Hideyasu Hashiba

Follow

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Cover tape for packaging semiconductor device and package for semic...
- Patent number 8,033,397
- Issue date Oct 11, 2011
- Fujitsu Semiconductor Limited
- Keiichi Sasamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tray for semiconductor device and semiconductor device
- Patent number 7,163,104
- Issue date Jan 16, 2007
- Fujitsu Limited
- Misao Inoke
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT ACCOMMODATING DEVICE
- Publication number 20090236261
- Publication date Sep 24, 2009
- Fujitsu Microelectronics Limited
- Yuuji Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cover tape for packaging semiconductor device and package for semic...
- Publication number 20070216000
- Publication date Sep 20, 2007
- FUJITSU LIMITED
- Keiichi Sasamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device receiving apparatus and method of loading/unloadi...
- Publication number 20070146926
- Publication date Jun 28, 2007
- FUJITSU LIMITED
- Hideyasu Hashiba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tray for semiconductor device and semiconductor device
- Publication number 20050285282
- Publication date Dec 29, 2005
- FUJITSU LIMITED
- Misao Inoke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCOMMODATION CONTAINER, ACCOMMODATION CONTAINER FOR ACCOMMODATING...
- Publication number 20010027933
- Publication date Oct 11, 2001
- KEIICHI SASAMURA
- H01 - BASIC ELECTRIC ELEMENTS