Heung S. Chun

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Bottom lead semiconductor chip package
- Patent number 6,043,430
- Issue date Mar 28, 2000
- LG Semicon Co., Ltd.
- Heung-Sup Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus having a leadframe with coated leads
- Patent number 5,923,080
- Issue date Jul 13, 1999
- LG Semicon Co., Ltd.
- Heung Sup Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing semiconductor package having solder balls
- Patent number 5,856,212
- Issue date Jan 5, 1999
- Goldstar Electron Co., Ltd.
- Heung Sop Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and a method of manufacturing thereof
- Patent number 5,849,609
- Issue date Dec 15, 1998
- LG Semicon Co., Ltd.
- Heung Sup Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding package
- Patent number 5,731,636
- Issue date Mar 24, 1998
- LG Semicon Co., Ltd.
- Heung Sup Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold and method for manufacturing a package for a semiconductor chi...
- Patent number 5,644,169
- Issue date Jul 1, 1997
- Goldstar Electron Co., Ltd.
- Heung Sup Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated double-chip semiconductor package and method for fabrica...
- Patent number 5,572,068
- Issue date Nov 5, 1996
- Goldstar Electron Co., Inc.
- Heung Sup Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charge coupled device package with glass lid
- Patent number 5,352,852
- Issue date Oct 4, 1994
- Goldstar Electron Co., Ltd.
- Heung S. Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor package
- Patent number 5,331,235
- Issue date Jul 19, 1994
- Goldstar Electron Co., Ltd.
- Heung S. Chun
- H01 - BASIC ELECTRIC ELEMENTS

Heung S. Chun

Person

Patents Grantslast 30 patents

Bottom lead semiconductor chip package

Semiconductor apparatus having a leadframe with coated leads

Method of producing semiconductor package having solder balls

Semiconductor package and a method of manufacturing thereof

Semiconductor bonding package

Mold and method for manufacturing a package for a semiconductor chi...

Integrated double-chip semiconductor package and method for fabrica...

Charge coupled device package with glass lid

Multi-chip semiconductor package