Hiroaki MATSUBARA

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 10,236,231
- Issue date Mar 19, 2019
- J-Devices Corporation
- Takeshi Miyakoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,134,710
- Issue date Nov 20, 2018
- J-DEVICES CORPORATION
- Takeshi Miyakoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure, printed circuit board, semiconductor device...
- Patent number 9,922,931
- Issue date Mar 20, 2018
- J-Devices Corporation
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 9,685,376
- Issue date Jun 20, 2017
- J-Devices Corporation
- Yoshihiko Ikemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,635,762
- Issue date Apr 25, 2017
- J-DEVICES CORPORATION
- Shinji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,601,450
- Issue date Mar 21, 2017
- J-DEVICES CORPORATION
- Takeshi Miyakoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic shielding package of non-volatile magnetic memory element
- Patent number 9,553,052
- Issue date Jan 24, 2017
- J-Devices Corporation
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 9,368,474
- Issue date Jun 14, 2016
- J-DEVICES CORPORATION
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink in the aperture of substrate
- Patent number 9,362,200
- Issue date Jun 7, 2016
- J-DEVICES CORPORATION
- Hirokazu Honda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170301599
- Publication date Oct 19, 2017
- J-DEVICES CORPORATION
- Takeshi MIYAKOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure, Printed Circuit Board, Semiconductor Device...
- Publication number 20170263560
- Publication date Sep 14, 2017
- J-DEVICES CORPORATION
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20170148766
- Publication date May 25, 2017
- J-DEVICES CORPORATION
- Takeshi Miyakoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC SHIELDING PACKAGE OF NON-VOLATILE MAGNETIC MEMORY ELEMENT
- Publication number 20160172580
- Publication date Jun 16, 2016
- J-DEVICES CORPORATION
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20160079204
- Publication date Mar 17, 2016
- J-DEVICES CORPORATION
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20160027715
- Publication date Jan 28, 2016
- J-DEVICES CORPORATION
- Shinji WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160027695
- Publication date Jan 28, 2016
- J-DEVICES CORPORATION
- Yoshihiko IKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150371934
- Publication date Dec 24, 2015
- J-DEVICES CORPORATION
- Hirokazu HONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20150279759
- Publication date Oct 1, 2015
- J-DEVICES CORPORATION
- Takeshi Miyakoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150243576
- Publication date Aug 27, 2015
- J-DEVICES CORPORATION
- Takeshi MIYAKOSHI
- H01 - BASIC ELECTRIC ELEMENTS

Hiroaki MATSUBARA

Person

Patents Grantslast 30 patents

Semiconductor device

Semiconductor package

Interconnect structure, printed circuit board, semiconductor device...

Semiconductor device and method of manufacturing semiconductor device

Semiconductor package

Semiconductor package

Magnetic shielding package of non-volatile magnetic memory element

Manufacturing method for semiconductor device

Heat sink in the aperture of substrate

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

Interconnect Structure, Printed Circuit Board, Semiconductor Device...

SEMICONDUCTOR PACKAGE

MAGNETIC SHIELDING PACKAGE OF NON-VOLATILE MAGNETIC MEMORY ELEMENT

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE