Hiren D. Thacker

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Reflow-compatible optical I/O assembly adapter
- Patent number 10,591,689
- Issue date Mar 17, 2020
- Oracle International Corporation
- Chaoqi Zhang
- G02 - OPTICS
Information Patent Grant
Waveguide-last silicon photonic optical connector assembly
- Patent number 9,933,574
- Issue date Apr 3, 2018
- Oracle International Corporation
- Chaoqi Zhang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Extracting an embedded DC signal to provide a reference voltage for...
- Patent number 9,819,421
- Issue date Nov 14, 2017
- Oracle International Corporation
- Jingqiong Xie
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Packaged opto-electronic module
- Patent number 9,678,271
- Issue date Jun 13, 2017
- Oracle International Corporation
- Hiren D. Thacker
- G02 - OPTICS
Information Patent Grant
Integrated electro-absorption modulator
- Patent number 9,411,177
- Issue date Aug 9, 2016
- Oracle International Corporation
- John E. Cunningham
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Hybrid-integrated photonic chip package with an interposer
- Patent number 9,297,971
- Issue date Mar 29, 2016
- Oracle International Corporation
- Hiren D. Thacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid integrated photonic chip package
- Patent number 9,256,026
- Issue date Feb 9, 2016
- Oracle International Corporation
- Hiren D. Thacker
- G02 - OPTICS
Information Patent Grant
Hybrid-integrated photonic chip package with an interposer
- Patent number 9,250,403
- Issue date Feb 2, 2016
- Oracle International Corporation
- Hiren D. Thacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Edge coupling of optical devices
- Patent number 9,217,836
- Issue date Dec 22, 2015
- Kotura, Inc.
- Mehdi Asghari
- G02 - OPTICS
Information Patent Grant
Method for singulating hybrid integrated photonic chips
- Patent number 9,159,861
- Issue date Oct 13, 2015
- Oracle International Corporation
- Chaoqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electro-absorption modulator
- Patent number 9,142,698
- Issue date Sep 22, 2015
- Oracle International Corporation
- John E. Cunningham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplated solder for high-temperature interconnect
- Patent number 9,136,237
- Issue date Sep 15, 2015
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch process for three-dimensional integration
- Patent number 9,082,808
- Issue date Jul 14, 2015
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable photonic interconnect module
- Patent number 8,998,509
- Issue date Apr 7, 2015
- Oracle International Corporation
- Hiren D. Thacker
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Chip package for high-count chip stacks
- Patent number 8,975,754
- Issue date Mar 10, 2015
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid-integrated photonic chip package
- Patent number 8,971,676
- Issue date Mar 3, 2015
- Oracle International Corporation
- Hiren D. Thacker
- G02 - OPTICS
Information Patent Grant
Multi-chip module with self-populating positive features
- Patent number 8,896,112
- Issue date Nov 25, 2014
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection and assembly of three-dimensional chip packages
- Patent number 8,772,920
- Issue date Jul 8, 2014
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maintaining alignment in a multi-chip module using a compressible s...
- Patent number 8,742,576
- Issue date Jun 3, 2014
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of multi-chip modules with proximity connectors using refl...
- Patent number 8,648,463
- Issue date Feb 11, 2014
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device with enhanced mechanical strength
- Patent number 8,600,201
- Issue date Dec 3, 2013
- Oracle International Corporation
- Hiren D. Thacker
- G02 - OPTICS
Information Patent Grant
Direct interlayer optical coupler
- Patent number 8,548,287
- Issue date Oct 1, 2013
- Oracle International Corporation
- Hiren D. Thacker
- G02 - OPTICS
Information Patent Grant
Efficient inter-chip optical coupling
- Patent number 8,548,288
- Issue date Oct 1, 2013
- Oracle International Corporation
- Kannan Raj
- G02 - OPTICS
Information Patent Grant
Mechanical coupling in a multi-chip module using magnetic components
- Patent number 8,334,149
- Issue date Dec 18, 2012
- Oracle America, Inc.
- Jing Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-locking features in a multi-chip module
- Patent number 8,315,065
- Issue date Nov 20, 2012
- Oracle America, Inc.
- Jing Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanical coupling in a multi-chip module using magnetic components
- Patent number 8,188,581
- Issue date May 29, 2012
- Oracle America, Inc.
- Jing Shi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUSES AND METHODS FOR WIRELESSLY POWERED CHARGE-BALANCED ELEC...
- Publication number 20230046820
- Publication date Feb 16, 2023
- Nanovision Biosciences, Inc.
- Abraham Akinin
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
HIGH VISUAL ACUITY, HIGH SENSITIVITY LIGHT SWITCHABLE NEURAL STIMUL...
- Publication number 20220387786
- Publication date Dec 8, 2022
- Nanovision Biosciences, Inc.
- Yu-Hsin Liu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
HIGH SPEED AND HIGH TIMING RESOLUTION CYCLING EXCITATION PROCESS (C...
- Publication number 20220384672
- Publication date Dec 1, 2022
- Nanovision Biosciences, Inc.
- Yu-Hwa Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REFLOW-COMPATIBLE OPTICAL I/O ASSEMBLY ADAPTER
- Publication number 20180267265
- Publication date Sep 20, 2018
- ORACLE INTERNATIONAL CORPORATION
- Chaoqi Zhang
- G02 - OPTICS
Information Patent Application
WAFER-LEVEL PACKAGED OPTOELECTRONIC MODULE
- Publication number 20180180808
- Publication date Jun 28, 2018
- ORACLE INTERNATIONAL CORPORATION
- Chaoqi Zhang
- G02 - OPTICS
Information Patent Application
PACKAGED OPTO-ELECTRONIC MODULE
- Publication number 20160216445
- Publication date Jul 28, 2016
- Oracle International Corporation
- Hiren D. Thacker
- G02 - OPTICS
Information Patent Application
INTEGRATED ELECTRO-ABSORPTION MODULATOR
- Publication number 20150362764
- Publication date Dec 17, 2015
- Oracle International Corporation
- John E. Cunningham
- G02 - OPTICS
Information Patent Application
ELECTROPLATED SOLDER WITH EUTECTIC CHEMICAL COMPOSITION
- Publication number 20150318254
- Publication date Nov 5, 2015
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRO-ABSORPTION MODULATOR
- Publication number 20150293383
- Publication date Oct 15, 2015
- Oracle International Corporation
- John E. Cunningham
- G02 - OPTICS
Information Patent Application
ELECTROPLATED SOLDER FOR HIGH-TEMPERATURE INTERCONNECT
- Publication number 20150171040
- Publication date Jun 18, 2015
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATING HYBRID INTEGRATED PHOTONIC CHIPS
- Publication number 20150108506
- Publication date Apr 23, 2015
- Oracle International Corporation
- Chaoqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE
- Publication number 20150098677
- Publication date Apr 9, 2015
- Oracle International Corporation
- Hiren D. Thacker
- G02 - OPTICS
Information Patent Application
HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER
- Publication number 20140321803
- Publication date Oct 30, 2014
- Oracle International Corporation
- Hiren D. Thacker
- G02 - OPTICS
Information Patent Application
HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER
- Publication number 20140321804
- Publication date Oct 30, 2014
- Oracle International Corporation
- Hiren D. Thacker
- G02 - OPTICS
Information Patent Application
STACKABLE PHOTONIC INTERCONNECT MODULE
- Publication number 20140270784
- Publication date Sep 18, 2014
- Oracle International Corporation
- Hiren D. Thacker
- G02 - OPTICS
Information Patent Application
MULTI-CHIP MODULE WITH SELF-POPULATING POSITIVE FEATURES
- Publication number 20140264854
- Publication date Sep 18, 2014
- Oracle International Corporation
- Hiren D. Thacker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW-COST CHIP PACKAGE FOR CHIP STACKS
- Publication number 20140225284
- Publication date Aug 14, 2014
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE FOR HIGH-COUNT CHIP STACKS
- Publication number 20140225273
- Publication date Aug 14, 2014
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge coupling of optical devices
- Publication number 20140133864
- Publication date May 15, 2014
- Mehdi Asghari
- G02 - OPTICS
Information Patent Application
BATCH PROCESS FOR THREE-DIMENSIONAL INTEGRATION
- Publication number 20130320567
- Publication date Dec 5, 2013
- ORACLE INTERNATIONAL CORPORATION
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAINTAINING ALIGNMENT IN A MULTI-CHIP MODULE USING A COMPRESSIBLE S...
- Publication number 20130207261
- Publication date Aug 15, 2013
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT INTER-CHIP OPTICAL COUPLING
- Publication number 20130156366
- Publication date Jun 20, 2013
- Oracle International Corporation
- Kannan Raj
- G02 - OPTICS
Information Patent Application
DIRECT INTERLAYER OPTICAL COUPLER
- Publication number 20130121635
- Publication date May 16, 2013
- Oracle International Corporation
- Hiren D. Thacker
- G02 - OPTICS
Information Patent Application
INTERCONNECTION AND ASSEMBLY OF THREE-DIMENSIONAL CHIP PACKAGES
- Publication number 20130015578
- Publication date Jan 17, 2013
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICAL COUPLING IN A MULTI-CHIP MODULE USING MAGNETIC COMPONENTS
- Publication number 20120220056
- Publication date Aug 30, 2012
- ORACLE INTERNATIONAL CORPORATION
- Jing Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE WITH ENHANCED MECHANICAL STRENGTH
- Publication number 20120213467
- Publication date Aug 23, 2012
- Oracle International Corporation
- Hiren D. Thacker
- G02 - OPTICS
Information Patent Application
ASSEMBLY OF MULTI-CHIP MODULES USING REFLOWABLE FEATURES
- Publication number 20110278718
- Publication date Nov 17, 2011
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICAL COUPLING IN A MULTI-CHIP MODULE USING MAGNETIC COMPONENTS
- Publication number 20110074011
- Publication date Mar 31, 2011
- SUN MICROSYSTEMS, INC.
- Jing Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-LOCKING FEATURES IN A MULTI-CHIP MODULE
- Publication number 20110075380
- Publication date Mar 31, 2011
- SUN MICROSYSTEMS, INC.
- Jing Shi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Hiren D. Thacker

Person

Patents Grantslast 30 patents

Reflow-compatible optical I/O assembly adapter

Waveguide-last silicon photonic optical connector assembly

Extracting an embedded DC signal to provide a reference voltage for...

Packaged opto-electronic module

Integrated electro-absorption modulator

Hybrid-integrated photonic chip package with an interposer

Hybrid integrated photonic chip package

Hybrid-integrated photonic chip package with an interposer

Edge coupling of optical devices

Method for singulating hybrid integrated photonic chips

Integrated electro-absorption modulator

Electroplated solder for high-temperature interconnect

Batch process for three-dimensional integration

Stackable photonic interconnect module

Chip package for high-count chip stacks

Hybrid-integrated photonic chip package

Multi-chip module with self-populating positive features

Interconnection and assembly of three-dimensional chip packages

Maintaining alignment in a multi-chip module using a compressible s...

Assembly of multi-chip modules with proximity connectors using refl...

Optical device with enhanced mechanical strength

Direct interlayer optical coupler

Efficient inter-chip optical coupling

Mechanical coupling in a multi-chip module using magnetic components

Self-locking features in a multi-chip module

Mechanical coupling in a multi-chip module using magnetic components

Patents Applicationslast 30 patents

APPARATUSES AND METHODS FOR WIRELESSLY POWERED CHARGE-BALANCED ELEC...

HIGH VISUAL ACUITY, HIGH SENSITIVITY LIGHT SWITCHABLE NEURAL STIMUL...

HIGH SPEED AND HIGH TIMING RESOLUTION CYCLING EXCITATION PROCESS (C...

REFLOW-COMPATIBLE OPTICAL I/O ASSEMBLY ADAPTER

WAFER-LEVEL PACKAGED OPTOELECTRONIC MODULE

PACKAGED OPTO-ELECTRONIC MODULE

INTEGRATED ELECTRO-ABSORPTION MODULATOR

ELECTROPLATED SOLDER WITH EUTECTIC CHEMICAL COMPOSITION

INTEGRATED ELECTRO-ABSORPTION MODULATOR

ELECTROPLATED SOLDER FOR HIGH-TEMPERATURE INTERCONNECT

SINGULATING HYBRID INTEGRATED PHOTONIC CHIPS

HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE

HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER

HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER

STACKABLE PHOTONIC INTERCONNECT MODULE

MULTI-CHIP MODULE WITH SELF-POPULATING POSITIVE FEATURES

LOW-COST CHIP PACKAGE FOR CHIP STACKS

CHIP PACKAGE FOR HIGH-COUNT CHIP STACKS

Edge coupling of optical devices

BATCH PROCESS FOR THREE-DIMENSIONAL INTEGRATION

MAINTAINING ALIGNMENT IN A MULTI-CHIP MODULE USING A COMPRESSIBLE S...

EFFICIENT INTER-CHIP OPTICAL COUPLING

DIRECT INTERLAYER OPTICAL COUPLER

INTERCONNECTION AND ASSEMBLY OF THREE-DIMENSIONAL CHIP PACKAGES

MECHANICAL COUPLING IN A MULTI-CHIP MODULE USING MAGNETIC COMPONENTS

OPTICAL DEVICE WITH ENHANCED MECHANICAL STRENGTH

ASSEMBLY OF MULTI-CHIP MODULES USING REFLOWABLE FEATURES

MECHANICAL COUPLING IN A MULTI-CHIP MODULE USING MAGNETIC COMPONENTS

SELF-LOCKING FEATURES IN A MULTI-CHIP MODULE