Hidetoshi Kusano

Person

Oita, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,334,591
- Issue date Dec 18, 2012
- Sony Corporation
- Hidetoshi Kusano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a device incorporated substrate and method...
- Patent number 8,146,243
- Issue date Apr 3, 2012
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 7,880,317
- Issue date Feb 1, 2011
- Sony Corporation
- Tomoshi Ohde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a device-incorporated substrate
- Patent number 7,874,066
- Issue date Jan 25, 2011
- Sony Corporation
- Asami Hiroshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having high cooling efficiency and method for...
- Patent number 7,679,184
- Issue date Mar 16, 2010
- Sony Computer Entertainment Inc.
- Hidetoshi Kusano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multilayer wiring substrate using temporary...
- Patent number 7,421,777
- Issue date Sep 9, 2008
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer wiring substrate, and multilayer...
- Patent number 7,420,127
- Issue date Sep 2, 2008
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer wiring substrate, and multilayer...
- Patent number 7,288,724
- Issue date Oct 30, 2007
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a high-frequency coil device
- Patent number 7,216,419
- Issue date May 15, 2007
- Sony Corporation
- Hidetoshi Kusano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture method of a flexible multilayer wiring board
- Patent number 7,185,429
- Issue date Mar 6, 2007
- Sony Corporation
- Hidetoshi Kusano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible multilayer wiring board and manufacture method thereof
- Patent number 7,115,818
- Issue date Oct 3, 2006
- Sony Corporation
- Hidetoshi Kusano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency coil device and method of manufacturing the same
- Patent number 6,940,385
- Issue date Sep 6, 2005
- Sony Corporation
- Hidetoshi Kusano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic parts mounting board and production method thereof
- Patent number 6,660,941
- Issue date Dec 9, 2003
- Sony Corporation
- Sakan Iwashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method of wiring substrate for mounting semiconductor e...
- Patent number 6,617,236
- Issue date Sep 9, 2003
- Sony Corporation
- Kenji Oosawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame, manufacturing method of a lead frame, semiconductor dev...
- Patent number 6,563,202
- Issue date May 13, 2003
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and production method thereof, and semiconductor device...
- Patent number 6,465,279
- Issue date Oct 15, 2002
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having an underplate metal layer
- Patent number 6,403,402
- Issue date Jun 11, 2002
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of wiring substrate for mounting semiconductor e...
- Patent number 6,372,620
- Issue date Apr 16, 2002
- Sony Corporation
- Kenji Oosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor chip having an underplate metal...
- Patent number 6,369,441
- Issue date Apr 9, 2002
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having an underplate metal layer
- Patent number 6,351,025
- Issue date Feb 26, 2002
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and production method thereof, and semiconductor device...
- Patent number 6,340,840
- Issue date Jan 22, 2002
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, the manufacturing method, semiconductor device and the...
- Patent number 6,140,153
- Issue date Oct 31, 2000
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, manufacturing method of a lead frame, semiconductor dev...
- Patent number 6,051,450
- Issue date Apr 18, 2000
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20100096747
- Publication date Apr 22, 2010
- SONY CORPORATION
- Hidetoshi Kusano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20090302450
- Publication date Dec 10, 2009
- SONY CORPORATION
- Tomoshi Ohde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE-INCORPORATED SUBSTRATE AND METHOD OF MANUFACTURING THEREOF A...
- Publication number 20090217518
- Publication date Sep 3, 2009
- SONY CORPORATION
- Asami Hiroshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20080185712
- Publication date Aug 7, 2008
- SONY CORPORATION
- Fujio Kanayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Manufacturing the Same
- Publication number 20070290310
- Publication date Dec 20, 2007
- SONY CORPORATION
- Hidetoshi KUSANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing multilayer wiring substrate, and multilayer...
- Publication number 20070293038
- Publication date Dec 20, 2007
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device having High Cooling Efficiency and Method for...
- Publication number 20070278667
- Publication date Dec 6, 2007
- SONY CORPORATION
- Hidetoshi KUSANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing multilayer wiring substrate, and multilayer...
- Publication number 20070102191
- Publication date May 10, 2007
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing board with built-in device and board with...
- Publication number 20060124345
- Publication date Jun 15, 2006
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible multilayer wiring board and manufacture method thereof
- Publication number 20060124351
- Publication date Jun 15, 2006
- SONY CORPORATION
- Hidetoshi Kusano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High-frequency coil device and method of manufacturing the same
- Publication number 20060001519
- Publication date Jan 5, 2006
- Sony Corporation
- Hidetoshi Kusano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing multilayer wiring substrate, and multilayer...
- Publication number 20050142852
- Publication date Jun 30, 2005
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High-frequency coil device and method of manufacturing the same
- Publication number 20040066266
- Publication date Apr 8, 2004
- Hidetoshi Kusano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing multilayer wiring substrate, and multilayer...
- Publication number 20040003494
- Publication date Jan 8, 2004
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible multilayer wiring board and manufacture method thereof
- Publication number 20030161129
- Publication date Aug 28, 2003
- SONY CORPORATION
- Hidetoshi Kusano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic parts mounting board and production method thereof
- Publication number 20020112879
- Publication date Aug 22, 2002
- Sony Corporation
- Sakan Iwashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication method of wiring substrate for mounting semiconductor e...
- Publication number 20020086514
- Publication date Jul 4, 2002
- Kenji Oosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame and production method thereof, and semiconductor device...
- Publication number 20020031862
- Publication date Mar 14, 2002
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-frequency coil device and method of manufacturing the same
- Publication number 20020030576
- Publication date Mar 14, 2002
- Sony Corporation
- Hidetoshi Kusano
- H01 - BASIC ELECTRIC ELEMENTS

Hidetoshi Kusano

Person

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing the same

Method of manufacturing a device incorporated substrate and method...

Semiconductor device and method of manufacturing semiconductor device

Method of manufacturing a device-incorporated substrate

Semiconductor device having high cooling efficiency and method for...

Method of manufacturing multilayer wiring substrate using temporary...

Method of manufacturing multilayer wiring substrate, and multilayer...

Method of manufacturing multilayer wiring substrate, and multilayer...

Method of manufacturing a high-frequency coil device

Manufacture method of a flexible multilayer wiring board

Flexible multilayer wiring board and manufacture method thereof

High-frequency coil device and method of manufacturing the same

Electronic parts mounting board and production method thereof

Fabrication method of wiring substrate for mounting semiconductor e...

Lead frame, manufacturing method of a lead frame, semiconductor dev...

Lead frame and production method thereof, and semiconductor device...

Semiconductor chip having an underplate metal layer

Fabrication method of wiring substrate for mounting semiconductor e...

Method of producing a semiconductor chip having an underplate metal...

Semiconductor chip having an underplate metal layer

Lead frame and production method thereof, and semiconductor device...

Lead frame, the manufacturing method, semiconductor device and the...

Lead frame, manufacturing method of a lead frame, semiconductor dev...

Patents Applicationslast 30 patents

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

DEVICE-INCORPORATED SUBSTRATE AND METHOD OF MANUFACTURING THEREOF A...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor Device and Method for Manufacturing the Same

Method of manufacturing multilayer wiring substrate, and multilayer...

Semiconductor Device having High Cooling Efficiency and Method for...

Method of manufacturing multilayer wiring substrate, and multilayer...

Method for manufacturing board with built-in device and board with...

Flexible multilayer wiring board and manufacture method thereof

High-frequency coil device and method of manufacturing the same

Method of manufacturing multilayer wiring substrate, and multilayer...

High-frequency coil device and method of manufacturing the same

Method of manufacturing multilayer wiring substrate, and multilayer...

Flexible multilayer wiring board and manufacture method thereof

Electronic parts mounting board and production method thereof

Fabrication method of wiring substrate for mounting semiconductor e...

Lead frame and production method thereof, and semiconductor device...

High-frequency coil device and method of manufacturing the same