Henry A. Nye, III

Person

Brookfield, CT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnections for flip-chip using lead-free solders and having r...
- Patent number 8,026,613
- Issue date Sep 27, 2011
- International Business Machines Corporation
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnections for flip-chip using lead-free solders and having r...
- Patent number 7,923,849
- Issue date Apr 12, 2011
- International Business Machines Corporation
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of chemically formed anchored metallic vias
- Patent number 7,517,736
- Issue date Apr 14, 2009
- International Business Machines Corporation
- Sanjay C. Mehta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnections for flip-chip using lead-free solders and having r...
- Patent number 7,410,833
- Issue date Aug 12, 2008
- International Business Machines Corporation
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Immersion plating and plated structures
- Patent number 7,276,296
- Issue date Oct 2, 2007
- International Business Machines Corporation
- Emanuel I. Cooper
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ball limiting metallurgy, interconnection structure including the s...
- Patent number 7,273,803
- Issue date Sep 25, 2007
- International Business Machines Corporation
- Yu-Ting Cheng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Immersion plating and plated structures
- Patent number 7,037,559
- Issue date May 2, 2006
- International Business Machines Corporation
- Emanuel I. Cooper
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Insulative cap for laser fusing
- Patent number 6,946,379
- Issue date Sep 20, 2005
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support structures for wirebond regions of contact pads over low mo...
- Patent number 6,908,841
- Issue date Jun 21, 2005
- Infineon Technologies AG
- Lloyd G. Burrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inhibition of tin oxide formation in lead free interconnect formation
- Patent number 6,900,142
- Issue date May 31, 2005
- International Business Machines Corporation
- Emanual I. Cooper
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...
- Publication number 20120012642
- Publication date Jan 19, 2012
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRADIENT DEPOSITION OF LOW-K CVD MATERIALS
- Publication number 20090026587
- Publication date Jan 29, 2009
- International Business Machines Corporation
- Matthew Angyal
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PREVENTING DAMAGE TO INTERLEVEL DIELECTRIC
- Publication number 20070072412
- Publication date Mar 29, 2007
- International Business Machines Corporation
- Derren N. Dunn
- H01 - BASIC ELECTRIC ELEMENTS

Henry A. Nye, III

Person

Patents Grantslast 30 patents

Interconnections for flip-chip using lead-free solders and having r...

Interconnections for flip-chip using lead-free solders and having r...

Structure and method of chemically formed anchored metallic vias

Interconnections for flip-chip using lead-free solders and having r...

Immersion plating and plated structures

Ball limiting metallurgy, interconnection structure including the s...

Immersion plating and plated structures

Insulative cap for laser fusing

Support structures for wirebond regions of contact pads over low mo...

Inhibition of tin oxide formation in lead free interconnect formation

Patents Applicationslast 30 patents

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...

GRADIENT DEPOSITION OF LOW-K CVD MATERIALS

PREVENTING DAMAGE TO INTERLEVEL DIELECTRIC