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Henning Braunisch
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Phoenix, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Components for millimeter-wave communication
Patent number
11,955,684
Issue date
Apr 9, 2024
Intel Corporation
Diego Correas-Serrano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dispersion compensation for electromagnetic waveguides
Patent number
11,916,604
Issue date
Feb 27, 2024
Intel Corporation
Diego Correas-Serrano
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Semiconductor packaging with high density interconnects
Patent number
11,881,457
Issue date
Jan 23, 2024
Tahoe Research, LTD.
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
Patent number
11,876,053
Issue date
Jan 16, 2024
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
Patent number
11,824,008
Issue date
Nov 21, 2023
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate integrated thin film capacitors using amorphous high-k di...
Patent number
11,804,455
Issue date
Oct 31, 2023
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low loss and low cross talk transmission lines with stacked dielect...
Patent number
11,791,528
Issue date
Oct 17, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit including a dielectric waveguide with a cavity t...
Patent number
11,764,452
Issue date
Sep 19, 2023
Intel Corporation
Georgios Dogiamis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
In situ package integrated thin film capacitors for power delivery
Patent number
11,756,948
Issue date
Sep 12, 2023
Intel Corporation
Thomas Sounart
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Waveguide fan-out
Patent number
11,728,290
Issue date
Aug 15, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies
Patent number
11,721,649
Issue date
Aug 8, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Platforms including microelectronic packages therein coupled to a c...
Patent number
11,716,826
Issue date
Aug 1, 2023
Intel Corporation
Telesphor Kamgaing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dielectric waveguide channel for interconnecting dies in a semicond...
Patent number
11,715,693
Issue date
Aug 1, 2023
Intel Corporation
Georgios Dogiamis
G02 - OPTICS
Information
Patent Grant
Interconnection structure fabrication using grayscale lithography
Patent number
11,664,303
Issue date
May 30, 2023
Intel Corporation
Johanna Swan
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Microelectronic package with radio frequency (RF) chiplet
Patent number
11,605,603
Issue date
Mar 14, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contactless high-frequency interconnect
Patent number
11,581,272
Issue date
Feb 14, 2023
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate integrated thin film capacitors using amorphous high-k di...
Patent number
11,495,552
Issue date
Nov 8, 2022
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual sided thermal management solutions for integrated circuit pack...
Patent number
11,460,499
Issue date
Oct 4, 2022
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies
Patent number
11,393,777
Issue date
Jul 19, 2022
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded very high density (VHD) layer
Patent number
11,387,187
Issue date
Jul 12, 2022
Intel Corporation
Andrew Paul Collins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density interconnect structures configured for manufacturing a...
Patent number
11,387,188
Issue date
Jul 12, 2022
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electromagnetic interference shield created on package using high t...
Patent number
11,380,624
Issue date
Jul 5, 2022
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies
Patent number
11,348,897
Issue date
May 31, 2022
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dielectric waveguide including a dielectric material with cavities...
Patent number
11,329,359
Issue date
May 10, 2022
Intel Corporation
Georgios Dogiamis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low loss and low cross talk transmission lines having l-shaped cros...
Patent number
11,329,358
Issue date
May 10, 2022
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate integrated inductors using high throughput additive depos...
Patent number
11,282,800
Issue date
Mar 22, 2022
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Enabling long interconnect bridges
Patent number
11,222,847
Issue date
Jan 11, 2022
Intel Corporation
Ravindranath V. Mahajan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High-density interconnects for integrated circuit packages
Patent number
11,133,263
Issue date
Sep 28, 2021
Intel Corporation
Veronica Strong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Single side band transmission over a waveguide
Patent number
11,108,433
Issue date
Aug 31, 2021
Intel Corporation
Henning Braunisch
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Interconnection structure fabrication using grayscale lithography
Patent number
11,101,205
Issue date
Aug 24, 2021
Intel Corporation
Johanna Swan
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PHOTONIC QUASI-MONOLITHIC DIE ARCHITECTURES
Publication number
20240061194
Publication date
Feb 22, 2024
Intel Corporation
Adel A. Elsherbini
G02 - OPTICS
Information
Patent Application
PACKAGE ARCHITECTURE FOR QUASI-MONOLITHIC CHIP WITH BACKSIDE POWER
Publication number
20240063120
Publication date
Feb 22, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE OF LARGE DIES USING QUASI-MONOLITHIC CHIP LAYERS
Publication number
20240063132
Publication date
Feb 22, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE WITH INTEGRATED CAPACITORS IN QUASI-MONOLITHIC...
Publication number
20240063202
Publication date
Feb 22, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
Publication number
20240038671
Publication date
Feb 1, 2024
Intel Corporation
Henning BRAUNISCH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE INTEGRATED THIN FILM CAPACITORS USING AMORPHOUS HIGH-K DI...
Publication number
20240014149
Publication date
Jan 11, 2024
Intel Corporation
Aleksandar ALEKSOV
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLATFORMS INCLUDING MICROELECTRONIC PACKAGES THEREIN COUPLED TO A C...
Publication number
20230320021
Publication date
Oct 5, 2023
Intel Corporation
Telesphor Kamgaing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONFORMAL POWER DELIVERY STRUCTURES OF 3D STACKED DIE ASSEMBLIES
Publication number
20230098957
Publication date
Mar 30, 2023
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IN SITU INDUCTOR STRUCTURE IN BUILDUP POWER PLANES
Publication number
20230096368
Publication date
Mar 30, 2023
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COOLING OF CONFORMAL POWER DELIVERY STRUCTURES
Publication number
20230098020
Publication date
Mar 30, 2023
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONFORMAL POWER DELIVERY STRUCTURES NEAR HIGH-SPEED SIGNAL TRACES
Publication number
20230094979
Publication date
Mar 30, 2023
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATING VOLTAGE REGULATORS AND PASSIVE CIRCUIT ELEMENTS WITH TO...
Publication number
20230095063
Publication date
Mar 30, 2023
Intel Corporation
Beomseok Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONFORMAL POWER DELIVERY STRUCTURES INCLUDING EMBEDDED PASSIVE DEVICES
Publication number
20230095608
Publication date
Mar 30, 2023
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONFORMAL POWER DELIVERY STRUCTURES
Publication number
20230095654
Publication date
Mar 30, 2023
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
Publication number
20230016326
Publication date
Jan 19, 2023
Intel Corporation
Henning M. Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS AND METHOD OF MANUFACTURING A VERTICALLY DISAGGREGATED PH...
Publication number
20220413237
Publication date
Dec 29, 2022
Henning Braunisch
G02 - OPTICS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES
Publication number
20220278057
Publication date
Sep 1, 2022
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES
Publication number
20220254754
Publication date
Aug 11, 2022
Intel Corporation
Adel A. ELSHERBINI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW LOSS AND LOW CROSS TALK TRANSMISSION LINES USING SHAPED VIAS
Publication number
20220231394
Publication date
Jul 21, 2022
Intel Corporation
Adel A. ELSHERBINI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIELECTRIC WAVEGUIDE INCLUDING A DIELECTRIC MATERIAL WITH CAVITIES...
Publication number
20220173489
Publication date
Jun 2, 2022
Intel Corporation
Georgios Dogiamis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENABLING LONG INTERCONNECT BRIDGES
Publication number
20220130763
Publication date
Apr 28, 2022
Intel Corporation
Ravindranath V. Mahajan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW LEAKAGE THIN FILM CAPACITORS USING TITANIUM OXIDE DIELECTRIC WI...
Publication number
20220102483
Publication date
Mar 31, 2022
Intel Corporation
Thomas Sounart
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPONENTS FOR MILLIMETER-WAVE COMMUNICATION
Publication number
20210408653
Publication date
Dec 30, 2021
Intel Corporation
Diego Correas-Serrano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPONENTS FOR MILLIMETER-WAVE COMMUNICATION
Publication number
20210408655
Publication date
Dec 30, 2021
Intel Corporation
Neelam Prabhu Gaunkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPONENTS FOR MILLIMETER-WAVE COMMUNICATION
Publication number
20210408657
Publication date
Dec 30, 2021
Intel Corporation
Diego Correas-Serrano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH-THROUGHPUT ADDITIVELY MANUFACTURED POWER DELIVERY VIAS AND TRACES
Publication number
20210407903
Publication date
Dec 30, 2021
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPONENTS FOR MILLIMETER-WAVE COMMUNICATION
Publication number
20210408654
Publication date
Dec 30, 2021
Intel Corporation
Diego Correas-Serrano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPONENTS FOR MILLIMETER-WAVE COMMUNICATION
Publication number
20210407934
Publication date
Dec 30, 2021
Intel Corporation
Neelam Prabhu Gaunkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPONENTS FOR MILLIMETER-WAVE COMMUNICATION
Publication number
20210408652
Publication date
Dec 30, 2021
Intel Corporation
Diego Correas-Serrano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPONENTS FOR MILLIMETER-WAVE COMMUNICATION
Publication number
20210408656
Publication date
Dec 30, 2021
Intel Corporation
Diego Correas-Serrano
H01 - BASIC ELECTRIC ELEMENTS