Claims
- 1. A bonding apparatus comprising an XY table having a bonding tool, a drive means for driving said XY table, a control circuit for controlling said drive means in drive amounts based on units of resolution of said drive means, a position detection means for detecting an amount of movement of said XY table, and a computer for controlling said control circuit based on said amount of movement of said XY table from said position detection means, thus performing scrubbing with said bonding tool by driving said XY table, wherein said bonding apparatus further comprises an offset compensation circuit provided in said control circuit so as to control said drive means in drive amounts smaller than said resolution of said drive means, and wherein when scrubbing is performed by said bonding tool of said XY table, said computer controls said offset compensation circuit so that said offset compensation circuit generates an output that provides a driving amount smaller than said resolution of said drive means, thus controlling said drive means with said output.
- 2. The bonding apparatus according to claim 1 wherein during scrubbing said computer provides a driving amount less than one unit of resolution of said drive means.
- 3. The bonding apparatus according to claim 1 wherein said drive means is selected from the group consisting a DC motor, AC motor, a pulse motor and a linear motor.
Priority Claims (1)
Number |
Date |
Country |
Kind |
10-161527 |
May 1998 |
JP |
|
Parent Case Info
This is a Divisional Application of application Ser. No. 09/322,801, filed May 27, 1999.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
5350106 |
Fogal |
Sep 1994 |
A |
5360155 |
Ookie et al. |
Nov 1994 |
A |
5890643 |
Razon et al. |
Apr 1999 |
A |