Herbert Schwarzbauer

Person

Munchen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Explosion-proof module structure for power components, particularly...
- Patent number 8,110,927
- Issue date Feb 7, 2012
- Siemens Aktiengesellschaft
- Herbert Schwarzbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical component and film composite laminated on the component...
- Patent number 7,932,585
- Issue date Apr 26, 2011
- Siemens Aktiengesellschaft
- Laurence Amigues
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Arrangement for hermetically sealing components, and method for the...
- Patent number 7,897,881
- Issue date Mar 1, 2011
- Siemens Aktiengesellschaft
- Michael Kaspar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making contact with electrical contact with electrical c...
- Patent number 7,402,457
- Issue date Jul 22, 2008
- Siemens Aktiengesellschaft
- Kerstin Häse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device with power semiconductor components for controlling the powe...
- Patent number 7,057,275
- Issue date Jun 6, 2006
- Siemens Aktiengesellschaft
- Herbert Schwarzbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-conducting adhesive joint with an adhesive-filled, porous heat...
- Patent number 6,823,915
- Issue date Nov 30, 2004
- Siemens Aktiengesellschaft
- Herbert Schwarzbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a heat-conducting connection between two work...
- Patent number 6,776,329
- Issue date Aug 17, 2004
- Siemens Aktiengesellschaft
- Herbert Schwarzbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a microelectronic component of sandwich constr...
- Patent number 6,584,681
- Issue date Jul 1, 2003
- Infineon Technologies AG
- Leo Lorenz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Matrix converter
- Patent number 6,559,532
- Issue date May 6, 2003
- Siemens Aktiengesellschaft
- Herbert Schwarzbauer
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Microelectronic component of sandwich construction
- Patent number 6,324,072
- Issue date Nov 27, 2001
- Siemens Aktiengesellschaft
- Leo Lorenz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connection for a power semiconductor component
- Patent number 6,175,148
- Issue date Jan 16, 2001
- Siemens Aktiengesellschaft
- Herbert Schwarzbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sintering method for fastening electronic components on a...
- Patent number 5,893,511
- Issue date Apr 13, 1999
- Siemens Aktiengesellschaft
- Herbert Schwarzbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor component with monolithically integrated sensor...
- Patent number 5,663,574
- Issue date Sep 2, 1997
- Siemens Aktiengesellchaft
- Christofer Hierold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor component having a buffer layer
- Patent number 5,654,586
- Issue date Aug 5, 1997
- Siemens Aktiengesellschaft
- Herbert Schwarzbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor modular structure
- Patent number 5,379,942
- Issue date Jan 10, 1995
- Siemens Aktiengesellschaft
- Reinhold Kuhnert
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and arrangement for connecting a semiconductor to a substrat...
- Patent number 5,158,226
- Issue date Oct 27, 1992
- Siemens Aktiengesellschaft
- Herbert Schwarzbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thyristor with high positive and negative blocking capability and m...
- Patent number 5,077,224
- Issue date Dec 31, 1991
- Siemens Aktiengesellschaft
- Herbert Schwarzbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thyristor with high positive and negative blocking capability
- Patent number 5,072,312
- Issue date Dec 10, 1991
- Siemens Aktiengesellschaft
- Herbert Schwarzbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for fastening semiconductor components to substrates
- Patent number 5,067,647
- Issue date Nov 26, 1991
- Siemens Aktiengesellschaft
- Herbert Schwarzbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for fastening electronic components to substrates
- Patent number 5,058,796
- Issue date Oct 22, 1991
- Siemens Aktiengesellschaft
- Herbert Schwarzbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for fastening semiconductor components to subs...
- Patent number 4,903,886
- Issue date Feb 27, 1990
- Siemens Aktiengesellschaft
- Herbert Schwarzbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for fastening electronic components to substrates
- Patent number 4,903,885
- Issue date Feb 27, 1990
- Siemens Aktiengesellschaft
- Herbert Schwarzbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of securing electronic components to a substrate
- Patent number 4,810,672
- Issue date Mar 7, 1989
- Siemens Aktiengesellschaft
- Herbert Schwarzbauer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRESSURE SUPPORT FOR AN ELECTRONIC CIRCUIT
- Publication number 20120075826
- Publication date Mar 29, 2012
- Michael Kaspar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT AND METHOD FOR PRODUCI...
- Publication number 20120028025
- Publication date Feb 2, 2012
- SIEMENS AKTIENGESELLSCHAFT
- Daniel Wolde-Giorgis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EXPLOSION-PROOF MODULE STRUCTURE FOR POWER COMPONENTS, PARTICULARLY...
- Publication number 20100314775
- Publication date Dec 16, 2010
- Siemens Aktiengesellschaft
- Herbert Schwarzbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing electronic component and electronic component
- Publication number 20100133577
- Publication date Jun 3, 2010
- Werner Hoffmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Component and Film Composite Laminated On the Component...
- Publication number 20100044889
- Publication date Feb 25, 2010
- Laurence Amigues
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System Comprising an Electrical Component and an Electrical Connect...
- Publication number 20080001244
- Publication date Jan 3, 2008
- Herbert Schwarzbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for contacting electrical contact surfaces of a substrate an...
- Publication number 20050032347
- Publication date Feb 10, 2005
- Kerstin Hase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device with power semiconductor components for controlling the powe...
- Publication number 20040256710
- Publication date Dec 23, 2004
- Herbert Schwarzbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing a heat-conducting connection between two work...
- Publication number 20030102356
- Publication date Jun 5, 2003
- Herbert Schwarzbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat-conducting adhesive compound and a method for producing a heat...
- Publication number 20030020159
- Publication date Jan 30, 2003
- Herbert Schwarzbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing a microelectronic component of sandwich constr...
- Publication number 20020023341
- Publication date Feb 28, 2002
- Siemens Aktiengesellschaft
- Leo Lorenz
- H01 - BASIC ELECTRIC ELEMENTS

Herbert Schwarzbauer

Person

Patents Grantslast 30 patents

Explosion-proof module structure for power components, particularly...

Electrical component and film composite laminated on the component...

Arrangement for hermetically sealing components, and method for the...

Method for making contact with electrical contact with electrical c...

Device with power semiconductor components for controlling the powe...

Heat-conducting adhesive joint with an adhesive-filled, porous heat...

Method for producing a heat-conducting connection between two work...

Method for producing a microelectronic component of sandwich constr...

Matrix converter

Microelectronic component of sandwich construction

Electrical connection for a power semiconductor component

Pressure sintering method for fastening electronic components on a...

Power semiconductor component with monolithically integrated sensor...

Power semiconductor component having a buffer layer

Method for producing a semiconductor modular structure

Method and arrangement for connecting a semiconductor to a substrat...

Thyristor with high positive and negative blocking capability and m...

Thyristor with high positive and negative blocking capability

Apparatus for fastening semiconductor components to substrates

Apparatus for fastening electronic components to substrates

Method and apparatus for fastening semiconductor components to subs...

Method and apparatus for fastening electronic components to substrates

Method of securing electronic components to a substrate

Patents Applicationslast 30 patents

PRESSURE SUPPORT FOR AN ELECTRONIC CIRCUIT

ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT AND METHOD FOR PRODUCI...

EXPLOSION-PROOF MODULE STRUCTURE FOR POWER COMPONENTS, PARTICULARLY...

Method for producing electronic component and electronic component

Electrical Component and Film Composite Laminated On the Component...

System Comprising an Electrical Component and an Electrical Connect...

Method for contacting electrical contact surfaces of a substrate an...

Device with power semiconductor components for controlling the powe...

Method for producing a heat-conducting connection between two work...

Heat-conducting adhesive compound and a method for producing a heat...

Method for producing a microelectronic component of sandwich constr...