Hei Ming Shiu

Person

Tsuen Wan, HK

People

Patents Grantslast 30 patents

Information Patent Grant
Leadless chip carrier having improved mountability
- Patent number 9,418,919
- Issue date Aug 16, 2016
- NXP B.V.
- Roelf Anco Jacob Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming reinforced interconnects on a substrate
- Patent number 7,494,924
- Issue date Feb 24, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Hei Ming Shiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming multi-layer bumps on a substrate
- Patent number 7,422,973
- Issue date Sep 9, 2008
- Freescale Semiconductor, Inc.
- Hei Ming Shiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming multi-layer bumps on a substrate
- Patent number 7,279,409
- Issue date Oct 9, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Hei Ming Shiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional package
- Patent number 7,262,494
- Issue date Aug 28, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Hei Ming Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land grid array packaged device and method of forming same
- Patent number 7,205,178
- Issue date Apr 17, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Hei Ming Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flipchip QFN package
- Patent number 7,112,871
- Issue date Sep 26, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Hei Ming Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming land grid array packaged device
- Patent number 7,056,766
- Issue date Jun 6, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Hei Ming Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging an optical sensor
- Patent number 6,905,910
- Issue date Jun 14, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Hei Ming Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flipchip QFN package and method therefor
- Patent number 6,867,072
- Issue date Mar 15, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Hei Ming Shiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEADLESS CHIP CARRIER HAVING IMPROVED MOUNTABILITY
- Publication number 20160211197
- Publication date Jul 21, 2016
- NXP B.V.
- Roelf Anco Jacob GROENHUIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS CHIP CARRIER HAVING IMPROVED MOUNTABILITY
- Publication number 20120181678
- Publication date Jul 19, 2012
- NXP B.V.
- Roelf Anco Jacob GROENHUIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming reinforced interconnects on a substrate
- Publication number 20070207605
- Publication date Sep 6, 2007
- Hei Ming Shiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fabricating a PCB
- Publication number 20070178228
- Publication date Aug 2, 2007
- Hei Ming Shiu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for forming multi-layer bumps on a substrate
- Publication number 20070178688
- Publication date Aug 2, 2007
- Hei Ming Shiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming multi-layer bumps on a substrate
- Publication number 20070099413
- Publication date May 3, 2007
- Hei Ming Shiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead frame panel and method of packaging semiconductor devices usin...
- Publication number 20060208344
- Publication date Sep 21, 2006
- Hei Ming Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional package and method of forming same
- Publication number 20060208363
- Publication date Sep 21, 2006
- Hei Ming Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Land grid array packaged device and method of forming same
- Publication number 20050214980
- Publication date Sep 29, 2005
- Hei Ming Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of packaging an optical sensor
- Publication number 20050156301
- Publication date Jul 21, 2005
- Hei Ming Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flipchip QFN package and method therefor
- Publication number 20050156291
- Publication date Jul 21, 2005
- Hei Ming Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING AN OPTICAL SENSOR
- Publication number 20050146001
- Publication date Jul 7, 2005
- Hei Ming Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Land grid array packaged device and method of forming same
- Publication number 20050124147
- Publication date Jun 9, 2005
- Hei Ming Shiu
- H01 - BASIC ELECTRIC ELEMENTS

Hei Ming Shiu

Person

Patents Grantslast 30 patents

Leadless chip carrier having improved mountability

Method for forming reinforced interconnects on a substrate

Method for forming multi-layer bumps on a substrate

Method for forming multi-layer bumps on a substrate

Three-dimensional package

Land grid array packaged device and method of forming same

Flipchip QFN package

Method of forming land grid array packaged device

Method of packaging an optical sensor

Flipchip QFN package and method therefor

Patents Applicationslast 30 patents

LEADLESS CHIP CARRIER HAVING IMPROVED MOUNTABILITY

LEADLESS CHIP CARRIER HAVING IMPROVED MOUNTABILITY

Method for forming reinforced interconnects on a substrate

Method for fabricating a PCB

Method for forming multi-layer bumps on a substrate

Method for forming multi-layer bumps on a substrate

Lead frame panel and method of packaging semiconductor devices usin...

Three-dimensional package and method of forming same

Land grid array packaged device and method of forming same

Method of packaging an optical sensor

Flipchip QFN package and method therefor

METHOD OF PACKAGING AN OPTICAL SENSOR

Land grid array packaged device and method of forming same