TREA

Hideyuki Takahashi

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  • Gotenba-Shi, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Interface structure
    • Patent number 10,714,851
    • Issue date Jul 14, 2020
    • Sensata Technologies
    • Hideyuki Takahashi
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Socket
    • Patent number 10,517,186
    • Issue date Dec 24, 2019
    • Sensata Technologies, Inc.
    • Hideyuki Takahashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Connector having a contact with contact surfaces inclined in opposi...
    • Patent number 9,350,100
    • Issue date May 24, 2016
    • Sensata Technologies, Inc.
    • Hideyuki Takahashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Socket
    • Patent number 8,602,805
    • Issue date Dec 10, 2013
    • Sensata Technologies Massachusetts, Inc.
    • Hideyuki Takahashi
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Semiconductor device burn-in test socket
    • Patent number 8,388,365
    • Issue date Mar 5, 2013
    • Hideyuki Takahashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Socket adaptor apparatus
    • Patent number 7,601,008
    • Issue date Oct 13, 2009
    • Sensata Technologies, Inc.
    • Hideyuki Takahashi
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Contact assembly and socket for use with semiconductor packages
    • Patent number 7,217,140
    • Issue date May 15, 2007
    • Sensata Technologies, Inc.
    • Hideyuki Takahashi
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Electronic part mounting device
    • Patent number 6,402,528
    • Issue date Jun 11, 2002
    • Texas Instruments Incorporated
    • Hideyuki Takahashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electrical socket apparatus
    • Patent number 6,287,127
    • Issue date Sep 11, 2001
    • Texas Instruments Incorporated
    • Yasushi Hibino
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SOCKET
    • Publication number 20190064214
    • Publication date Feb 28, 2019
    • Sensata Technologies, Inc.
    • Hideyuki Takahashi
    • G01 - MEASURING TESTING
  • Information Patent Application

    INTERFACE STRUCTURE
    • Publication number 20170171985
    • Publication date Jun 15, 2017
    • Sensata Technologies, Inc.
    • Hideyuki Takahashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONNECTOR
    • Publication number 20150126071
    • Publication date May 7, 2015
    • Sensata Technologies Massachusetts, Inc.
    • Hideyuki Takahashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Socket
    • Publication number 20120129379
    • Publication date May 24, 2012
    • Hideyuki Takahashi
    • G01 - MEASURING TESTING
  • Information Patent Application

    SOCKET
    • Publication number 20100248518
    • Publication date Sep 30, 2010
    • Hideyuki Takahashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Socket Adaptor Apparatus
    • Publication number 20090017703
    • Publication date Jan 15, 2009
    • Hideyuki Takahashi
    • G01 - MEASURING TESTING
  • Information Patent Application

    Contact assembly and socket for use with semiconductor packages
    • Publication number 20060192264
    • Publication date Aug 31, 2006
    • Hideyuki Takahashi
    • G01 - MEASURING TESTING
  • Information Patent Application

    Electronic part mounting device
    • Publication number 20010029123
    • Publication date Oct 11, 2001
    • Hideyuki Takahashi
    • H01 - BASIC ELECTRIC ELEMENTS