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Hijiri Hayashi
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Nakano-ku, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Mounting head
Patent number
11,302,666
Issue date
Apr 12, 2022
Shinkawa Ltd.
Manato Nishide
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding apparatus
Patent number
6,362,014
Issue date
Mar 26, 2002
Kabushiki Kaisha Shinkawa
Kuniyuki Takahashi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding apparatus and method
Patent number
6,302,312
Issue date
Oct 16, 2001
Kabushiki Kaisha Shinkawa
Kuniyuki Takahashi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Control method for wire bonding apparatus
Patent number
6,206,266
Issue date
Mar 27, 2001
Kabushiki Kaisha Shinkawa
Kuniyuki Takahashi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wire bonding apparatus and bonding load correction method for the same
Patent number
6,119,917
Issue date
Sep 19, 2000
Kabushiki Kaisha Shinkawa
Kuniyuki Takahashi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wire bonding apparatus
Patent number
6,119,914
Issue date
Sep 19, 2000
Kabushiki Kaisha Shinkawa
Kuniyuki Takahashi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding load correction method and wire bonding apparatus
Patent number
6,095,396
Issue date
Aug 1, 2000
Kabushiki Kaisha Shinkawa
Kuniyuki Takahashi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wire bonding apparatus and control method thereof
Patent number
6,070,778
Issue date
Jun 6, 2000
Kabushiki Kaisha Shinkawa
Kuniyuki Takahashi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuit and method for controlling a DC motor
Patent number
5,949,208
Issue date
Sep 7, 1999
Kabushiki Kaisha Shinkawa
Kuniyuki Takahashi
G05 - CONTROLLING REGULATING
Information
Patent Grant
Motor control circuit for a wire bonding apparatus
Patent number
5,485,063
Issue date
Jan 16, 1996
Kabushiki Kaisha Shinkawa
Tooru Mochida
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Information
Patent Grant
Ultrasonic wire bonding apparatus
Patent number
5,046,654
Issue date
Sep 10, 1991
Kabushiki Kaisha Shinkawa
Nobuto Yamazaki
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Information
Patent Grant
Wire bonding apparatus
Patent number
5,016,803
Issue date
May 21, 1991
Kabushiki Kaisha Shinkawa
Yuji Ohashi
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Patents Applications
last 30 patents
Information
Patent Application
MOUNTING APPARATUS
Publication number
20220320034
Publication date
Oct 6, 2022
SHINKAWA LTD.
Hijiri HAYASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOUNTING HEAD
Publication number
20200051947
Publication date
Feb 13, 2020
SHINKAWA LTD.
Manato NISHIDE
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