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Hem P. Takiar
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Fremont, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Systems and methods for reducing the size of a semiconductor assembly
Patent number
11,942,460
Issue date
Mar 26, 2024
Micron Technology, Inc.
Hong Wan Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit wire bonded to a multi-layer substrate having an...
Patent number
11,929,351
Issue date
Mar 12, 2024
Micron Technology, Inc.
Kelvin Tan Aik Boo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Overlapping die stacks for nand package architecture
Patent number
11,908,833
Issue date
Feb 20, 2024
Micron Technology, Inc.
Enyong Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrates for semiconductor packages, including hybrid substrates...
Patent number
11,894,289
Issue date
Feb 6, 2024
Micron Technology, Inc.
Hong Wan Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Surface mount device bonded to an inner layer of a multi-layer subs...
Patent number
11,723,150
Issue date
Aug 8, 2023
Micron Technology, Inc.
Kelvin Tan Aik Boo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices with multiple substrates and die stacks
Patent number
11,562,987
Issue date
Jan 24, 2023
Micron Technology, Inc.
Chin Hui Chong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrates for semiconductor packages, including hybrid substrates...
Patent number
11,527,459
Issue date
Dec 13, 2022
Micron Technology, Inc.
Hong Wan Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Overlapping die stacks for NAND package architecture
Patent number
11,309,281
Issue date
Apr 19, 2022
Micron Technology, Inc.
Enyong Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit wire bonded to a multi-layer substrate having an...
Patent number
11,282,811
Issue date
Mar 22, 2022
Micron Technology, Inc.
Kelvin Tan Aik Boo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of fabricating semiconductor package
Patent number
11,031,371
Issue date
Jun 8, 2021
SanDisk Information Technology (Shanghai) Co., Ltd.
Chin Tien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing process for separating logic and memory array
Patent number
10,930,607
Issue date
Feb 23, 2021
Western Digital Technologies, Inc.
Hem Takiar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die singulation using a sacrificial bonding material...
Patent number
10,854,573
Issue date
Dec 1, 2020
SanDisk Technologies LLC
Zhongli Ji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Datacenter 3D solid state drives with matrix cooling
Patent number
10,818,575
Issue date
Oct 27, 2020
SanDisk Information Technology (Shanghai) Co., Ltd.
Chin-Tien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
10,811,386
Issue date
Oct 20, 2020
SanDisk Information Technology (Shanghai) Co., Ltd.
Chin Tien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including optically connected wafer stack
Patent number
10,734,354
Issue date
Aug 4, 2020
SanDisk Information Technology (Shanghai) Co., Ltd.
Chin-Tien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heterogeneous fan-out structures for memory devices
Patent number
10,607,955
Issue date
Mar 31, 2020
SanDisk Semiconductor (Shanghai) Co. Ltd.
Chin-Tien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing process for separating logic and memory array
Patent number
10,522,489
Issue date
Dec 31, 2019
Western Digital Technologies, Inc.
Hem Takiar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Angled die semiconductor device
Patent number
10,490,529
Issue date
Nov 26, 2019
SanDisk Information Technology (Shanghai) Co., Ltd.
Chin-Tien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated USB connector and memory device
Patent number
10,485,125
Issue date
Nov 19, 2019
Western Digital Technologies, Inc.
Hem Takiar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Non-volatile memory system with wide I/O memory die
Patent number
10,381,327
Issue date
Aug 13, 2019
SanDisk Technologies LLC
Venkatesh P. Ramachandra
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Vertical semiconductor device having a stacked die block
Patent number
10,325,881
Issue date
Jun 18, 2019
SanDisk Information Technology (Shanghai) Co., Ltd.
Suresh Upadhyayula
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bonded wide I/O semiconductor device
Patent number
10,249,592
Issue date
Apr 2, 2019
SanDisk Technologies LLC
Michael Mostovoy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including interconnected package on package
Patent number
10,242,965
Issue date
Mar 26, 2019
SanDisk Information Technology (Shanghai) Co., Ltd.
Chin-Tien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed circuit board with coextensive electrical connectors and co...
Patent number
10,051,733
Issue date
Aug 14, 2018
SanDisk Technologies Inc.
Chih-Chin Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bonded wide I/O semiconductor device
Patent number
9,899,347
Issue date
Feb 20, 2018
SanDisk Technologies LLC
Michael Mostovoy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire tail connector for a semiconductor device
Patent number
9,362,244
Issue date
Jun 7, 2016
SanDisk Information Technology (Shanghai) Co., Ltd.
Chin Tien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
EMI shielding and thermal dissipation for semiconductor device
Patent number
9,337,153
Issue date
May 10, 2016
SanDisk Information Technology (Shanghai) Co., Ltd.
Peng Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Rigid wave pattern design on chip carrier substrate and printed cir...
Patent number
9,230,919
Issue date
Jan 5, 2016
SanDisk Technologies Inc.
Chin-Tien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low profile wire bonded USB device
Patent number
9,218,953
Issue date
Dec 22, 2015
SanDisk Technologies Inc.
Suresh Upadhyayula
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Hidden plating traces
Patent number
9,209,159
Issue date
Dec 8, 2015
SanDisk Technologies Inc.
Hem Takiar
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SYSTEMS AND METHODS FOR REDUCING THE SIZE OF A SEMICONDUCTOR ASSEMBLY
Publication number
20240203963
Publication date
Jun 20, 2024
Micron Technology, Inc.
Hong Wan Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OVERLAPPING DIE STACKS FOR NAND PACKAGE ARCHITECTURE
Publication number
20240153912
Publication date
May 9, 2024
Micron Technology, Inc.
Enyong Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES...
Publication number
20240128163
Publication date
Apr 18, 2024
Micron Technology, Inc.
Hong Wan Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH SCREEN-PRINTED EPOXY SPACERS A...
Publication number
20240014083
Publication date
Jan 11, 2024
Micron Technology, Inc.
Hem P. Takiar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SURFACE MOUNT DEVICE BONDED TO AN INNER LAYER OF A MULTI-LAYER SUBS...
Publication number
20230345639
Publication date
Oct 26, 2023
Micron Technology, Inc.
Kelvin Tan Aik Boo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES...
Publication number
20230056648
Publication date
Feb 23, 2023
Micron Technology, Inc.
Hong Wan Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES...
Publication number
20220352052
Publication date
Nov 3, 2022
Micron Technology, Inc.
Hong Wan Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES WITH MULTIPLE SUBSTRATES AND DIE STACKS
Publication number
20220336417
Publication date
Oct 20, 2022
Micron Technology, Inc.
Chin Hui Chong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OVERLAPPING DIE STACKS FOR NAND PACKAGE ARCHITECTURE
Publication number
20220271007
Publication date
Aug 25, 2022
Micron Technology, Inc.
Enyong Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR REDUCING THE SIZE OF A SEMICONDUCTOR ASSEMBLY
Publication number
20220208744
Publication date
Jun 30, 2022
Micron Technology, Inc.
Hong Wan Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT WIRE BONDED TO A MULTI-LAYER SUBSTRATE HAVING AN...
Publication number
20220181307
Publication date
Jun 9, 2022
Micron Technology, Inc.
Kelvin Tam Aik Boo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SURFACE MOUNT DEVICE BONDED TO AN INNER LAYER OF A MULTI-LAYER SUBS...
Publication number
20220078915
Publication date
Mar 10, 2022
Micron Technology, Inc.
Kelvin Tan Aik Boo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OVERLAPPING DIE STACKS FOR NAND PACKAGE ARCHITECTURE
Publication number
20220068877
Publication date
Mar 3, 2022
Micron Technology, Inc.
Enyong Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT WIRE BONDED TO A MULTI-LAYER SUBSTRATE HAVING AN...
Publication number
20210358888
Publication date
Nov 18, 2021
Micron Technology, Inc.
Kelvin Tan Aik Boo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE SINGULATION USING A SACRIFICIAL BONDING MATERIAL...
Publication number
20200219842
Publication date
Jul 9, 2020
SANDISK TECHNOLOGIES LLC
Zhongli Ji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING PROCESS FOR SEPARATING LOGIC AND MEMORY ARRAY
Publication number
20200126936
Publication date
Apr 23, 2020
Western Digital Technologies, Inc.
Hem Takiar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING PROCESS FOR SEPARATING LOGIC AND MEMORY ARRAY
Publication number
20200006268
Publication date
Jan 2, 2020
Western Digital Technologies, Inc.
Hem Takiar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING OPTICALLY CONNECTED WAFER STACK
Publication number
20190198479
Publication date
Jun 27, 2019
SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Chin-Tien Chiu
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
INTEGRATED USB CONNECTOR AND MEMORY DEVICE
Publication number
20190200471
Publication date
Jun 27, 2019
Western Digital Technologies, Inc.
Hem Takiar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DATACENTER 3D SOLID STATE DRIVES WITH MATRIX COOLING
Publication number
20190189536
Publication date
Jun 20, 2019
SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Chin-Tien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HETEROGENEOUS FAN-OUT STRUCTURES FOR MEMORY DEVICES
Publication number
20180366429
Publication date
Dec 20, 2018
SunDisk Semiconductro (Shanghai) Co. Ltd.
Chin-Tien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANGLED DIE SEMICONDUCTOR DEVICE
Publication number
20180342483
Publication date
Nov 29, 2018
SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Chin-Tien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE BONDED WIDE I/O SEMICONDUCTOR DEVICE
Publication number
20180174996
Publication date
Jun 21, 2018
SanDisk Technologies LLC
Michael Mostovoy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20180114777
Publication date
Apr 26, 2018
SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Chin Tien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
Publication number
20180114773
Publication date
Apr 26, 2018
SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Chin Tien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NON-VOLATILE MEMORY SYSTEM WITH WIDE I/O MEMORY DIE
Publication number
20180102344
Publication date
Apr 12, 2018
SanDisk Technologies LLC
Venkatesh P. Ramachandra
G11 - INFORMATION STORAGE
Information
Patent Application
VERTICAL SEMICONDUCTOR DEVICE
Publication number
20180047706
Publication date
Feb 15, 2018
SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Suresh Upadhyayula
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING INTERCONNECTED PACKAGE ON PACKAGE
Publication number
20180005974
Publication date
Jan 4, 2018
SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Chin-Tien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD WITH COEXTENSIVE ELECTRICAL CONNECTORS AND CO...
Publication number
20150223335
Publication date
Aug 6, 2015
SANDISK TECHNOLOGIES INC.
Chih-Chin Liao
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
EPOXY COATING ON SUBSTRATE FOR DIE ATTACH
Publication number
20150214184
Publication date
Jul 30, 2015
SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Wei Gu
H01 - BASIC ELECTRIC ELEMENTS