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Hideyuki Kurita
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Kanagawa, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method for manufacturing double-sided flexible printed board
Patent number
7,213,334
Issue date
May 8, 2007
Sony Corporation
Hideyuki Kurita
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flexible wiring boards
Patent number
7,053,312
Issue date
May 30, 2006
Sony Corporation
Hiroyuki Hishinuma
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and apparatus for shielding integrated circuits
Patent number
7,005,323
Issue date
Feb 28, 2006
RfStream Corporation
Hiroshi Ogasawara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for manufacturing multilayer flexible wiring boards
Patent number
6,991,148
Issue date
Jan 31, 2006
Sony Corporation
Hideyuki Kurita
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Ultrasonic manufacturing apparatus
Patent number
6,926,187
Issue date
Aug 9, 2005
Sony Chemicals Corp.
Hideyuki Kurita
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Process for manufacturing flexible wiring boards
Patent number
6,848,176
Issue date
Feb 1, 2005
Sony Chemicals Corporation
Hiroyuki Hishinuma
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Board pieces, flexible wiring boards and processes for manufacturin...
Patent number
6,840,430
Issue date
Jan 11, 2005
Sony Chemicals, Corp.
Hideyuki Kurita
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer flexible wiring boards and processes for manufacturing m...
Patent number
6,812,060
Issue date
Nov 2, 2004
Sony Chemicals Corporation
Hideyuki Kurita
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flexible printed wiring board and its production method
Patent number
6,809,267
Issue date
Oct 26, 2004
Sony Chemicals Corporation
Hideyuki Kurita
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Processes for manufacturing flexible wiring boards and the resultin...
Patent number
6,737,588
Issue date
May 18, 2004
Sony Chemicals Corporation
Hideyuki Kurita
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Processes for manufacturing flexible wiring boards and the resultin...
Patent number
6,729,022
Issue date
May 4, 2004
Sony Chemicals Corp.
Hideyuki Kurita
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Substrate piece and flexible substrate
Patent number
6,717,064
Issue date
Apr 6, 2004
Sony Chemicals Corp.
Hideyuki Kurita
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing double-sided flexible printed board
Patent number
6,705,007
Issue date
Mar 16, 2004
Sony Chemicals Corp.
Hideyuki Kurita
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Process for producing magnetic head suspension
Patent number
6,658,722
Issue date
Dec 9, 2003
Sony Chemicals Corporation
Hideyuki Kurita
G11 - INFORMATION STORAGE
Information
Patent Grant
Processes for manufacturing flexible wiring boards
Patent number
6,643,923
Issue date
Nov 11, 2003
Sony Chemicals Corp.
Hiroyuki Hishinuma
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Board pieces, flexible wiring boards, and processes for manufacturi...
Patent number
6,596,947
Issue date
Jul 22, 2003
Sony Chemicals Corp.
Hideyuki Kurita
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Ultrasonic manufacturing apparatuses, multilayer flexible wiring bo...
Patent number
6,583,364
Issue date
Jun 24, 2003
Sony Chemicals Corp.
Hideyuki Kurita
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
BGA package substrate
Patent number
6,448,647
Issue date
Sep 10, 2002
Sony Chemicals Corporation
Hideyuki Kurita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flexible board made by joining two pieces through an adhesive film
Patent number
6,437,251
Issue date
Aug 20, 2002
Sony Chemicals Corp.
Hideyuki Kurita
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flexible wiring board pieces and wiring sheets
Patent number
6,420,659
Issue date
Jul 16, 2002
Sony Chemicals Corporation
Akira Tsutsumi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multi-layer flexible printed wiring board
Patent number
6,404,052
Issue date
Jun 11, 2002
Sony Chemicals Corp.
Hideyuki Kurita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer boards
Patent number
6,399,891
Issue date
Jun 4, 2002
Sony Chemicals Corporation
Hideyuki Kurita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a flexible circuit board
Patent number
6,344,308
Issue date
Feb 5, 2002
Sony Chemicals Corp.
Hideyuki Kurita
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuit board and production method thereof
Patent number
6,323,434
Issue date
Nov 27, 2001
Sony Chemicals Corp.
Hideyuki Kurita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Non-contact IC card and process for its production
Patent number
5,705,852
Issue date
Jan 6, 1998
Sony Chemicals Corp.
Katsuhisa Orihara
G06 - COMPUTING CALCULATING COUNTING
Patents Applications
last 30 patents
Information
Patent Application
Method and apparatus for shielding integrated circuits
Publication number
20050250246
Publication date
Nov 10, 2005
Hiroshi Ogasawara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Process for manufacturing multilayer flexible wiring boards
Publication number
20050028358
Publication date
Feb 10, 2005
Sony Chemicals Corp.
Hideyuki Kurita
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method for manufacturing double-sided flexible printed board
Publication number
20040131765
Publication date
Jul 8, 2004
Sony Chemicals Corp.
Hideyuki Kurita
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Flexible wiring boards
Publication number
20040045157
Publication date
Mar 11, 2004
SONY CHEMICALS CORP.
Hiroyuki Hishinuma
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Processes for manufacturing flexible wiring boards
Publication number
20040045737
Publication date
Mar 11, 2004
SONY CHEMICALS CORP.
Hiroyuki Hishinuma
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Ultrasonic manufacturing apparatus
Publication number
20030234085
Publication date
Dec 25, 2003
Sony Chemicals Corp.
Hideyuki Kurita
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Board pieces, flexible wiring boards and processes for manufacturin...
Publication number
20030211234
Publication date
Nov 13, 2003
Hideyuki Kurita
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Processes for manufacturing flexible wiring boards and the resultin...
Publication number
20020189857
Publication date
Dec 19, 2002
SONY CHEMICALS CORPORATION
Hideyuki Kurita
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC