Henry Descalzo Bathan

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Thousand Oaks, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming substrate with 3-sided w...
- Patent number 12,176,273
- Issue date Dec 24, 2024
- Semtech Corporation
- Henry D. Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Side-solderable leadless package
- Patent number 11,810,842
- Issue date Nov 7, 2023
- Semtech Corporation
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming mold degating structure...
- Patent number 11,469,149
- Issue date Oct 11, 2022
- Semtech Corporation
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Side-solderable leadless package
- Patent number 10,892,211
- Issue date Jan 12, 2021
- Semtech Corporation
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Substrate with 3-Sided W...
- Publication number 20250062197
- Publication date Feb 20, 2025
- SEMTECH CORPORATION
- Henry D. Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Side-Solderable Leadless Package
- Publication number 20240021504
- Publication date Jan 18, 2024
- SEMTECH CORPORATION
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Substrate with 3-Sided W...
- Publication number 20230197583
- Publication date Jun 22, 2023
- SEMTECH CORPORATION
- Henry D. Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Mold Degating Structure...
- Publication number 20210151359
- Publication date May 20, 2021
- SEMTECH CORPORATION
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Side-Solderable Leadless Package
- Publication number 20210118776
- Publication date Apr 22, 2021
- SEMTECH CORPORATION
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Side-Solderable Leadless Package
- Publication number 20190051584
- Publication date Feb 14, 2019
- SEMTECH CORPORATION
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS