Hideo Kudo

Person

Nishishirakawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Slicing method and wire saw apparatus
- Patent number 8,567,384
- Issue date Oct 29, 2013
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Semiconductor substrate and semiconductor device
- Patent number 8,492,879
- Issue date Jul 23, 2013
- National University Corporation Tohoku University
- Tadahiro Ohmi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing apparatus
- Patent number 8,454,410
- Issue date Jun 4, 2013
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B24 - GRINDING POLISHING
Information Patent Grant
Multi-color molding article, multicolor molding method and substrat...
- Patent number 8,318,275
- Issue date Nov 27, 2012
- Shin-Etsu Handotai Co., Ltd.
- Hideo Kudo
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Carrier for double-side polishing apparatus, double-side polishing...
- Patent number 8,118,646
- Issue date Feb 21, 2012
- Shin-Etsu Handotai Co., Ltd.
- Kazuya Sato
- B24 - GRINDING POLISHING
Information Patent Grant
Precision substrate storage container and retaining member therefor
- Patent number 7,017,749
- Issue date Mar 28, 2006
- Shin-Etsu Polymer Co., Ltd.
- Toshitsugu Yajima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Gaskets for substrate containers
- Patent number 6,951,340
- Issue date Oct 4, 2005
- Shin-Etsu Polymer Co., Ltd.
- Tsutomu Suzuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor wafer processing method and semiconductor wafers prod...
- Patent number 6,432,837
- Issue date Aug 13, 2002
- Shin-Etsu Handotai Co., Ltd.
- Takashi Nihonmatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing method for wafer and holding plate
- Patent number 6,402,594
- Issue date Jun 11, 2002
- Shin-Etsu Handotai Co., Ltd.
- Daisuke Kobayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer processing method and semiconductor wafers prod...
- Patent number 6,346,485
- Issue date Feb 12, 2002
- Shin-Etsu Handotai Co., Ltd.
- Takashi Nihonmatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafers processing method and semiconductor wafers pro...
- Patent number 6,239,039
- Issue date May 29, 2001
- Shin-Etsu Handotai Co., Ltd.
- Takashi Nihonmatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of purifying alkaline solution and method of etching semicon...
- Patent number 6,110,839
- Issue date Aug 29, 2000
- Shin-Etsu Handotai Co., Ltd.
- Masami Nakano
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Method and apparatus for surface-grinding of workpiece
- Patent number 6,077,149
- Issue date Jun 20, 2000
- Shin-Etsu Handotai Co., Ltd.
- Sadayuki Ohkuni
- B24 - GRINDING POLISHING
Information Patent Grant
Surface grinding device and method of surface grinding a thin-plate...
- Patent number 6,050,880
- Issue date Apr 18, 2000
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Grant
Method of polishing semiconductor wafers
- Patent number 5,951,374
- Issue date Sep 14, 1999
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing semiconductor wafers
- Patent number 5,942,445
- Issue date Aug 24, 1999
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- C30 - CRYSTAL GROWTH
Information Patent Grant
Apparatus and method for double-sided polishing semiconductor wafers
- Patent number 5,914,053
- Issue date Jun 22, 1999
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing agent used for polishing semiconductor wafers and polishi...
- Patent number 5,891,353
- Issue date Apr 6, 1999
- Shin-Etsu Handotai Co, Ltd.
- Hisashi Masumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing agent used for polishing semiconductor wafers and polishi...
- Patent number 5,866,226
- Issue date Feb 2, 1999
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor mirror wafers
- Patent number 5,827,779
- Issue date Oct 27, 1998
- Shin-Etsu Handotai Co. Ltd.
- Hisashi Masumura
- C30 - CRYSTAL GROWTH
Information Patent Grant
Polishing pad used for polishing silicon wafers and polishing metho...
- Patent number 5,827,395
- Issue date Oct 27, 1998
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing semiconductor mirror wafers
- Patent number 5,821,167
- Issue date Oct 13, 1998
- Shin-Etsu Handotai Co., Ltd.
- Teruaki Fukami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor wafers
- Patent number 5,800,725
- Issue date Sep 1, 1998
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of and apparatus for determining residual damage to wafer edges
- Patent number 5,790,252
- Issue date Aug 4, 1998
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for inducing damage for gettering to single crystal silicon...
- Patent number 5,759,087
- Issue date Jun 2, 1998
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Grant
Epitaxial wafer
- Patent number 5,705,423
- Issue date Jan 6, 1998
- Shin-Etsu Handotai Co., Ltd.
- Atsuto Sakata
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for production of silicon wafer and apparatus therefor
- Patent number 5,679,212
- Issue date Oct 21, 1997
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Grant
Device for handling wafers
- Patent number 5,595,412
- Issue date Jan 21, 1997
- Shin-Etsu Handotai Co., Ltd.
- Hideo Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer holder
- Patent number 5,555,634
- Issue date Sep 17, 1996
- Shin-Etsu Handotai Co., Ltd.
- Isao Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for handling or processing semiconductor wafers
- Patent number 5,547,515
- Issue date Aug 20, 1996
- Shin-Etsu Handotai Co., Ltd.
- Hideo Kudo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS, DOUBLE-SIDE POLISHING...
- Publication number 20110124271
- Publication date May 26, 2011
- Shin-Etsu Handotai Co., Ltd.
- Kazuya Sato
- B24 - GRINDING POLISHING
Information Patent Application
MULTI-COLOR MOLDING ARTICLE, MULTICOLOR MOLDING METHOD AND SUBSTRAT...
- Publication number 20110064896
- Publication date Mar 17, 2011
- Shin-Etsu Handotai Co., Ltd.
- Hideo Kudo
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20100213516
- Publication date Aug 26, 2010
- National University Corporation Tohoku University
- Tadahiro Ohmi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING APPARATUS
- Publication number 20100144249
- Publication date Jun 10, 2010
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B24 - GRINDING POLISHING
Information Patent Application
SLICING METHOD AND WIRE SAW APPARATUS
- Publication number 20100089377
- Publication date Apr 15, 2010
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Semiconductor Wafer Fabricating Method and Semiconductor Wafer Mirr...
- Publication number 20080113510
- Publication date May 15, 2008
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Application
Gaskets for substrate containers and substrate container equipped w...
- Publication number 20040041355
- Publication date Mar 4, 2004
- Tsutomu Suzuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Precision substrate storage container and retaining member therefor
- Publication number 20030221985
- Publication date Dec 4, 2003
- Toshitsugu Yajima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Semiconductor wafer processing method and semiconductor wafers prod...
- Publication number 20010008807
- Publication date Jul 19, 2001
- SHIN-ETSU HANDOTAI CO., LTD.
- Takashi Nihonmatsu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Slicing method and wire saw apparatus

Semiconductor substrate and semiconductor device

Polishing apparatus

Multi-color molding article, multicolor molding method and substrat...

Carrier for double-side polishing apparatus, double-side polishing...

Precision substrate storage container and retaining member therefor

Gaskets for substrate containers

Semiconductor wafer processing method and semiconductor wafers prod...

Polishing method for wafer and holding plate

Semiconductor wafer processing method and semiconductor wafers prod...

Semiconductor wafers processing method and semiconductor wafers pro...

Method of purifying alkaline solution and method of etching semicon...

Method and apparatus for surface-grinding of workpiece

Surface grinding device and method of surface grinding a thin-plate...

Method of polishing semiconductor wafers

Method of manufacturing semiconductor wafers

Apparatus and method for double-sided polishing semiconductor wafers

Polishing agent used for polishing semiconductor wafers and polishi...

Polishing agent used for polishing semiconductor wafers and polishi...

Method of manufacturing semiconductor mirror wafers

Polishing pad used for polishing silicon wafers and polishing metho...

Method of manufacturing semiconductor mirror wafers

Method of manufacturing semiconductor wafers

Method of and apparatus for determining residual damage to wafer edges

Method for inducing damage for gettering to single crystal silicon...

Epitaxial wafer

Method for production of silicon wafer and apparatus therefor

Device for handling wafers

Wafer holder

Method for handling or processing semiconductor wafers

Patents Applicationslast 30 patents

CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS, DOUBLE-SIDE POLISHING...

MULTI-COLOR MOLDING ARTICLE, MULTICOLOR MOLDING METHOD AND SUBSTRAT...

SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR DEVICE

POLISHING APPARATUS

SLICING METHOD AND WIRE SAW APPARATUS

Semiconductor Wafer Fabricating Method and Semiconductor Wafer Mirr...

Gaskets for substrate containers and substrate container equipped w...

Precision substrate storage container and retaining member therefor

Semiconductor wafer processing method and semiconductor wafers prod...