Hideaki Miyoshi

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Substrate transport apparatus and substrate transport path adjustme...
- Patent number 5,749,698
- Issue date May 12, 1998
- Kaijo Corporation
- Hideaki Miyoshi
- G02 - OPTICS
Information Patent Grant
Wire bonder and a bonding tool and bonding arm
- Patent number 5,699,951
- Issue date Dec 23, 1997
- Kaijo Corporation
- Hideaki Miyoshi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire guiding apparatus, wire guiding method and a wire bonder equip...
- Patent number 5,685,476
- Issue date Nov 11, 1997
- Kaijo Corporation
- Hideaki Miyoshi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate transport apparatus and substrate transport path adjustme...
- Patent number 5,634,765
- Issue date Jun 3, 1997
- Kaijo Corporation
- Hideaki Miyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate transport apparatus and substrate transport path adjustme...
- Patent number 5,628,605
- Issue date May 13, 1997
- Kaijo Corporation
- Hideaki Miyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate transport apparatus and substrate transport path adjustme...
- Patent number 5,562,382
- Issue date Oct 8, 1996
- Kaijo Corporation
- Hideaki Miyoshi
- H01 - BASIC ELECTRIC ELEMENTS