Hirohito Ohhata

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Tsukuba-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Fabrication process of semiconductor package and semiconductor package
- Patent number 7,187,072
- Issue date Mar 6, 2007
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication process of semiconductor package and semiconductor package
- Patent number 6,746,897
- Issue date Jun 8, 2004
- Naoki Fukutomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication process of semiconductor package and semiconductor package
- Patent number 6,365,432
- Issue date Apr 2, 2002
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process of semiconductor package and semiconductor package
- Patent number 5,976,912
- Issue date Nov 2, 1999
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process of wiring board
- Patent number 5,504,992
- Issue date Apr 9, 1996
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Fabrication process of semiconductor package and semiconductor package
- Publication number 20040110319
- Publication date Jun 10, 2004
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fabrication process of semiconductor package and semiconductor package
- Publication number 20020094606
- Publication date Jul 18, 2002
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication process of semiconductor package and semiconductor package
- Publication number 20020039808
- Publication date Apr 4, 2002
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H01 - BASIC ELECTRIC ELEMENTS