Hideo Kotani

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Hyogo, JP

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Patents Grantslast 30 patents

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Method of manufacturing semiconductor device including interlaying...
- Patent number 5,250,468
- Issue date Oct 5, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Masazumi Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including interlayer insulating film
- Patent number 5,132,774
- Issue date Jul 21, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Masazumi Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing interconnection structure in semiconductor...
- Patent number 4,977,105
- Issue date Dec 11, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Tatsuo Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure in semiconductor device and manufacturing...
- Patent number 4,872,050
- Issue date Oct 3, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Tatsuo Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 4,411,929
- Issue date Oct 25, 1983
- Mitsubishi Denki Kabushiki Kaisha LSI Development Laboratory
- Shinichi Sato
- H01 - BASIC ELECTRIC ELEMENTS