Claims
- 1. A semiconductor device-mounted component manufacturing apparatus for performing mounting of a semiconductor device on a circuit pattern, which is electrically connected to the semiconductor device while being brought in contact with a bump of the semiconductor device and is formed of a conductive paste on a pattern forming surface of a base material, the apparatus comprising:
a semiconductor device pressurizing device for inserting the semiconductor device from one surface of the base material and exposing an end surface of the bump at the other surface of the base material with the bump of the semiconductor device put in an exposed state or an unexposed state proximately to the pattern forming surface; and a contact area increasing device for forming a contact area increasing portion for increasing a contact area of the circuit pattern with the bump that is exposed or located proximately to the pattern forming surface.
- 2. A semiconductor device-mounted component manufacturing apparatus as claimed in claim 1, wherein the contact area increasing device comprises:
an extension portion-forming member for forming the contact area increasing portion by coming in contact with the bump or in contact with the pattern forming surface located in the vicinity of the bump; and an extension portion-forming member pressurizing device for pressurizing the extension portion-forming member against the bump or the pattern forming surface located in the vicinity of the bump.
- 3. A semiconductor device-mounted component manufacturing apparatus as claimed in claim 2, wherein
the extension portion-forming member has a cylindrical shape and forms a projecting portion that serves as the contact area increasing portion on the bump formed by a pressurizing operation for performing pressurization with the extension portion-forming member pressurizing device.
- 4. A semiconductor device-mounted component manufacturing apparatus as claimed in claim 2, wherein the extension portion-forming member has at its tip a rugged portion and forms a rugged portion as the contact area increasing portion on the bump formed by a pressurizing operation for performing pressurization with the extension portion-forming member pressurizing device.
- 5. A semiconductor device-mounted component manufacturing apparatus as claimed in claim 2, wherein the extension portion-forming member has a cylindrical shape and forms a contact area increasing groove in the vicinity of the bump by pressurizing the pattern forming surface located in the vicinity of the bump by a pressurizing operation for performing pressurization with the extension portion-forming member pressurizing device, thus exposing the bump from the base material.
- 6. A semiconductor device-mounted finished-product manufacturing apparatus comprising:
the semiconductor device-mounted component manufacturing apparatus claimed in claim 1; and an encapsulating device for encapsulating the semiconductor device-mounted component manufactured by the semiconductor device-mounted component manufacturing apparatus.
- 7. A semiconductor device-mounted finished-product comprising the semiconductor device-mounted component manufactured by the semiconductor device-mounted component manufacturing apparatus claimed in claim 1.
- 8. A semiconductor device-mounted finished-product manufactured by the semiconductor device-mounted finished-product manufacturing apparatus claimed in claim 6.
- 9. A semiconductor device-mounted finished-product claimed in claim 7, wherein the semiconductor device-mounted finished-product is a noncontact IC card.
- 10. A semiconductor device-mounted finished-product claimed in claim 8, wherein the semiconductor device-mounted finished-product is a noncontact IC card.
Priority Claims (2)
Number |
Date |
Country |
Kind |
11-202847 |
Jul 1999 |
JP |
|
2000-63686 |
Mar 2000 |
JP |
|
Parent Case Info
[0001] This is a Continuation Application of U.S. application Ser. No. 10/031,00, filed Jan. 16, 2002, which is the National Stage of International Application No. PCT/JP00/04699, Jul. 13, 2000.
Continuations (1)
|
Number |
Date |
Country |
Parent |
10031000 |
Jan 2002 |
US |
Child |
10736568 |
Dec 2003 |
US |