Hideharu Sakoda

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Fingerprint sensor apparatus and manufacturing method thereof
- Patent number 7,192,798
- Issue date Mar 20, 2007
- Fujitsu Limited
- Akira Okada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device having resin package and method of producing the same
- Patent number 7,144,754
- Issue date Dec 5, 2006
- Fujitsu Limited
- Yoshiyuki Yoneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 7,064,645
- Issue date Jun 20, 2006
- Fujitsu Limited
- Kazuhiko Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having resin package and method of producing the same
- Patent number 6,856,017
- Issue date Feb 15, 2005
- Fujitsu Limited
- Yoshiyuki Yoneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacture of wafer level semiconductor device with quality markin...
- Patent number 6,777,250
- Issue date Aug 17, 2004
- Fujitsu Limited
- Shinsuke Nakajyo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin for semiconductor wire
- Patent number 6,700,198
- Issue date Mar 2, 2004
- Shinko Electric Industries Co., Ltd.
- Hideki Toya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a built-in contact-type sensor and manu...
- Patent number 6,670,221
- Issue date Dec 30, 2003
- Fujitsu Limited
- Hideharu Sakoda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device, method for fabricating the semiconductor devi...
- Patent number 6,573,121
- Issue date Jun 3, 2003
- Fujitsu Limited
- Yoshiyuki Yoneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, method for fabricating the semiconductor devi...
- Patent number 6,376,921
- Issue date Apr 23, 2002
- Fujitsu Limited
- Yoshiyuki Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier substrate for producing semiconductor device
- Patent number 6,348,416
- Issue date Feb 19, 2002
- Shinko Electric Industries Co., Ltd.
- Hideki Toya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process of producing same
- Patent number 6,339,261
- Issue date Jan 15, 2002
- Shinko Electric Industries Co., Ltd.
- Masahiro Yonemochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having resin encapsulated package structure
- Patent number 6,271,583
- Issue date Aug 7, 2001
- Fujitsu Limited
- Hideharu Sakoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a lead portion with outer connecting te...
- Patent number 6,255,740
- Issue date Jul 3, 2001
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for fabricating semiconductor device
- Patent number 6,159,770
- Issue date Dec 12, 2000
- Fujitsu Limited
- Masafumi Tetaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having resin package with projections
- Patent number 6,072,239
- Issue date Jun 6, 2000
- Fujitsu Limited
- Yoshiyuki Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having resin encapsulated package structure
- Patent number 6,031,280
- Issue date Feb 29, 2000
- Fujitsu Limited
- Hideharu Sakoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a frame terminal
- Patent number 6,025,650
- Issue date Feb 15, 2000
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor device
- Patent number 5,930,603
- Issue date Jul 27, 1999
- Fujitsu Limited
- Kazuto Tsuji
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device having resin encapsulated package structure
- Patent number 5,808,357
- Issue date Sep 15, 1998
- Fujitsu Limited
- Hideharu Sakoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a packaged semiconductor having a divided...
- Patent number 5,804,468
- Issue date Sep 8, 1998
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device and method of producing the...
- Patent number 5,703,398
- Issue date Dec 30, 1997
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semicondutor device having a lead portion wit...
- Patent number 5,656,550
- Issue date Aug 12, 1997
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a plural stacked leadframe semiconductor...
- Patent number 5,569,625
- Issue date Oct 29, 1996
- Fujitsu Limited
- Yoshiyuki Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and lead frame therefore
- Patent number 5,497,032
- Issue date Mar 5, 1996
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of producing the same
- Patent number 5,399,804
- Issue date Mar 21, 1995
- Fujitsu Limited
- Yoshiyuki Yoneda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Manufacture of wafer level semiconductor device with quality markin...
- Publication number 20040235271
- Publication date Nov 25, 2004
- FUJITSU LIMITED
- Shinsuke Nakajyo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device having resin package and method of producing the same
- Publication number 20040219719
- Publication date Nov 4, 2004
- FUJITSU LIMITED
- Yoshiyuki Yoneda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device having a built-in contact-type sensor and manu...
- Publication number 20030178714
- Publication date Sep 25, 2003
- FUJITSU LIMITED
- Hideharu Sakoda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Fingerprint sensor apparatus and manufacturing method thereof
- Publication number 20030156743
- Publication date Aug 21, 2003
- FUJITSU LIMITED
- Akira Okada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic device
- Publication number 20030127704
- Publication date Jul 10, 2003
- Kazuhiko Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE HAVING RESIN PACKAGE AND METHOD OF PRODUCING THE SAME
- Publication number 20030006503
- Publication date Jan 9, 2003
- YOSHIYUKI YONEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, method for fabricating the semiconductor devi...
- Publication number 20020027265
- Publication date Mar 7, 2002
- FUJITSU LIMITED
- Yoshiyuki Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin for semiconductor wire
- Publication number 20020019133
- Publication date Feb 14, 2002
- Shinko Electric Industries Co., Ltd.
- Hideki Toya
- H01 - BASIC ELECTRIC ELEMENTS

Hideharu Sakoda

Person

Patents Grantslast 30 patents

Fingerprint sensor apparatus and manufacturing method thereof

Device having resin package and method of producing the same

Electronic device

Device having resin package and method of producing the same

Manufacture of wafer level semiconductor device with quality markin...

Resin for semiconductor wire

Semiconductor device having a built-in contact-type sensor and manu...

Semiconductor device, method for fabricating the semiconductor devi...

Semiconductor device, method for fabricating the semiconductor devi...

Carrier substrate for producing semiconductor device

Semiconductor device and process of producing same

Semiconductor device having resin encapsulated package structure

Semiconductor device having a lead portion with outer connecting te...

Method and apparatus for fabricating semiconductor device

Device having resin package with projections

Semiconductor device having resin encapsulated package structure

Semiconductor device including a frame terminal

Method for producing a semiconductor device

Semiconductor device having resin encapsulated package structure

Process for manufacturing a packaged semiconductor having a divided...

Semiconductor integrated circuit device and method of producing the...

Method of producing a semicondutor device having a lead portion wit...

Process for manufacturing a plural stacked leadframe semiconductor...

Semiconductor device and lead frame therefore

Semiconductor device and method of producing the same

Patents Applicationslast 30 patents

Manufacture of wafer level semiconductor device with quality markin...

Device having resin package and method of producing the same

Semiconductor device having a built-in contact-type sensor and manu...

Fingerprint sensor apparatus and manufacturing method thereof

Electronic device

DEVICE HAVING RESIN PACKAGE AND METHOD OF PRODUCING THE SAME

Semiconductor device, method for fabricating the semiconductor devi...

Resin for semiconductor wire