Hinmeng Au

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 12,113,026
- Issue date Oct 8, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 11,876,053
- Issue date Jan 16, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 11,824,008
- Issue date Nov 21, 2023
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 10,923,429
- Issue date Feb 16, 2021
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 10,763,216
- Issue date Sep 1, 2020
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 10,510,669
- Issue date Dec 17, 2019
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form lateral pad on edge of wafer
- Patent number 8,383,949
- Issue date Feb 26, 2013
- Intel Corporation
- Edris M. Mohammed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 8,227,904
- Issue date Jul 24, 2012
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20240429173
- Publication date Dec 26, 2024
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20240038671
- Publication date Feb 1, 2024
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20230016326
- Publication date Jan 19, 2023
- Intel Corporation
- Henning M. Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20210134726
- Publication date May 6, 2021
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20200357747
- Publication date Nov 12, 2020
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20200075493
- Publication date Mar 5, 2020
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20180145031
- Publication date May 24, 2018
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20120261838
- Publication date Oct 18, 2012
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO FORM LATERAL PAD ON EDGE OF WAFER
- Publication number 20110155435
- Publication date Jun 30, 2011
- EDRIS M. MOHAMMED
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multi-chip package and method of providing die-to-die interconnects...
- Publication number 20100327424
- Publication date Dec 30, 2010
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Multi-chip package and method of providing die-to-die interconnects...

Multi-chip package and method of providing die-to-die interconnects...

Multi-chip package and method of providing die-to-die interconnects...

Multi-chip package and method of providing die-to-die interconnects...

Multi-chip package and method of providing die-to-die interconnects...

Multi-chip package and method of providing die-to-die interconnects...

Method to form lateral pad on edge of wafer

Multi-chip package and method of providing die-to-die interconnects...

Patents Applicationslast 30 patents

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

METHOD TO FORM LATERAL PAD ON EDGE OF WAFER

Multi-chip package and method of providing die-to-die interconnects...