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Hideki Kotake
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Tokyo, JP
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last 30 patents
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Patent Grant
Structure and method of making interconnect element having metal tr...
Patent number
8,736,064
Issue date
May 27, 2014
Invensas Corporation
Hideki Kotake
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Structure And Method Of Making Interconnect Element Having Metal Tr...
Publication number
20110057324
Publication date
Mar 10, 2011
Tessera Interconnect Materials, Inc.
Hideki Kotake
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Structure and method of making interconnect element having metal tr...
Publication number
20080169568
Publication date
Jul 17, 2008
Tessera Interconnect Materials, Inc.
Hideki Kotake
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Structure and method of making interconnect element having metal tr...
Publication number
20080136041
Publication date
Jun 12, 2008
Tessera Interconnect Materials, Inc.
Hideki Kotake
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of manufacturing a multi-layer wiring board using a metal me...
Publication number
20080128288
Publication date
Jun 5, 2008
Tessera Interconnect Materials, Inc.
Yukio Hashimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR