Claims
- 1. A method of producing a semiconductor package having solder balls comprising the steps of:
- electrically connecting a plurality of bond pads of a semiconductor chip to a plurality of inner leads of a lead frame with a plurality of conductive media;
- packaging said chip, said lead frame and said conductive media in a mold resin body such that a plurality of holes are formed on only a single side of the resin body and communicate with corresponding ones of the plurality of inner leads of the lead frame; and
- charging conductors in the holes; and
- heating the conductors such that the conductors protrude out of a surface of the mold resin body and are electrically connected to the inner leads.
- 2. The method according to claim 1, wherein said charging step comprises screen printing of solder paste.
- 3. The method according to claim 1, wherein said charging step comprises dotting of solder paste.
- 4. The method according to claim 1, wherein said charging step comprises electroplating and vacuum depositing of solder paste.
- 5. The method according to claim 1, further comprising a step of attaching said semiconductor chip directly to surfaces of the plurality of inner leads of the lead frame using polyimide film.
- 6. The method of claim 1, wherein the packaging step comprises packaging the chip, lead frame and conductive media such that said plurality of holes are formed in a zig zag pattern.
Priority Claims (1)
Number |
Date |
Country |
Kind |
1994/10322 |
May 1994 |
KRX |
|
Parent Case Info
This application is a division of application Ser. No. 08/368,442 filed Jan. 4, 1995, now abandoned.
US Referenced Citations (7)
Foreign Referenced Citations (8)
Number |
Date |
Country |
59-161851 |
Sep 1984 |
JPX |
63-296252 |
Dec 1988 |
JPX |
63-300543 |
Dec 1988 |
JPX |
1-191455 |
Aug 1989 |
JPX |
3-105934 |
May 1991 |
JPX |
5-335433 |
Dec 1993 |
JPX |
6-209065 |
Jul 1994 |
JPX |
8904552 |
May 1989 |
WOX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
368442 |
Jan 1995 |
|