Hideharu AOYAMA

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Substrate transporter and substrate processing apparatus including...
- Patent number 12,237,194
- Issue date Feb 25, 2025
- EBARA CORPORATION
- Akihiro Yazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating support system, plating support device, and recording medium
- Patent number 11,773,504
- Issue date Oct 3, 2023
- Ebara Corporation
- Mitsuhiro Shamoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Plating apparatus and plating method
- Patent number 10,577,714
- Issue date Mar 3, 2020
- Ebara Corporation
- Yoshitaka Mukaiyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of controlling display of operation of semiconductor manufac...
- Patent number 10,446,422
- Issue date Oct 15, 2019
- Ebara Corporation
- Masayuki Fujiki
- G05 - CONTROLLING REGULATING

Patents Applicationslast 30 patents

Information Patent Application
TRANSFER APPARATUS, CLEANING MODULE, AND SUBSTRATE PROCESSING APPAR...
- Publication number 20240001407
- Publication date Jan 4, 2024
- EBARA CORPORATION
- Asagi MATSUGU
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE TRANSPORTER AND SUBSTRATE PROCESSING APPARATUS INCLUDING...
- Publication number 20220005716
- Publication date Jan 6, 2022
- EBARA CORPORATION
- Akihiro Yazawa
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
PLATING SUPPORT SYSTEM, PLATING SUPPORT DEVICE, AND RECORDING MEDIUM
- Publication number 20210222315
- Publication date Jul 22, 2021
- EBARA CORPORATION
- MITSUHIRO SHAMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF CONTROLLING DISPLAY OF OPERATION OF SEMICONDUCTOR MANUFAC...
- Publication number 20180286723
- Publication date Oct 4, 2018
- EBARA CORPORATION
- Masayuki FUJIKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20170298531
- Publication date Oct 19, 2017
- EBARA CORPORATION
- Yoshitaka MUKAIYAMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR