Henning M. Hauenstein

Person

Redondo Beach, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer scale package for high power devices
- Patent number 9,559,068
- Issue date Jan 31, 2017
- Infineon Technologies Americas Corp.
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechatronic integration of motor drive and E-machine, especially sm...
- Patent number 9,102,242
- Issue date Aug 11, 2015
- International Rectifier Corporation
- Henning Hauenstein
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Dual compartment semiconductor package
- Patent number 9,054,119
- Issue date Jun 9, 2015
- International Rectifier Corporation
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with press-fit clamps
- Patent number 9,001,518
- Issue date Apr 7, 2015
- International Rectifier Corporation
- Henning M. Hauenstein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked half-bridge power module
- Patent number 8,987,777
- Issue date Mar 24, 2015
- International Rectifier Corporation
- Henning M. Hauenstein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having internal shunt and solder stop dimples
- Patent number 8,928,115
- Issue date Jan 6, 2015
- International Rectifier Corporation
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with temperature sensor
- Patent number 8,860,198
- Issue date Oct 14, 2014
- International Rectifier Corporation
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for high power devices
- Patent number 8,836,112
- Issue date Sep 16, 2014
- International Rectifier Corporation
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package with double-sided cooling
- Patent number 8,804,340
- Issue date Aug 12, 2014
- International Rectifier Corporation
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with current routing
- Patent number 8,736,040
- Issue date May 27, 2014
- International Rectifier Corporation
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond wireless power module with double-sided single device cooling...
- Patent number 8,680,666
- Issue date Mar 25, 2014
- International Rectifier Corporation
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual compartment semiconductor package with temperature sensor
- Patent number 8,637,981
- Issue date Jan 28, 2014
- International Rectifier Corporation
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly utilizing a DBC substrate
- Patent number 8,604,611
- Issue date Dec 10, 2013
- International Rectifier Corporation
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for high power devices
- Patent number 8,569,883
- Issue date Oct 29, 2013
- International Rectifier Corporation
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale package for high power devices
- Patent number 8,368,210
- Issue date Feb 5, 2013
- International Rectifier Corporation
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bondwireless power module with three-dimensional current routing
- Patent number 8,350,376
- Issue date Jan 8, 2013
- International Rectifier Corporation
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with internal device protection
- Patent number 8,102,668
- Issue date Jan 24, 2012
- International Rectifier Corporation
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for high power density devices
- Patent number 8,018,056
- Issue date Sep 13, 2011
- International Rectifier Corporation
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driver IC with HV-isolation, especially hybrid electric vehicle mot...
- Patent number 7,956,566
- Issue date Jun 7, 2011
- International Rectifier Corporation
- Henning M. Hauenstein
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Gate-driver IC with HV-isolation, especially hybrid electric vehicl...
- Patent number 7,834,575
- Issue date Nov 16, 2010
- International Rectifier Corporation
- Henning M. Hauenstein
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Substrate and method for mounting silicon device
- Patent number 7,723,830
- Issue date May 25, 2010
- International Rectifier Corporation
- Henning Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly efficient both-side-cooled discrete power package, especiall...
- Patent number 7,619,302
- Issue date Nov 17, 2009
- International Rectifier Corporation
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechatronic integration of motor drive and E-machine, especially sm...
- Patent number 7,567,053
- Issue date Jul 28, 2009
- International Rectifier Corporation
- Henning Hauenstein
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Low inductance bond-wireless co-package for high power density devi...
- Patent number 7,554,188
- Issue date Jun 30, 2009
- International Rectifier Corporation
- Henning Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wafer Scale Package for High Power Devices
- Publication number 20150035120
- Publication date Feb 5, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sintering Utilizing Non-Mechanical Pressure
- Publication number 20140224409
- Publication date Aug 14, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Henning M. Hauenstein
- B32 - LAYERED PRODUCTS
Information Patent Application
Semiconductor Package with Temperature Sensor
- Publication number 20140131709
- Publication date May 15, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Compartment Semiconductor Package
- Publication number 20140131767
- Publication date May 15, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package for High Power Devices
- Publication number 20140048923
- Publication date Feb 20, 2014
- International Rectifier Corporation
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having Internal Shunt and Solder Stop Dimples
- Publication number 20130147016
- Publication date Jun 13, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Assembly Utilizing a DBC Substrate
- Publication number 20130140684
- Publication date Jun 6, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module with Current Routing
- Publication number 20130119907
- Publication date May 16, 2013
- International Ractifier Corporation
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Half-Bridge Power Module
- Publication number 20130015495
- Publication date Jan 17, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package with Double-Sided Cooling
- Publication number 20120314372
- Publication date Dec 13, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module with Press-Fit Clamps
- Publication number 20120275121
- Publication date Nov 1, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Henning M. Hauenstein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bondwireless Power Module with Three-Dimensional Current Routing
- Publication number 20120262100
- Publication date Oct 18, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Compartment Semiconductor Package with Temperature Sensor
- Publication number 20120248564
- Publication date Oct 4, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package for High Power Devices
- Publication number 20120001316
- Publication date Jan 5, 2012
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Scale Package for High Power Devices
- Publication number 20110316086
- Publication date Dec 29, 2011
- International Rectifier Corporation
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH INTERNAL DEVICE PROTECTION
- Publication number 20090279220
- Publication date Nov 12, 2009
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gate-driver IC with HV-isolation, especially hybrid electric vehicl...
- Publication number 20090243764
- Publication date Oct 1, 2009
- International Rectifier Corp.
- Henning M. Hauenstein
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Driver IC with HV-isolation, especially hybrid electric vehicle mot...
- Publication number 20090184760
- Publication date Jul 23, 2009
- International Rectifier Corp.
- Henning M. Hauenstein
- B60 - VEHICLES IN GENERAL
Information Patent Application
Mechatronic integration of motor drive and E-machine, especially sm...
- Publication number 20080018290
- Publication date Jan 24, 2008
- International Rectifier Corporation
- Henning Hauenstein
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
BOND WIRELESS POWER MODULE WIHT DOUBLE-SIDED SINGLE DEVICE COOLING...
- Publication number 20070290311
- Publication date Dec 20, 2007
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGHLY EFFICIENT BOTH-SIDE-COOLED DISCRETE POWER PACKAGE, ESPECIALL...
- Publication number 20070273009
- Publication date Nov 29, 2007
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mechatronic integration of motor drive and E-machine, especially sm...
- Publication number 20070267926
- Publication date Nov 22, 2007
- International Rectifier Corp.
- Henning Hauenstein
- B60 - VEHICLES IN GENERAL
Information Patent Application
DIE-ON-LEADFRAME (DOL) WITH HIGH VOLTAGE ISOLATION
- Publication number 20070257343
- Publication date Nov 8, 2007
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low inductance bond-wireless co-package for high power density devi...
- Publication number 20070241393
- Publication date Oct 18, 2007
- International Rectifier Corporation
- Henning Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND METHOD FOR MOUNTING SILICON DEVICE
- Publication number 20070182008
- Publication date Aug 9, 2007
- Henning Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package for high power density devices
- Publication number 20070138651
- Publication date Jun 21, 2007
- International Rectifier Corporation
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS

Henning M. Hauenstein

Person

Patents Grantslast 30 patents

Wafer scale package for high power devices

Mechatronic integration of motor drive and E-machine, especially sm...

Dual compartment semiconductor package

Power module with press-fit clamps

Stacked half-bridge power module

Semiconductor package having internal shunt and solder stop dimples

Semiconductor package with temperature sensor

Semiconductor package for high power devices

Power semiconductor package with double-sided cooling

Power module with current routing

Bond wireless power module with double-sided single device cooling...

Dual compartment semiconductor package with temperature sensor

Semiconductor device assembly utilizing a DBC substrate

Package for high power devices

Wafer scale package for high power devices

Bondwireless power module with three-dimensional current routing

Semiconductor device package with internal device protection

Package for high power density devices

Driver IC with HV-isolation, especially hybrid electric vehicle mot...

Gate-driver IC with HV-isolation, especially hybrid electric vehicl...

Substrate and method for mounting silicon device

Highly efficient both-side-cooled discrete power package, especiall...

Mechatronic integration of motor drive and E-machine, especially sm...

Low inductance bond-wireless co-package for high power density devi...

Patents Applicationslast 30 patents

Wafer Scale Package for High Power Devices

Sintering Utilizing Non-Mechanical Pressure

Semiconductor Package with Temperature Sensor

Dual Compartment Semiconductor Package

Semiconductor Package for High Power Devices

Semiconductor Package Having Internal Shunt and Solder Stop Dimples

Semiconductor Device Assembly Utilizing a DBC Substrate

Power Module with Current Routing

Stacked Half-Bridge Power Module

Power Semiconductor Package with Double-Sided Cooling

Power Module with Press-Fit Clamps

Bondwireless Power Module with Three-Dimensional Current Routing

Dual Compartment Semiconductor Package with Temperature Sensor

Package for High Power Devices

Wafer Scale Package for High Power Devices

SEMICONDUCTOR DEVICE PACKAGE WITH INTERNAL DEVICE PROTECTION

Gate-driver IC with HV-isolation, especially hybrid electric vehicl...

Driver IC with HV-isolation, especially hybrid electric vehicle mot...

Mechatronic integration of motor drive and E-machine, especially sm...

BOND WIRELESS POWER MODULE WIHT DOUBLE-SIDED SINGLE DEVICE COOLING...

HIGHLY EFFICIENT BOTH-SIDE-COOLED DISCRETE POWER PACKAGE, ESPECIALL...

Mechatronic integration of motor drive and E-machine, especially sm...

DIE-ON-LEADFRAME (DOL) WITH HIGH VOLTAGE ISOLATION

Low inductance bond-wireless co-package for high power density devi...

SUBSTRATE AND METHOD FOR MOUNTING SILICON DEVICE

Package for high power density devices