Hideyuki Arakawa

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 9,230,937
- Issue date Jan 5, 2016
- Renesas Electronics Corporation
- Kaori Sumitomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, and wire bonder
- Patent number 8,881,966
- Issue date Nov 11, 2014
- Renesas Electronics Corporation
- Kazuyuki Misumi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 8,415,245
- Issue date Apr 9, 2013
- Renesas Electronics Corporation
- Yasuki Takata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,943,433
- Issue date May 17, 2011
- Renesas Electronics Corporation
- Hideyuki Arakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molded semiconductor device and differential amplifier circuit
- Patent number 7,763,966
- Issue date Jul 27, 2010
- Renesas Technology Corp.
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,659,635
- Issue date Feb 9, 2010
- Renesas Technology Corp.
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, interposer chip and manufacturing method of s...
- Patent number 7,622,799
- Issue date Nov 24, 2009
- Renesas Technology Corp.
- Soshi Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,456,091
- Issue date Nov 25, 2008
- Renesas Technology Corp.
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,774,494
- Issue date Aug 10, 2004
- Renesas Technology Corp.
- Hideyuki Arakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method and wire bonding apparatus
- Patent number 6,564,989
- Issue date May 20, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Hideyuki Arakawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF
- Publication number 20120286427
- Publication date Nov 15, 2012
- Renesas Electronics Corporation
- Kaori Sumitomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20110057299
- Publication date Mar 10, 2011
- Renesas Electronics Corporation
- Yasuki TAKATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND WIRE BONDER
- Publication number 20100203681
- Publication date Aug 12, 2010
- RENEASAS TECHNOLOGY CORP.
- KAZUYUKI MISUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20100120207
- Publication date May 13, 2010
- RENESAS TECHNOLOGY CORP.
- Hideyuki ARAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090001572
- Publication date Jan 1, 2009
- Renesas Technology Corp.
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20080217750
- Publication date Sep 11, 2008
- RENESAS TECHNOLOGY CORP.
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20080054052
- Publication date Mar 6, 2008
- Hideyuki Arakawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, INTERPOSER CHIP AND MANUFACTURING METHOD OF S...
- Publication number 20070170573
- Publication date Jul 26, 2007
- Soshi KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20060261495
- Publication date Nov 23, 2006
- Renesas Technology Corp.
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20060216863
- Publication date Sep 28, 2006
- Renesas Technology Corp.
- Hideyuki Arakawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method thereof.
- Publication number 20020137327
- Publication date Sep 26, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Hideyuki Arakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding method and wire bonding apparatus
- Publication number 20020027151
- Publication date Mar 7, 2002
- Hideyuki Arakawa
- H01 - BASIC ELECTRIC ELEMENTS

Hideyuki Arakawa

Person

Patents Grantslast 30 patents

Semiconductor device and a manufacturing method thereof

Method of manufacturing semiconductor device, and wire bonder

Method of manufacturing semiconductor device and semiconductor device

Method of manufacturing semiconductor device

Resin molded semiconductor device and differential amplifier circuit

Semiconductor device and method of manufacturing the same

Semiconductor device, interposer chip and manufacturing method of s...

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Wire bonding method and wire bonding apparatus

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND WIRE BONDER

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, INTERPOSER CHIP AND MANUFACTURING METHOD OF S...

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device

Semiconductor device and manufacturing method thereof.

Wire bonding method and wire bonding apparatus