Hidenori Miyakawa

Person

Moriguchi-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Heat-insulation material, heat-insulation structure using same, and...
- Patent number 11,293,583
- Issue date Apr 5, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daido Kohmyohji
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Heat-dissipating resin composition, and component and electronic de...
- Patent number 10,407,604
- Issue date Sep 10, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Honami Nawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronic module and production method therefor
- Patent number 9,072,204
- Issue date Jun 30, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Ryo Kuwabara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composition, method of manufacturing the same a...
- Patent number 8,697,237
- Issue date Apr 15, 2014
- Panasonic Corporation
- Hirohisa Hino
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding material, bonded portion and circuit board
- Patent number 8,679,635
- Issue date Mar 25, 2014
- Panasonic Corporation
- Atsushi Yamaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive paste, and electrical and electronic device...
- Patent number 8,540,903
- Issue date Sep 24, 2013
- Panasonic Corporation
- Takayuki Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount adhesive, mounting structure including the same, and...
- Patent number 8,481,629
- Issue date Jul 9, 2013
- Panasonic Corporation
- Ryo Kuwabara
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Package structure
- Patent number 8,482,931
- Issue date Jul 9, 2013
- Panasonic Corporation
- Ryo Kuwabara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device mounted structure and its manufacturing method
- Patent number 8,450,859
- Issue date May 28, 2013
- Panasonic Corporation
- Naomichi Ohashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounted structure
- Patent number 8,410,377
- Issue date Apr 2, 2013
- Panasonic Corporation
- Atsushi Yamaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting structure for semiconductor element with underfill resin
- Patent number 8,378,472
- Issue date Feb 19, 2013
- Panasonic Corporation
- Koso Matsuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure with electronic component mounted therein and method for...
- Patent number 8,345,444
- Issue date Jan 1, 2013
- Panasonic Corporation
- Shigeaki Sakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component packaging structure having two-layer moisture-...
- Patent number 8,344,268
- Issue date Jan 1, 2013
- Panasonic Corporation
- Hideyuki Tsujimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding material, bonded portion and circuit board
- Patent number 8,293,370
- Issue date Oct 23, 2012
- Panasonic Corporation
- Atsushi Yamaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sealing material and mounting method using the sealing material
- Patent number 8,217,275
- Issue date Jul 10, 2012
- Panasonic Corporation
- Atsushi Yamaguchi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing circuit board on which electronic componen...
- Patent number 8,205,327
- Issue date Jun 26, 2012
- Panasonic Corporation
- Hidenori Miyakawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste and mounting structure using the same
- Patent number 8,182,923
- Issue date May 22, 2012
- Panasonic Corporation
- Naomichi Ohashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounted structural body and method of manufacturing the same
- Patent number 8,179,686
- Issue date May 15, 2012
- Panasonic Corporation
- Shigeaki Sakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting structure
- Patent number 8,138,426
- Issue date Mar 20, 2012
- Panasonic Corporation
- Koso Matsuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroconductive bonding material and electric/electronic device u...
- Patent number 8,012,379
- Issue date Sep 6, 2011
- Panasonic Corporation
- Hidenori Miyakawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronic circuit device and method for manufacturing same
- Patent number 7,935,892
- Issue date May 3, 2011
- Panasonic Corporation
- Kazuhiro Nishikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electrically conductive adhesive
- Patent number 7,785,500
- Issue date Aug 31, 2010
- Panasonic Corporation
- Atsushi Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package manufacturing method and semiconductor...
- Patent number 7,090,482
- Issue date Aug 15, 2006
- Matsushita Electric Industrial Co., Ltd.
- Norihito Tsukahara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package of semiconductor device and method of manufacture thereof
- Patent number 6,780,668
- Issue date Aug 24, 2004
- Matsushita Electric Industrial Co., Ltd.
- Norihito Tsukahara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing article having electronic circuit
- Patent number 6,708,401
- Issue date Mar 23, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hidenori Miyakawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HEAT-INSULATION MATERIAL, HEAT-INSULATION STRUCTURE USING SAME, AND...
- Publication number 20180245731
- Publication date Aug 30, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- DAIDO KOHMYOHJI
- B32 - LAYERED PRODUCTS
Information Patent Application
HEAT-DISSIPATING RESIN COMPOSITION, AND COMPONENT AND ELECTRONIC DE...
- Publication number 20150327393
- Publication date Nov 12, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Honami NAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SECONDARY BATTERY UNIT
- Publication number 20130344369
- Publication date Dec 26, 2013
- PANASONIC CORPORATION
- Hidenori Miyakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION, METHOD OF MANUFACTURING THE SAME A...
- Publication number 20130237645
- Publication date Sep 12, 2013
- Panasonic Corporation
- Hirohisa Hino
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING MATERIAL, BONDED PORTION AND CIRCUIT BOARD
- Publication number 20130037314
- Publication date Feb 14, 2013
- Atsushi Yamaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MODULE AND PRODUCTION METHOD THEREFOR
- Publication number 20120120613
- Publication date May 17, 2012
- PANASONIC CORPORATION
- Ryo Kuwabara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE WITH ELECTRONIC COMPONENT MOUNTED THEREIN AND METHOD FOR...
- Publication number 20110110050
- Publication date May 12, 2011
- Shigeaki Sakatani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD
- Publication number 20110095423
- Publication date Apr 28, 2011
- Naomichi Ohashi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRICALLY CONDUCTIVE PASTE, AND ELECTRICAL AND ELECTRONIC DEVICE...
- Publication number 20110049439
- Publication date Mar 3, 2011
- Takayuki Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROCONDUCTIVE BONDING MATERIAL AND ELECTRIC/ELECTRONIC DEVICE U...
- Publication number 20100316794
- Publication date Dec 16, 2010
- Hidenori Miyakawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MOUNTING STRUCTURE
- Publication number 20100224398
- Publication date Sep 9, 2010
- PANASONIC CORPORATION
- Koso Matsuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL, BONDED PORTION AND CIRCUIT BOARD
- Publication number 20100159257
- Publication date Jun 24, 2010
- Atsushi Yamaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20100159719
- Publication date Jun 24, 2010
- Ryo KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermosetting Resin Composition, Method of Manufacturing the Same a...
- Publication number 20100147567
- Publication date Jun 17, 2010
- PANASONIC ELECTRIC WORKS CO., LTD.
- Hirohisa Hino
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEALING MATERIAL AND MOUNTING METHOD USING THE SEALING MATERIAL
- Publication number 20100084174
- Publication date Apr 8, 2010
- Atsushi Yamaguchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEALING MATERIAL AND MOUNTING METHOD USING THE SEALING MATERIAL
- Publication number 20100006329
- Publication date Jan 14, 2010
- PANASONIC CORPORATION
- Kousou Matsuno
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ELECTRONIC COMPONENT PACKAGING STRUCTURE HAVING TWO-LAYER MOISTURE-...
- Publication number 20100002401
- Publication date Jan 7, 2010
- Hideyuki TSUJIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE MOUNT ADHESIVE, MOUNTING STRUCTURE INCLUDING THE SAME, AND...
- Publication number 20090277678
- Publication date Nov 12, 2009
- Ryo KUWABARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CONDUCTIVE PASTE AND MOUNTING STRUCTURE USING THE SAME
- Publication number 20090269598
- Publication date Oct 29, 2009
- Naomichi OHASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT CURABLE RESIN COMPOSITION, AND MOUNTING METHOD AND REPARING PR...
- Publication number 20090236036
- Publication date Sep 24, 2009
- Hidenori Miyakawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20090133900
- Publication date May 28, 2009
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Kazuhiro Nishikawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MOUNTED STRUCTURAL BODY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090120675
- Publication date May 14, 2009
- Shigeaki SAKATANI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE
- Publication number 20090114885
- Publication date May 7, 2009
- Atsushi Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTED STRUCTURE
- Publication number 20090116205
- Publication date May 7, 2009
- Panasonic Corporation
- Atsushi Yamaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING STRUCTURE
- Publication number 20090116203
- Publication date May 7, 2009
- Koso MATSUNO
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD ON WHICH ELECTRONIC COMPONEN...
- Publication number 20090070994
- Publication date Mar 19, 2009
- Hidenori Miyakawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electroconductive Bonding Material and Electric/Electronic Device U...
- Publication number 20090032293
- Publication date Feb 5, 2009
- Hidenori Miyakawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor device package manufacturing method and semiconductor...
- Publication number 20040130024
- Publication date Jul 8, 2004
- Norihito Tsukahara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Article with electronic circuit formed and method of manufacturing...
- Publication number 20040078965
- Publication date Apr 29, 2004
- Hidenori Miyakawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive, process for the preparation thereof, and process for moun...
- Publication number 20020122915
- Publication date Sep 5, 2002
- Hidenori Miyakawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Hidenori Miyakawa

Person

Patents Grantslast 30 patents

Heat-insulation material, heat-insulation structure using same, and...

Heat-dissipating resin composition, and component and electronic de...

Electronic module and production method therefor

Thermosetting resin composition, method of manufacturing the same a...

Bonding material, bonded portion and circuit board

Electrically conductive paste, and electrical and electronic device...

Surface mount adhesive, mounting structure including the same, and...

Package structure

Semiconductor device mounted structure and its manufacturing method

Mounted structure

Mounting structure for semiconductor element with underfill resin

Structure with electronic component mounted therein and method for...

Electronic component packaging structure having two-layer moisture-...

Bonding material, bonded portion and circuit board

Sealing material and mounting method using the sealing material

Method for manufacturing circuit board on which electronic componen...

Conductive paste and mounting structure using the same

Mounted structural body and method of manufacturing the same

Mounting structure

Electroconductive bonding material and electric/electronic device u...

Electronic circuit device and method for manufacturing same

Electrically conductive adhesive

Semiconductor device package manufacturing method and semiconductor...

Package of semiconductor device and method of manufacture thereof

Method of manufacturing article having electronic circuit

Patents Applicationslast 30 patents

HEAT-INSULATION MATERIAL, HEAT-INSULATION STRUCTURE USING SAME, AND...

HEAT-DISSIPATING RESIN COMPOSITION, AND COMPONENT AND ELECTRONIC DE...

SECONDARY BATTERY UNIT

THERMOSETTING RESIN COMPOSITION, METHOD OF MANUFACTURING THE SAME A...

BONDING MATERIAL, BONDED PORTION AND CIRCUIT BOARD

ELECTRONIC MODULE AND PRODUCTION METHOD THEREFOR

STRUCTURE WITH ELECTRONIC COMPONENT MOUNTED THEREIN AND METHOD FOR...

SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD

ELECTRICALLY CONDUCTIVE PASTE, AND ELECTRICAL AND ELECTRONIC DEVICE...

ELECTROCONDUCTIVE BONDING MATERIAL AND ELECTRIC/ELECTRONIC DEVICE U...

MOUNTING STRUCTURE

BONDING MATERIAL, BONDED PORTION AND CIRCUIT BOARD

PACKAGE STRUCTURE

Thermosetting Resin Composition, Method of Manufacturing the Same a...

SEALING MATERIAL AND MOUNTING METHOD USING THE SEALING MATERIAL

SEALING MATERIAL AND MOUNTING METHOD USING THE SEALING MATERIAL

ELECTRONIC COMPONENT PACKAGING STRUCTURE HAVING TWO-LAYER MOISTURE-...

SURFACE MOUNT ADHESIVE, MOUNTING STRUCTURE INCLUDING THE SAME, AND...

CONDUCTIVE PASTE AND MOUNTING STRUCTURE USING THE SAME

HEAT CURABLE RESIN COMPOSITION, AND MOUNTING METHOD AND REPARING PR...

ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING SAME

MOUNTED STRUCTURAL BODY AND METHOD OF MANUFACTURING THE SAME

ELECTRICALLY CONDUCTIVE ADHESIVE

MOUNTED STRUCTURE

MOUNTING STRUCTURE

METHOD FOR MANUFACTURING CIRCUIT BOARD ON WHICH ELECTRONIC COMPONEN...

Electroconductive Bonding Material and Electric/Electronic Device U...

Semiconductor device package manufacturing method and semiconductor...

Article with electronic circuit formed and method of manufacturing...

Adhesive, process for the preparation thereof, and process for moun...