Hideaki Sasaki

Person

Hadano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Paste providing method, soldering method and apparatus and system t...
- Patent number 6,705,505
- Issue date Mar 16, 2004
- Hitachi, Ltd.
- Fumio Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin electronic circuit component and method and apparatus for prod...
- Patent number 6,551,449
- Issue date Apr 22, 2003
- Hitachi, Ltd.
- Keiji Fujikawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Paste providing method, soldering method and apparatus and system t...
- Patent number 6,533,162
- Issue date Mar 18, 2003
- Hitachi, Ltd.
- Fumio Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface reformation method of high polymer material
- Patent number 6,423,405
- Issue date Jul 23, 2002
- Hitachi, Ltd.
- Tsutomu Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grinding method, semiconductor device and method of manufacturing s...
- Patent number 6,406,357
- Issue date Jun 18, 2002
- Hitachi, Ltd.
- Shinichi Kazui
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Solder bump measuring method and apparatus
- Patent number 6,340,109
- Issue date Jan 22, 2002
- Hitachi, Ltd.
- Yutaka Hashimoto
- G01 - MEASURING TESTING
Information Patent Grant
High-frequency transmitter-receiver apparatus for such an applicati...
- Patent number 6,249,242
- Issue date Jun 19, 2001
- Hitachi, Ltd.
- Kenji Sekine
- G01 - MEASURING TESTING
Information Patent Grant
Thin electronic circuit component and method and apparatus for prod...
- Patent number 6,203,655
- Issue date Mar 20, 2001
- Hitachi, Ltd.
- Keiji Fujikawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solder bump measuring method and apparatus
- Patent number 6,196,441
- Issue date Mar 6, 2001
- Hitachi, Ltd.
- Yutaka Hashimoto
- G01 - MEASURING TESTING
Information Patent Grant
Paste providing method, soldering method and apparatus and system t...
- Patent number 6,193,144
- Issue date Feb 27, 2001
- Hitachi, Ltd.
- Fumio Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, IC card, and manufacturing method thereof
- Patent number 6,137,687
- Issue date Oct 24, 2000
- Hitachi, Ltd.
- Mitsugu Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for measuring the height of an object
- Patent number 6,069,701
- Issue date May 30, 2000
- Hitachi, Ltd.
- Yutaka Hashimoto
- G01 - MEASURING TESTING
Information Patent Grant
Laser assisted surface reformation method of high polymer material
- Patent number 6,017,424
- Issue date Jan 25, 2000
- Hitachi, Ltd.
- Tsutomu Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser cleavage cutting method and system
- Patent number 5,968,382
- Issue date Oct 19, 1999
- Hitachi, Ltd.
- Takashi Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump measuring method and apparatus
- Patent number 5,906,309
- Issue date May 25, 1999
- Hitachi, Ltd.
- Yutaka Hashimoto
- G01 - MEASURING TESTING
Information Patent Grant
Surface reformation method of high polymer material
- Patent number 5,801,350
- Issue date Sep 1, 1998
- Hitachi, Ltd.
- Tsutomu Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering method
- Patent number 5,709,338
- Issue date Jan 20, 1998
- Hitachi, Ltd.
- Mitugu Shirai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming conductive bumps
- Patent number 5,551,148
- Issue date Sep 3, 1996
- Hitachi, Ltd.
- Shinichi Kazui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Drilling apparatus of hard brittle material and method thereof
- Patent number 5,498,109
- Issue date Mar 12, 1996
- Hitachi, Ltd.
- Toshihiro Mine
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Balance adjustment method of end mill
- Patent number 5,433,655
- Issue date Jul 18, 1995
- Hitachi, Ltd.
- Takeji Shiokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grinding method and grinding machine
- Patent number 5,390,446
- Issue date Feb 21, 1995
- Hitachi, Ltd.
- Shinichi Kazui
- B24 - GRINDING POLISHING
Information Patent Grant
Printed circuit board assembling system
- Patent number 5,329,690
- Issue date Jul 19, 1994
- Hitachi, Ltd.
- Yoshihisa Tsuji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic circuit device and method of producing the same
- Patent number 5,276,289
- Issue date Jan 4, 1994
- Hitachi, Ltd.
- Ryohei Satoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding method and apparatus
- Patent number 5,251,805
- Issue date Oct 12, 1993
- Hitachi, Ltd.
- Mitsukiyo Tani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Computer-integrated manufacturing system and method
- Patent number 5,231,585
- Issue date Jul 27, 1993
- Hitachi Ltd.
- Mamoru Kobayashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic circuit apparatus comprising a structure for sealing an...
- Patent number 5,151,773
- Issue date Sep 29, 1992
- Hitachi, Ltd.
- Kiyoshi Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip-module
- Patent number 5,150,274
- Issue date Sep 22, 1992
- Hitachi, Ltd.
- Kenichi Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit device, method of connecting with solder and sol...
- Patent number 5,136,360
- Issue date Aug 4, 1992
- Hitachi, Ltd.
- Masahide Harada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with a uniform conductive layer formed by equ...
- Patent number 5,023,407
- Issue date Jun 11, 1991
- Hitachi, Ltd.
- Mitugu Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor tank
- Patent number 4,628,616
- Issue date Dec 16, 1986
- Hitachi, Ltd.
- Mitugu Shirai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Paste providing method, soldering method and apparatus and system t...
- Publication number 20030057264
- Publication date Mar 27, 2003
- Fumio Yoshikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE REFORMATION METHOD OF HIGH POLYMER MATERIAL
- Publication number 20020048664
- Publication date Apr 25, 2002
- TSUTOMU SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin electronic circuit component and method and apparatus for prod...
- Publication number 20010050138
- Publication date Dec 13, 2001
- Hitachi, Ltd.
- Keiji Fujikawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Solder bump measuring method and apparatus
- Publication number 20010000904
- Publication date May 10, 2001
- Hitachi, Ltd.
- Yutaka Hashimoto
- G01 - MEASURING TESTING
Information Patent Application
Paste providing method, soldering method and apparatus and system t...
- Publication number 20010000906
- Publication date May 10, 2001
- Fumio Yoshikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hideaki Sasaki

Person

Patents Grantslast 30 patents

Paste providing method, soldering method and apparatus and system t...

Thin electronic circuit component and method and apparatus for prod...

Paste providing method, soldering method and apparatus and system t...

Surface reformation method of high polymer material

Grinding method, semiconductor device and method of manufacturing s...

Solder bump measuring method and apparatus

High-frequency transmitter-receiver apparatus for such an applicati...

Thin electronic circuit component and method and apparatus for prod...

Solder bump measuring method and apparatus

Paste providing method, soldering method and apparatus and system t...

Printed circuit board, IC card, and manufacturing method thereof

Method and apparatus for measuring the height of an object

Laser assisted surface reformation method of high polymer material

Laser cleavage cutting method and system

Solder bump measuring method and apparatus

Surface reformation method of high polymer material

Soldering method

Method for forming conductive bumps

Drilling apparatus of hard brittle material and method thereof

Balance adjustment method of end mill

Grinding method and grinding machine

Printed circuit board assembling system

Electronic circuit device and method of producing the same

Wire bonding method and apparatus

Computer-integrated manufacturing system and method

Electronic circuit apparatus comprising a structure for sealing an...

Multi-chip-module

Electronic circuit device, method of connecting with solder and sol...

Printed circuit board with a uniform conductive layer formed by equ...

Vapor tank

Patents Applicationslast 30 patents

Paste providing method, soldering method and apparatus and system t...

SURFACE REFORMATION METHOD OF HIGH POLYMER MATERIAL

Thin electronic circuit component and method and apparatus for prod...

Solder bump measuring method and apparatus

Paste providing method, soldering method and apparatus and system t...