Cover tape for packaging semiconductor device and package for semiconductor device

Abstract

The purpose of the present invention is to provide a cover tape for packaging semiconductor device which protects the outer shape of the semiconductor device, and is capable of improving the mounting speed of the semiconductor device by shipment in tape, and a package for semiconductor device using the cover tape for packaging semiconductor device. The cover tape for packaging semiconductor device of the present invention has a net-like structure 20 at least in a portion, and the cover tape for packaging semiconductor device is pasted onto an embossed tape which has a number of pockets containing semiconductor devices so as to cover the pockets. The package for semiconductor device of the present invention contains an embossed tape which has a number of pockets which contain semiconductor devices, and the cover tape for packaging semiconductor device of the present invention.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a photograph showing an overall view of an exemplary embossed tape and cover tape wound on a reel.

FIG. 1B is a photograph showing a plain view of the embossed tape and the cover tape of FIG. 1A.

FIG. 1C is a schematic cross-sectional view showing the embossed tape and the cover tape shown in FIGS. 1A and 1B.

FIG. 1D is a schematic cross-sectional view showing an exemplary layer composition of the conventional cover tape.

FIG. 1E is a perspective view showing an example (first view) of the conventional cover tape of an aspect in which openings are disposed on the cover tape.

FIG. 1F is a schematic cross-sectional view showing the cover tape shown in FIG. 1E.

FIG. 1G is a cross-sectional view showing an example (second view) of the conventional cover tape of an aspect in which openings in form of projection are disposed on the cover tape.

FIG. 1H is a schematic cross-sectional view showing the cover tape shown in FIG. 1G.

FIG. 1I is a cross-sectional view showing an example (third view) of the conventional cover tape of an aspect in which projections are disposed on the cover tape.

FIG. 2A is a perspective view showing the cover tape for packaging semiconductor device of the present invention in the first embodiment.

FIG. 2B is a schematic diagram showing a net-like structure of the cover tape for packaging semiconductor device of the present invention in the first embodiment.

FIG. 2C is a schematic cross-sectional view showing the cover tape for packaging semiconductor device of the present invention in the first embodiment.

Claims

1. A cover tape for packaging semiconductor device comprising: a net-like structure,wherein the cover tape for packaging semiconductor device comprises the net-like structure at least in a portion, andthe cover tape for packaging semiconductor device is pasted onto an embossed tape which comprises a number of pockets containing semiconductor devices so as to cover the pockets.

2. The cover tape for packaging semiconductor device according to claim 1, wherein the cover tape for packaging semiconductor device is in woven form.

3. The cover tape for packaging semiconductor device according to claim 1, wherein the net-like structure is formed of a woven string-like member.

4. The cover tape for packaging semiconductor device according to claim 3, wherein the string-like member comprises an insulating material which is coated with an antistatic material.

5. The cover tape for packaging semiconductor device according to claim 3, wherein the string-like member comprises the insulating material, and a grid insulating layer, which is formed of the woven string-like member, is coated with an antistatic layer comprising the antistatic material.

6. The cover tape for packaging semiconductor device according to claim 1, wherein the net-like structure is located only in an area corresponding to the pocket of the embossed tape.

7. The cover tape for packaging semiconductor device according to claim 3, wherein the net-like structure is located only in an area corresponding to the pocket of the embossed tape.

8. A package for semiconductor device, comprising: an embossed tape; anda cover tape for packaging semiconductor device,wherein the embossed tape comprises a number of pockets which contain semiconductor devices, andthe cover tape for packaging semiconductor device comprises:a net-like structure,wherein the cover tape for packaging semiconductor device comprises the net-like structure at least in a portion, andthe cover tape for packaging semiconductor device is pasted onto an embossed tape which comprises a number of pockets containing semiconductor devices so as to cover the pockets.

9. The package for semiconductor device according to claim 8, wherein the cover tape for packaging semiconductor device is in woven form.

10. The package for semiconductor device according to claim 8, wherein the net-like structure is formed of a woven string-like member.

11. The package for semiconductor device according to claim 10, wherein the string-like member comprises an insulating material which is coated with an antistatic material.

12. The package for semiconductor device according to claim 10, wherein the string-like member comprises the insulating material, and a grid insulating layer, which is formed of the woven string-like member, is coated with an antistatic layer comprising the antistatic material.

13. The package for semiconductor device according to claim 8, wherein the net-like structure is located only in an area corresponding to the pocket of the embossed tape.

14. The package for semiconductor device according to claim 10, wherein the net-like structure is located only in an area corresponding to the pocket of the embossed tape.