails
- Patent number 12,002,705
- Issue date Jun 4, 2024
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully aligned subtractive processes and electronic devices therefrom
- Patent number 11,967,527
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming nickel silicide materials
- Patent number 11,965,236
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Minrui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reverse selective etch stop layer
- Patent number 11,955,382
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Kevin Kashefi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive metals and subtractive metal semiconductor structures
- Patent number 11,923,244
- Issue date Mar 5, 2024
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for subtractive self-alignment
- Patent number 11,908,696
- Issue date Feb 20, 2024
- Applied Materials, Inc.
- He Ren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of cleaning a structure and method of depositing a capping l...
- Patent number 11,830,725
- Issue date Nov 28, 2023
- Applied Materials, Inc.
- Naomi Yoshida
- B08 - CLEANING
Information Patent Grant
Multi-step pre-clean for selective metal gap fill
- Patent number 11,776,806
- Issue date Oct 3, 2023
- Applied Materials, Inc.
- Xi Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for processing a substrate
- Patent number 11,749,532
- Issue date Sep 5, 2023
- Applied Materials, Inc.
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for controllable metal and barrier-liner recess
- Patent number 11,705,366
- Issue date Jul 18, 2023
- Micromaterials LLC
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dielectric material fill and treatment
- Patent number 11,615,984
- Issue date Mar 28, 2023
- Applied Materials, Inc.
- Shi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective tungsten deposition within trench structures
- Patent number 11,515,200
- Issue date Nov 29, 2022
- Applied Materials, Inc.
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming interconnect for semiconductor device
- Patent number 11,508,617
- Issue date Nov 22, 2022
- Applied Materials, Inc.
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully self-aligned via
- Patent number 11,437,274
- Issue date Sep 6, 2022
- Micromaterials LLC
- Regina Freed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully aligned subtractive processes and electronic devices therefrom
- Patent number 11,410,885
- Issue date Aug 9, 2022
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step pre-clean for selective metal gap fill
- Patent number 11,380,536
- Issue date Jul 5, 2022
- Applied Materials, Inc.
- Xi Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a metal gapfill
- Patent number 11,355,391
- Issue date Jun 7, 2022
- Applied Materials, Inc.
- Xi Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Damage free metal conductor formation
- Patent number 11,289,342
- Issue date Mar 29, 2022
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for subtractive self-alignment
- Patent number 11,257,677
- Issue date Feb 22, 2022
- Applied Materials, Inc.
- He Ren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatuses for forming interconnection structures
- Patent number 11,205,589
- Issue date Dec 21, 2021
- Applied Materials, Inc.
- He Ren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process integration approach for selective metal via fill
- Patent number 11,164,780
- Issue date Nov 2, 2021
- Applied Materials, Inc.
- Shi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of selective deposition process
- Patent number 11,094,588
- Issue date Aug 17, 2021
- Applied Materials, Inc.
- Shi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for controllable metal and barrier-liner recess
- Patent number 11,062,942
- Issue date Jul 13, 2021
- Micromaterials LLC
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective removal process to create high aspect ratio fully self-al...
- Patent number 11,037,825
- Issue date Jun 15, 2021
- Micromaterials LLC
- Amrita B. Mullick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for etching a structure for semiconductor applications
- Patent number 10,957,533
- Issue date Mar 23, 2021
- Applied Materials, Inc.
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming metal silicide layers and metal silicide layers...
- Patent number 10,916,433
- Issue date Feb 9, 2021
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective removal process to create high aspect ratio fully self-al...
- Patent number 10,790,191
- Issue date Sep 29, 2020
- Micromaterials LLC
- Amrita B. Mullick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process integration approach of selective tungsten via fill
- Patent number 10,727,119
- Issue date Jul 28, 2020
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT
- Publication number 20240379420
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Shi YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-TEMPERATURE SELECTIVE EPITAXY CONTACT APPROACH
- Publication number 20240363354
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- He REN
- C30 - CRYSTAL GROWTH
Information Patent Application
FABRICATION OF HIGH ASPECT RATIO ELECTRONIC DEVICES WITH MINIMAL SI...
- Publication number 20240321641
- Publication date Sep 26, 2024
- Applied Materials, Inc.
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE METALS AND SUBTRACTIVE METAL SEMICONDUCTOR STRUCTURES
- Publication number 20240213088
- Publication date Jun 27, 2024
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR FORMING BACKSIDE POWER RAILS
- Publication number 20230260825
- Publication date Aug 17, 2023
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT
- Publication number 20230187276
- Publication date Jun 15, 2023
- Applied Materials, Inc.
- Shi YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING INTERCONNECT FOR SEMICONDUCTOR DEVICE
- Publication number 20230045689
- Publication date Feb 9, 2023
- Applied Materials, Inc.
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY SELF-ALIGNED VIA
- Publication number 20220359289
- Publication date Nov 10, 2022
- Micromaterials LLC.
- Regina Freed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20220359224
- Publication date Nov 10, 2022
- Hao JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fully Aligned Subtractive Processes And Electronic Devices Therefrom
- Publication number 20220328352
- Publication date Oct 13, 2022
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE METALS AND SUBTRACTIVE METAL SEMICONDUCTOR STRUCTURES
- Publication number 20220285212
- Publication date Sep 8, 2022
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STEP PRE-CLEAN FOR SELECTIVE METAL GAP FILL
- Publication number 20220270871
- Publication date Aug 25, 2022
- Applied Materials, Inc.
- Xi Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSE SELECTIVE ETCH STOP LAYER
- Publication number 20220181204
- Publication date Jun 9, 2022
- Applied Materials, Inc.
- Kevin Kashefi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TUNGSTEN DEPOSITION WITHIN TRENCH STRUCTURES
- Publication number 20220181201
- Publication date Jun 9, 2022
- Applied Materials, Inc.
- Yi XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR SUBTRACTIVE SELF-ALIGNMENT
- Publication number 20220130676
- Publication date Apr 28, 2022
- Applied Materials, Inc.
- He Ren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FLUORINE-FREE TUNGSTEN ALD FOR DIELECTRIC SELECTIVITY IMPROVEMENT
- Publication number 20210384036
- Publication date Dec 9, 2021
- Applied Materials, Inc.
- Ilanit Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluorine-Free Tungsten ALD And Tungsten Selective CVD For Dielectrics
- Publication number 20210384035
- Publication date Dec 9, 2021
- Applied Materials, Inc.
- Ilanit Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Step Pre-Clean for Selective Metal Gap Fill
- Publication number 20210351032
- Publication date Nov 11, 2021
- Applied Materials, Inc.
- Xi Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT
- Publication number 20210317580
- Publication date Oct 14, 2021
- Applied Materials, Inc.
- Shi YOU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods For Controllable Metal And Barrier-Liner Recess
- Publication number 20210305091
- Publication date Sep 30, 2021
- Micromaterials LLC.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CLEANING A STRUCTURE AND METHOD OF DEPOSITING A CAPPING L...
- Publication number 20210233765
- Publication date Jul 29, 2021
- Applied Materials, Inc.
- Naomi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR SUBTRACTIVE SELF-ALIGNMENT
- Publication number 20210233770
- Publication date Jul 29, 2021
- Applied Materials, Inc.
- He Ren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING INTERCONNECT FOR SEMICONDUCTOR DEVICE
- Publication number 20210125864
- Publication date Apr 29, 2021
- Applied Materials, Inc.
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES FOR FORMING INTERCONNECTION STRUCTURES
- Publication number 20210104434
- Publication date Apr 8, 2021
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fully Self-Aligned Via
- Publication number 20210090952
- Publication date Mar 25, 2021
- Micromaterials LLC.
- Regina Freed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE OF SELECTIVE DEPOSITION PROCESS
- Publication number 20210074583
- Publication date Mar 11, 2021
- Applied Materials, Inc.
- Shi YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR CLEANING METAL CONTACTS
- Publication number 20210066064
- Publication date Mar 4, 2021
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Removal Process To Create High Aspect Ratio Fully Self-Al...
- Publication number 20200388535
- Publication date Dec 10, 2020
- Micromaterials LLC.
- Amrita B. Mullick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS INTEGRATION APPROACH FOR SELECTIVE METAL VIA FILL
- Publication number 20200388533
- Publication date Dec 10, 2020
- Applied Materials, Inc.
- SHI YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fully Aligned Subtractive Processes And Electronic Devices Therefrom
- Publication number 20200350206
- Publication date Nov 5, 2020
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Fluorine-free tungsten ALD for dielectric selectivity improvement

Method of dielectric material fill and treatment

Methods and apparatus for forming backside power rails

Fully aligned subtractive processes and electronic devices therefrom

Method of forming nickel silicide materials

Reverse selective etch stop layer

Subtractive metals and subtractive metal semiconductor structures

Methods and devices for subtractive self-alignment

Method of cleaning a structure and method of depositing a capping l...

Multi-step pre-clean for selective metal gap fill

Methods and apparatus for processing a substrate

Methods for controllable metal and barrier-liner recess

Method of dielectric material fill and treatment

Selective tungsten deposition within trench structures

Method of forming interconnect for semiconductor device

Fully self-aligned via

Fully aligned subtractive processes and electronic devices therefrom

Multi-step pre-clean for selective metal gap fill

Method for forming a metal gapfill

Damage free metal conductor formation

Methods and devices for subtractive self-alignment

Methods and apparatuses for forming interconnection structures

Process integration approach for selective metal via fill

Interconnection structure of selective deposition process

Methods for controllable metal and barrier-liner recess

Selective removal process to create high aspect ratio fully self-al...

Methods for etching a structure for semiconductor applications

Methods of forming metal silicide layers and metal silicide layers...

Selective removal process to create high aspect ratio fully self-al...

Process integration approach of selective tungsten via fill

Patents Applicationslast 30 patents

METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT

LOW-TEMPERATURE SELECTIVE EPITAXY CONTACT APPROACH

FABRICATION OF HIGH ASPECT RATIO ELECTRONIC DEVICES WITH MINIMAL SI...

SUBTRACTIVE METALS AND SUBTRACTIVE METAL SEMICONDUCTOR STRUCTURES

METHODS AND APPARATUS FOR FORMING BACKSIDE POWER RAILS

METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT

METHOD OF FORMING INTERCONNECT FOR SEMICONDUCTOR DEVICE

FULLY SELF-ALIGNED VIA

METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

Fully Aligned Subtractive Processes And Electronic Devices Therefrom

SUBTRACTIVE METALS AND SUBTRACTIVE METAL SEMICONDUCTOR STRUCTURES

MULTI-STEP PRE-CLEAN FOR SELECTIVE METAL GAP FILL

REVERSE SELECTIVE ETCH STOP LAYER

SELECTIVE TUNGSTEN DEPOSITION WITHIN TRENCH STRUCTURES

METHODS AND DEVICES FOR SUBTRACTIVE SELF-ALIGNMENT

FLUORINE-FREE TUNGSTEN ALD FOR DIELECTRIC SELECTIVITY IMPROVEMENT

Fluorine-Free Tungsten ALD And Tungsten Selective CVD For Dielectrics

Multi-Step Pre-Clean for Selective Metal Gap Fill

METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT

Methods For Controllable Metal And Barrier-Liner Recess

METHOD OF CLEANING A STRUCTURE AND METHOD OF DEPOSITING A CAPPING L...

METHODS AND DEVICES FOR SUBTRACTIVE SELF-ALIGNMENT

METHOD OF FORMING INTERCONNECT FOR SEMICONDUCTOR DEVICE

METHODS AND APPARATUSES FOR FORMING INTERCONNECTION STRUCTURES

Fully Self-Aligned Via

INTERCONNECTION STRUCTURE OF SELECTIVE DEPOSITION PROCESS

METHODS AND APPARATUS FOR CLEANING METAL CONTACTS

Selective Removal Process To Create High Aspect Ratio Fully Self-Al...

PROCESS INTEGRATION APPROACH FOR SELECTIVE METAL VIA FILL

Fully Aligned Subtractive Processes And Electronic Devices Therefrom