Herbert I. Stoller

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and manufacture of silicon based package and devices manufac...
- Patent number 8,097,492
- Issue date Jan 17, 2012
- International Business Machines Corporation
- John H. Magerlein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon based package
- Patent number 7,855,442
- Issue date Dec 21, 2010
- International Business Machines Corporation
- John H. Magerlein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple power density chip structure
- Patent number 7,193,318
- Issue date Mar 20, 2007
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture of silicon based package and devices manufact...
- Patent number 7,189,595
- Issue date Mar 13, 2007
- International Business Machines Corporation
- John H. Magerlein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jogging structure for wiring translation between grids with non-int...
- Patent number 6,974,722
- Issue date Dec 13, 2005
- International Business Machines Corporation
- Glenn G. Daves
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacture of silicon based package
- Patent number 6,878,608
- Issue date Apr 12, 2005
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jogging structure for wiring translation between grids with non-int...
- Patent number 6,762,489
- Issue date Jul 13, 2004
- International Business Machines Corporation
- Glenn G. Daves
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for repairing electronic packages
- Patent number 6,713,686
- Issue date Mar 30, 2004
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High k dielectric material with low k dielectric sheathed signal vias
- Patent number 6,430,030
- Issue date Aug 6, 2002
- International Business Machines Corporation
- Mukta S. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package containing multiple memory units
- Patent number 6,392,896
- Issue date May 21, 2002
- International Business Machines Corporation
- Herbert I. Stoller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct deposit thin film single/multi chip module
- Patent number 6,261,467
- Issue date Jul 17, 2001
- International Business Machines Corporation
- Ajay P. Giri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for a thin film multilayer capacitor
- Patent number 6,216,324
- Issue date Apr 17, 2001
- International Business Machines Corporation
- Mukta S. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making high k dielectric material with low k dielectric...
- Patent number 6,200,400
- Issue date Mar 13, 2001
- International Business Machines Corp.
- Mukta S. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High k dielectric capacitor with low k sheathed signal vias
- Patent number 6,072,690
- Issue date Jun 6, 2000
- International Business Machines Corporation
- Mukta S. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct deposit thin film single/multi chip module
- Patent number 6,037,044
- Issue date Mar 14, 2000
- International Business Machines Corporation
- Ajay P. Giri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for a thin film multilayer capacitor
- Patent number 6,023,407
- Issue date Feb 8, 2000
- International Business Machines Corporation
- Mukta S. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Internal resistor termination in multi-chip module environments
- Patent number 5,635,761
- Issue date Jun 3, 1997
- International Business Machines, Inc.
- Tai A. Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct distribution repair and engineering change system
- Patent number 5,243,140
- Issue date Sep 7, 1993
- International Business Machines Corporation
- Harsaran S. Bhatia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics system with direct write engineering change capability
- Patent number 5,060,116
- Issue date Oct 22, 1991
- Warren D. Grobman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered interposer board for powering high current chip modules
- Patent number 4,688,151
- Issue date Aug 18, 1987
- International Business Machines Corporation
- Charles J. Kraus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Engineering change facility on both major surfaces of chip module
- Patent number 4,546,413
- Issue date Oct 8, 1985
- International Business Machines Corporation
- Irving Feinberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density wired module
- Patent number 4,535,388
- Issue date Aug 13, 1985
- International Business Machines Corporation
- Charles J. Kraus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective epitaxy method for making filamentary pedestal transistor
- Patent number 4,252,581
- Issue date Feb 24, 1981
- International Business Machines Corporation
- Narasipur G. Anantha
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of manufacture of silicon based package and devices manufact...
- Publication number 20070111385
- Publication date May 17, 2007
- John H. Magerlein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE POWER DENSITY CHIP STRUCTURE
- Publication number 20060038281
- Publication date Feb 23, 2006
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacture of silicon based package and devices manufact...
- Publication number 20040229398
- Publication date Nov 18, 2004
- International Business Machines Corporation
- John H. Magerlein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOGGING STRUCTURE FOR WIRING TRANSLATION BETWEEN GRIDS WITH NON-INT...
- Publication number 20040188823
- Publication date Sep 30, 2004
- International Business Machines Corporation
- Glenn G. Daves
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for repairing electronic packages
- Publication number 20030136581
- Publication date Jul 24, 2003
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure and method for wiring translation between grids with non-...
- Publication number 20030094687
- Publication date May 22, 2003
- Glenn G. Daves
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacture of silicon based package and device manufactu...
- Publication number 20020180013
- Publication date Dec 5, 2002
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for making high k dielectric material with low k dielectric...
- Publication number 20010011571
- Publication date Aug 9, 2001
- International Business Machines Corporation
- Mukta S. Farooq
- H01 - BASIC ELECTRIC ELEMENTS

Herbert I. Stoller

Person

Patents Grantslast 30 patents

Method and manufacture of silicon based package and devices manufac...

Silicon based package

Multiple power density chip structure

Method of manufacture of silicon based package and devices manufact...

Jogging structure for wiring translation between grids with non-int...

Method of manufacture of silicon based package

Jogging structure for wiring translation between grids with non-int...

Apparatus and method for repairing electronic packages

High k dielectric material with low k dielectric sheathed signal vias

Semiconductor package containing multiple memory units

Direct deposit thin film single/multi chip module

Method for a thin film multilayer capacitor

Method for making high k dielectric material with low k dielectric...

High k dielectric capacitor with low k sheathed signal vias

Direct deposit thin film single/multi chip module

Structure for a thin film multilayer capacitor

Internal resistor termination in multi-chip module environments

Direct distribution repair and engineering change system

Electronics system with direct write engineering change capability

Multilayered interposer board for powering high current chip modules

Engineering change facility on both major surfaces of chip module

High density wired module

Selective epitaxy method for making filamentary pedestal transistor

Patents Applicationslast 30 patents

Method of manufacture of silicon based package and devices manufact...

MULTIPLE POWER DENSITY CHIP STRUCTURE

Method of manufacture of silicon based package and devices manufact...

JOGGING STRUCTURE FOR WIRING TRANSLATION BETWEEN GRIDS WITH NON-INT...

Apparatus and method for repairing electronic packages

Structure and method for wiring translation between grids with non-...

Method of manufacture of silicon based package and device manufactu...

Method for making high k dielectric material with low k dielectric...