Henry Lo

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Near non-adaptive virtual metrology and chamber control
- Patent number 9,588,505
- Issue date Mar 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yu Wang
- G05 - CONTROLLING REGULATING
Information Patent Grant
Preventing contamination in integrated circuit manufacturing lines
- Patent number 9,177,843
- Issue date Nov 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Ming Sung
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Clustering for prediction models in process control and for optimal...
- Patent number 9,037,279
- Issue date May 19, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Francis Ko
- G05 - CONTROLLING REGULATING
Information Patent Grant
Automatic virtual metrology for semiconductor wafer result prediction
- Patent number 8,682,466
- Issue date Mar 25, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Francis Ko
- G05 - CONTROLLING REGULATING
Information Patent Grant
Near non-adaptive virtual metrology and chamber control
- Patent number 8,433,434
- Issue date Apr 30, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Amy Wang
- G05 - CONTROLLING REGULATING
Information Patent Grant
Method and system for controlling copper chemical mechanical polish...
- Patent number 8,409,993
- Issue date Apr 2, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Francis Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for extraction of key process parameters from fault detectio...
- Patent number 7,974,728
- Issue date Jul 5, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hsien Lin
- G05 - CONTROLLING REGULATING
Information Patent Grant
Integrated etch and supercritical CO2 process and chamber design
- Patent number 7,951,723
- Issue date May 31, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Ya Wang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Integrated circuit devices with multi-dimensional pad structures
- Patent number 7,928,549
- Issue date Apr 19, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hai-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for enhanced control of copper trench sheet resis...
- Patent number 7,851,234
- Issue date Dec 14, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Francis Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Auto routing for optimal uniformity control
- Patent number 7,767,471
- Issue date Aug 3, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jean Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prediction of uniformity of a wafer
- Patent number 7,634,325
- Issue date Dec 15, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jean Wang
- G01 - MEASURING TESTING
Information Patent Grant
Method to implement stress free polishing
- Patent number 7,544,606
- Issue date Jun 9, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jean Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving low-K dielectrics by supercritical fluid treat...
- Patent number 7,387,973
- Issue date Jun 17, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Ya Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface modification of a porous organic material through the use o...
- Patent number 7,354,623
- Issue date Apr 8, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Ya Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-etching method to replicate alignment marks for semiconductor...
- Patent number 7,338,909
- Issue date Mar 4, 2008
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Yu-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming dual damascenes with supercritical fluid treatments
- Patent number 7,332,449
- Issue date Feb 19, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Ya Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarizing method employing hydrogenated silicon nitride planarizi...
- Patent number 7,129,151
- Issue date Oct 31, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ping Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced process control approach for Cu interconnect wiring sheet...
- Patent number 7,083,495
- Issue date Aug 1, 2006
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Hsien Lin
- B24 - GRINDING POLISHING
Information Patent Grant
Method and composition to improve a nitride/oxide wet etching selec...
- Patent number 6,987,064
- Issue date Jan 17, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ping Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for in-situ monitoring of mixing ratio of high se...
- Patent number 6,884,149
- Issue date Apr 26, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Ting Tsai
- B24 - GRINDING POLISHING
Information Patent Grant
System and method for dampening high pressure impact on porous mate...
- Patent number 6,875,285
- Issue date Apr 5, 2005
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Ya Wang
- B08 - CLEANING
Information Patent Grant
Application of a supercritical CO2 system for curing low k dielectr...
- Patent number 6,875,709
- Issue date Apr 5, 2005
- Taiwan Semiconductor Manufacturing Comapny, Ltd.
- Chun-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing pad conditioning disks for chemical mechanical polisher
- Patent number 6,872,127
- Issue date Mar 29, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Liang Lin
- B24 - GRINDING POLISHING
Information Patent Grant
Method to solve alignment mark blinded issues and a technology for...
- Patent number 6,746,966
- Issue date Jun 8, 2004
- Taiwan Semiconductor Manufacturing Company
- Chung-Long Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for in-situ monitoring of mixing ratio of high se...
- Patent number 6,729,935
- Issue date May 4, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Ting Tsai
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Near Non-Adaptive Virtual Metrology and Chamber Control
- Publication number 20140088747
- Publication date Mar 27, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yu Wang
- G05 - CONTROLLING REGULATING
Information Patent Application
Clustering for Prediction Models in Process Control and for Optimal...
- Publication number 20110060441
- Publication date Mar 10, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Francis Ko
- G05 - CONTROLLING REGULATING
Information Patent Application
Near Non-Adaptive Virtual Metrology and Chamber Control
- Publication number 20110009998
- Publication date Jan 13, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Amy Wang
- G05 - CONTROLLING REGULATING
Information Patent Application
SYSTEM AND METHOD FOR ENHANCED CONTROL OF COPPER TRENCH SHEET RESIS...
- Publication number 20090142860
- Publication date Jun 4, 2009
- Taiwan Semiconductor Manufacturing Co., LTD
- Francis Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Auto Routing for Optimal Uniformity Control
- Publication number 20090035883
- Publication date Feb 5, 2009
- Jean Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for controlling copper chemical mechanical polish...
- Publication number 20080305563
- Publication date Dec 11, 2008
- Francis Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Preventing Contamination in Integrated Circuit Manufacturing Lines
- Publication number 20080304944
- Publication date Dec 11, 2008
- Chien-Ming Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTRACTION OF KEY PROCESS PARAMETER
- Publication number 20080275585
- Publication date Nov 6, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hsien Lin
- G05 - CONTROLLING REGULATING
Information Patent Application
Novel Methodology To Realize Automatic Virtual Metrology
- Publication number 20080275586
- Publication date Nov 6, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Francis Ko
- G05 - CONTROLLING REGULATING
Information Patent Application
PREDICTION OF UNIFORMITY OF A WAFER
- Publication number 20080275588
- Publication date Nov 6, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jean Wang
- G01 - MEASURING TESTING
Information Patent Application
Integrated Etch and Supercritical CO2 Process and Chamber Design
- Publication number 20080108223
- Publication date May 8, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Ya Wang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Integrated circuit devices with multi-dimensional pad structures
- Publication number 20080067657
- Publication date Mar 20, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hai-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming dual damascenes with supercritical fluid treatments
- Publication number 20070241455
- Publication date Oct 18, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Ya Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional integrated circuit structure
- Publication number 20070145367
- Publication date Jun 28, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hai-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel method to implement stress free polishing
- Publication number 20060276030
- Publication date Dec 7, 2006
- Jean Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for improving low-K dielectrics by supercritical fluid treat...
- Publication number 20060073697
- Publication date Apr 6, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Ya Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro-etching method to replicate alignment marks for semiconductor...
- Publication number 20050282396
- Publication date Dec 22, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface modification of a porous organic material through the use o...
- Publication number 20050260402
- Publication date Nov 24, 2005
- Ching-Ya Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIB exposure of alignment marks in MIM technology
- Publication number 20050186753
- Publication date Aug 25, 2005
- Ping-Hsu Chen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method of integrating post-etching cleaning process with deposition...
- Publication number 20050158664
- Publication date Jul 21, 2005
- Joshua Tseng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Advanced process control approach for Cu interconnect wiring sheet...
- Publication number 20050112997
- Publication date May 26, 2005
- Chun Hsien Lin
- G05 - CONTROLLING REGULATING
Information Patent Application
Planarizing method employing hydrogenated silicon nitride planarizi...
- Publication number 20050095864
- Publication date May 5, 2005
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Ping Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for dampening high pressure impact on porous mate...
- Publication number 20040211440
- Publication date Oct 28, 2004
- Ching-Ya Wang
- B08 - CLEANING
Information Patent Application
Method and system for in-situ monitoring of mixing ratio of high se...
- Publication number 20040203322
- Publication date Oct 14, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Ting Tsai
- B24 - GRINDING POLISHING
Information Patent Application
Method to solve alignment mark blinded issues and technology for ap...
- Publication number 20040198017
- Publication date Oct 7, 2004
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Chung-Long Chang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Novel application of a supercritical CO2 system for curing low k di...
- Publication number 20040175958
- Publication date Sep 9, 2004
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Chun-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and composition to improve a nitride/oxide wet etching selec...
- Publication number 20040077171
- Publication date Apr 22, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ping Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Slurry flow control and monitor system for chemical mechanical poli...
- Publication number 20040071555
- Publication date Apr 15, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ping-Hsu Chen
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
Dual mode hybrid control and method for CMP slurry
- Publication number 20040072503
- Publication date Apr 15, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Jung Chang
- B24 - GRINDING POLISHING
Information Patent Application
Polishing pad conditioning disks for chemical mechanical polisher
- Publication number 20040009742
- Publication date Jan 15, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Liang Lin
- B24 - GRINDING POLISHING

Person

Patents Grantslast 30 patents

Near non-adaptive virtual metrology and chamber control

Preventing contamination in integrated circuit manufacturing lines

Clustering for prediction models in process control and for optimal...

Automatic virtual metrology for semiconductor wafer result prediction

Near non-adaptive virtual metrology and chamber control

Method and system for controlling copper chemical mechanical polish...

System for extraction of key process parameters from fault detectio...

Integrated etch and supercritical CO2 process and chamber design

Integrated circuit devices with multi-dimensional pad structures

System and method for enhanced control of copper trench sheet resis...

Auto routing for optimal uniformity control

Prediction of uniformity of a wafer

Method to implement stress free polishing

Method for improving low-K dielectrics by supercritical fluid treat...

Surface modification of a porous organic material through the use o...

Micro-etching method to replicate alignment marks for semiconductor...

Method for forming dual damascenes with supercritical fluid treatments

Planarizing method employing hydrogenated silicon nitride planarizi...

Advanced process control approach for Cu interconnect wiring sheet...

Method and composition to improve a nitride/oxide wet etching selec...

Method and system for in-situ monitoring of mixing ratio of high se...

System and method for dampening high pressure impact on porous mate...

Application of a supercritical CO2 system for curing low k dielectr...

Polishing pad conditioning disks for chemical mechanical polisher

Method to solve alignment mark blinded issues and a technology for...

Method and system for in-situ monitoring of mixing ratio of high se...

Patents Applicationslast 30 patents

Near Non-Adaptive Virtual Metrology and Chamber Control

Clustering for Prediction Models in Process Control and for Optimal...

Near Non-Adaptive Virtual Metrology and Chamber Control

SYSTEM AND METHOD FOR ENHANCED CONTROL OF COPPER TRENCH SHEET RESIS...

Auto Routing for Optimal Uniformity Control

Method and system for controlling copper chemical mechanical polish...

Preventing Contamination in Integrated Circuit Manufacturing Lines

EXTRACTION OF KEY PROCESS PARAMETER

Novel Methodology To Realize Automatic Virtual Metrology

PREDICTION OF UNIFORMITY OF A WAFER

Integrated Etch and Supercritical CO2 Process and Chamber Design

Integrated circuit devices with multi-dimensional pad structures

Method for forming dual damascenes with supercritical fluid treatments

Three-dimensional integrated circuit structure

Novel method to implement stress free polishing

Method for improving low-K dielectrics by supercritical fluid treat...

Micro-etching method to replicate alignment marks for semiconductor...

Surface modification of a porous organic material through the use o...

FIB exposure of alignment marks in MIM technology

Method of integrating post-etching cleaning process with deposition...

Advanced process control approach for Cu interconnect wiring sheet...

Planarizing method employing hydrogenated silicon nitride planarizi...

System and method for dampening high pressure impact on porous mate...

Method and system for in-situ monitoring of mixing ratio of high se...

Method to solve alignment mark blinded issues and technology for ap...

Novel application of a supercritical CO2 system for curing low k di...

Method and composition to improve a nitride/oxide wet etching selec...

Slurry flow control and monitor system for chemical mechanical poli...

Dual mode hybrid control and method for CMP slurry

Polishing pad conditioning disks for chemical mechanical polisher