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last 30 patents
Information
Patent Grant
Semiconductor package and packaging process for side-wall plating w...
Patent number
11,876,003
Issue date
Jan 16, 2024
VISHAY GENERAL SEMICONDUCTOR, LLC
Longnan Jin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package assembly for plating with selective molding
Patent number
11,764,075
Issue date
Sep 19, 2023
VISHAY GENERAL SEMICONDUCTOR, LLC
Huiying Ding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging process for side-wall plating with a conductive film
Patent number
11,450,534
Issue date
Sep 20, 2022
VISHAY GENERAL SEMICONDUCTOR, LLC
Longnan Jin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging process for plating with selective molding
Patent number
11,393,699
Issue date
Jul 19, 2022
VISHAY GENERAL SEMICONDUCTOR, LLC
Huiying Ding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Surface-mountable electronic device
Patent number
9,018,537
Issue date
Apr 28, 2015
Vishay Semiconductor GmbH
Heinrich Karrer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE AND PACKAGING PROCESS FOR SIDE-WALL PLATING W...
Publication number
20230019610
Publication date
Jan 19, 2023
VISHAY GENERAL SEMICONDUCTOR, LLC
Longnan JIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ASSEMBLY FOR PLATING WITH SELECTIVE MOLDING
Publication number
20220319869
Publication date
Oct 6, 2022
VISHAY GENERAL SEMICONDUCTOR, LLC
Huiying DING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING PROCESS FOR PLATING WITH SELECTIVE MOLDING
Publication number
20210375641
Publication date
Dec 2, 2021
VISHAY GENERAL SEMICONDUCTOR, LLC
Huiying DING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING PROCESS FOR SIDE-WALL PLATING WITH A CONDUCTIVE FILM
Publication number
20210366729
Publication date
Nov 25, 2021
VISHAY GENERAL SEMICONDUCTOR, LLC
Longnan JIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SURFACE-MOUNTABLE ELECTRONIC DEVICE
Publication number
20090266593
Publication date
Oct 29, 2009
Vishay Semiconductor GmbH
Heinrich Karrer
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...