Henning Braunisch

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Components for millimeter-wave communication
- Patent number 12,255,158
- Issue date Mar 18, 2025
- Intel Corporation
- Neelam Prabhu Gaunkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low leakage thin film capacitors using titanium oxide dielectric wi...
- Patent number 12,255,225
- Issue date Mar 18, 2025
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating voltage regulators and passive circuit elements with to...
- Patent number 12,242,290
- Issue date Mar 4, 2025
- Intel Corporation
- Beomseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density interconnects for integrated circuit packages
- Patent number 12,205,902
- Issue date Jan 21, 2025
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable embedded silicon bridge via pillars in lithographically de...
- Patent number 12,199,067
- Issue date Jan 14, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,176,323
- Issue date Dec 24, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-throughput additively manufactured power delivery vias and traces
- Patent number 12,170,244
- Issue date Dec 17, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Components for millimeter-wave communication
- Patent number 12,166,261
- Issue date Dec 10, 2024
- Intel Corporation
- Diego Correas-Serrano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platforms including microelectronic packages therein coupled to a c...
- Patent number 12,150,271
- Issue date Nov 19, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter-wave dielectric waveguide bundle including first and sec...
- Patent number 12,126,068
- Issue date Oct 22, 2024
- Intel Corporation
- Diego Correas-Serrano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter-wave dielectric waveguide including an opening of varyin...
- Patent number 12,126,067
- Issue date Oct 22, 2024
- Intel Corporation
- Diego Correas-Serrano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 12,113,026
- Issue date Oct 8, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic support for millimeter-wave communication including...
- Patent number 12,107,314
- Issue date Oct 1, 2024
- Intel Corporation
- Neelam Prabhu Gaunkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dispersive waveguide crosstalk mitigation
- Patent number 12,088,360
- Issue date Sep 10, 2024
- Intel Corporation
- Henning Braunisch
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Power delivery structures
- Patent number 12,087,682
- Issue date Sep 10, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Components for millimeter-wave communication
- Patent number 12,021,289
- Issue date Jun 25, 2024
- Intel Corporation
- Diego Correas-Serrano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Components for millimeter-wave communication
- Patent number 11,955,684
- Issue date Apr 9, 2024
- Intel Corporation
- Diego Correas-Serrano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dispersion compensation for electromagnetic waveguides
- Patent number 11,916,604
- Issue date Feb 27, 2024
- Intel Corporation
- Diego Correas-Serrano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor packaging with high density interconnects
- Patent number 11,881,457
- Issue date Jan 23, 2024
- Tahoe Research, LTD.
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 11,876,053
- Issue date Jan 16, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 11,824,008
- Issue date Nov 21, 2023
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate integrated thin film capacitors using amorphous high-k di...
- Patent number 11,804,455
- Issue date Oct 31, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low loss and low cross talk transmission lines with stacked dielect...
- Patent number 11,791,528
- Issue date Oct 17, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including a dielectric waveguide with a cavity t...
- Patent number 11,764,452
- Issue date Sep 19, 2023
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In situ package integrated thin film capacitors for power delivery
- Patent number 11,756,948
- Issue date Sep 12, 2023
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide fan-out
- Patent number 11,728,290
- Issue date Aug 15, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 11,721,649
- Issue date Aug 8, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platforms including microelectronic packages therein coupled to a c...
- Patent number 11,716,826
- Issue date Aug 1, 2023
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric waveguide channel for interconnecting dies in a semicond...
- Patent number 11,715,693
- Issue date Aug 1, 2023
- Intel Corporation
- Georgios Dogiamis
- G02 - OPTICS
Information Patent Grant
Interconnection structure fabrication using grayscale lithography
- Patent number 11,664,303
- Issue date May 30, 2023
- Intel Corporation
- Johanna Swan
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE TRANSFER OF OPTICAL AND OPTO-ELECTRONIC COMPONENTS
- Publication number 20250105053
- Publication date Mar 27, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE EMBEDDED SILICON BRIDGE VIA PILLARS IN LITHOGRAPHICALLY DE...
- Publication number 20250096197
- Publication date Mar 20, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC INDUCTORS FOR SEMICONDUCTOR PACKAGING
- Publication number 20250079300
- Publication date Mar 6, 2025
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20250070083
- Publication date Feb 27, 2025
- Intel Corporation
- Adel A. ELSHERBINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS
- Publication number 20250006781
- Publication date Jan 2, 2025
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20240429173
- Publication date Dec 26, 2024
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER-WAVE DIELECTRIC WAVEGUIDE BUNDLE INCLUDING FIRST AND SEC...
- Publication number 20240429588
- Publication date Dec 26, 2024
- Intel Corporation
- Diego Correas-Serrano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH CORE VIA COAXIAL-TYPE INDUCTORS WITH TWO OR MORE MAGNETIC M...
- Publication number 20240371799
- Publication date Nov 7, 2024
- Intel Corporation
- Aleksander ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY STRUCTURES
- Publication number 20240355725
- Publication date Oct 24, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTE...
- Publication number 20240339381
- Publication date Oct 10, 2024
- Intel Corporation
- Hiroki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS
- Publication number 20240222018
- Publication date Jul 4, 2024
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC QUASI-MONOLITHIC DIE ARCHITECTURES
- Publication number 20240061194
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- G02 - OPTICS
Information Patent Application
PACKAGE ARCHITECTURE FOR QUASI-MONOLITHIC CHIP WITH BACKSIDE POWER
- Publication number 20240063120
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE OF LARGE DIES USING QUASI-MONOLITHIC CHIP LAYERS
- Publication number 20240063132
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH INTEGRATED CAPACITORS IN QUASI-MONOLITHIC...
- Publication number 20240063202
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20240038671
- Publication date Feb 1, 2024
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INTEGRATED THIN FILM CAPACITORS USING AMORPHOUS HIGH-K DI...
- Publication number 20240014149
- Publication date Jan 11, 2024
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATFORMS INCLUDING MICROELECTRONIC PACKAGES THEREIN COUPLED TO A C...
- Publication number 20230320021
- Publication date Oct 5, 2023
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL POWER DELIVERY STRUCTURES OF 3D STACKED DIE ASSEMBLIES
- Publication number 20230098957
- Publication date Mar 30, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN SITU INDUCTOR STRUCTURE IN BUILDUP POWER PLANES
- Publication number 20230096368
- Publication date Mar 30, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL POWER DELIVERY STRUCTURES NEAR HIGH-SPEED SIGNAL TRACES
- Publication number 20230094979
- Publication date Mar 30, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING OF CONFORMAL POWER DELIVERY STRUCTURES
- Publication number 20230098020
- Publication date Mar 30, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING VOLTAGE REGULATORS AND PASSIVE CIRCUIT ELEMENTS WITH TO...
- Publication number 20230095063
- Publication date Mar 30, 2023
- Intel Corporation
- Beomseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL POWER DELIVERY STRUCTURES INCLUDING EMBEDDED PASSIVE DEVICES
- Publication number 20230095608
- Publication date Mar 30, 2023
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL POWER DELIVERY STRUCTURES
- Publication number 20230095654
- Publication date Mar 30, 2023
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20230016326
- Publication date Jan 19, 2023
- Intel Corporation
- Henning M. Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD OF MANUFACTURING A VERTICALLY DISAGGREGATED PH...
- Publication number 20220413237
- Publication date Dec 29, 2022
- Henning Braunisch
- G02 - OPTICS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20220278057
- Publication date Sep 1, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20220254754
- Publication date Aug 11, 2022
- Intel Corporation
- Adel A. ELSHERBINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW LOSS AND LOW CROSS TALK TRANSMISSION LINES USING SHAPED VIAS
- Publication number 20220231394
- Publication date Jul 21, 2022
- Intel Corporation
- Adel A. ELSHERBINI
- H01 - BASIC ELECTRIC ELEMENTS

Henning Braunisch

Person

Patents Grantslast 30 patents

Components for millimeter-wave communication

Low leakage thin film capacitors using titanium oxide dielectric wi...

Integrating voltage regulators and passive circuit elements with to...

High-density interconnects for integrated circuit packages

Scalable embedded silicon bridge via pillars in lithographically de...

Microelectronic assemblies

High-throughput additively manufactured power delivery vias and traces

Components for millimeter-wave communication

Platforms including microelectronic packages therein coupled to a c...

Millimeter-wave dielectric waveguide bundle including first and sec...

Millimeter-wave dielectric waveguide including an opening of varyin...

Multi-chip package and method of providing die-to-die interconnects...

Microelectronic support for millimeter-wave communication including...

Dispersive waveguide crosstalk mitigation

Power delivery structures

Components for millimeter-wave communication

Components for millimeter-wave communication

Dispersion compensation for electromagnetic waveguides

Semiconductor packaging with high density interconnects

Multi-chip package and method of providing die-to-die interconnects...

Multi-chip package and method of providing die-to-die interconnects...

Substrate integrated thin film capacitors using amorphous high-k di...

Low loss and low cross talk transmission lines with stacked dielect...

Integrated circuit including a dielectric waveguide with a cavity t...

In situ package integrated thin film capacitors for power delivery

Waveguide fan-out

Microelectronic assemblies

Platforms including microelectronic packages therein coupled to a c...

Dielectric waveguide channel for interconnecting dies in a semicond...

Interconnection structure fabrication using grayscale lithography

Patents Applicationslast 30 patents

SELECTIVE TRANSFER OF OPTICAL AND OPTO-ELECTRONIC COMPONENTS

SCALABLE EMBEDDED SILICON BRIDGE VIA PILLARS IN LITHOGRAPHICALLY DE...

MAGNETIC INDUCTORS FOR SEMICONDUCTOR PACKAGING

MICROELECTRONIC ASSEMBLIES

CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

MILLIMETER-WAVE DIELECTRIC WAVEGUIDE BUNDLE INCLUDING FIRST AND SEC...

THROUGH CORE VIA COAXIAL-TYPE INDUCTORS WITH TWO OR MORE MAGNETIC M...

POWER DELIVERY STRUCTURES

AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTE...

SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS

PHOTONIC QUASI-MONOLITHIC DIE ARCHITECTURES

PACKAGE ARCHITECTURE FOR QUASI-MONOLITHIC CHIP WITH BACKSIDE POWER

PACKAGE ARCHITECTURE OF LARGE DIES USING QUASI-MONOLITHIC CHIP LAYERS

PACKAGE ARCHITECTURE WITH INTEGRATED CAPACITORS IN QUASI-MONOLITHIC...

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

SUBSTRATE INTEGRATED THIN FILM CAPACITORS USING AMORPHOUS HIGH-K DI...

PLATFORMS INCLUDING MICROELECTRONIC PACKAGES THEREIN COUPLED TO A C...

CONFORMAL POWER DELIVERY STRUCTURES OF 3D STACKED DIE ASSEMBLIES

IN SITU INDUCTOR STRUCTURE IN BUILDUP POWER PLANES

CONFORMAL POWER DELIVERY STRUCTURES NEAR HIGH-SPEED SIGNAL TRACES

COOLING OF CONFORMAL POWER DELIVERY STRUCTURES

INTEGRATING VOLTAGE REGULATORS AND PASSIVE CIRCUIT ELEMENTS WITH TO...

CONFORMAL POWER DELIVERY STRUCTURES INCLUDING EMBEDDED PASSIVE DEVICES

CONFORMAL POWER DELIVERY STRUCTURES

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

APPARATUS AND METHOD OF MANUFACTURING A VERTICALLY DISAGGREGATED PH...

MICROELECTRONIC ASSEMBLIES

MICROELECTRONIC ASSEMBLIES

LOW LOSS AND LOW CROSS TALK TRANSMISSION LINES USING SHAPED VIAS