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HIROJI AGA

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD FOR MANUFACTURING SOI WAFER
    • Publication number 20230154761
    • Publication date May 18, 2023
    • Shin-Etsu Handotai Co., Ltd.
    • Hiroji AGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING SOI WAFER
    • Publication number 20200111701
    • Publication date Apr 9, 2020
    • Shin-Etsu Handotai Co., Ltd.
    • Hiroji AGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING BONDED SOI WAFER
    • Publication number 20190221470
    • Publication date Jul 18, 2019
    • Shin-Etsu Handotai Co., Ltd.
    • Norihiro KOBAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR PRODUCING SOI WAFER
    • Publication number 20180144975
    • Publication date May 24, 2018
    • Shin-Etsu Handotai Co., Ltd.
    • Isao YOKOKAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING AN SOI WAFER
    • Publication number 20170287697
    • Publication date Oct 5, 2017
    • Shin-Etsu Handotai Co., Ltd.
    • Hiroji AGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR POLISHING GERMANIUM WAFER
    • Publication number 20170216992
    • Publication date Aug 3, 2017
    • Shin-Etsu Handotai Co., Ltd.
    • Yasuo NAGAOKA
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    METHOD OF MANUFACTURING SOI WAFER
    • Publication number 20170200634
    • Publication date Jul 13, 2017
    • Shin-Etsu Handotai Co., Ltd.
    • Hiroji AGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING BONDED SOI WAFER
    • Publication number 20160372363
    • Publication date Dec 22, 2016
    • Shin-Etsu Handotai Co., Ltd.
    • Hiroji Aga
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING BONDED WAFER
    • Publication number 20160365273
    • Publication date Dec 15, 2016
    • Shin-Etsu Handotai Co., Ltd.
    • Norihiro Kobayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING BONDED WAFER
    • Publication number 20160204024
    • Publication date Jul 14, 2016
    • Shin-Etsu Handotai Co., Ltd.
    • Norihiro Kobayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING BONDED WAFER
    • Publication number 20160197008
    • Publication date Jul 7, 2016
    • Shin-Etsu Handotai Co., Ltd.
    • Isao YOKOKAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF PRODUCING BONDED WAFER
    • Publication number 20160118294
    • Publication date Apr 28, 2016
    • Shin-Etsu Handotai Co., Ltd.
    • Norihiro Kobayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING SOI WAFER AND SOI WAFER
    • Publication number 20150340279
    • Publication date Nov 26, 2015
    • Shin-Etsu Handotai Co., Ltd.
    • Norihiro KOBAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING SOI WAFER
    • Publication number 20150249035
    • Publication date Sep 3, 2015
    • Shin-Etsu Handotai Co., Ltd.
    • Hiroji Aga
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING SOI WAFER
    • Publication number 20150243550
    • Publication date Aug 27, 2015
    • Shin-Etsu Handotai Co., Ltd.
    • Hiroji Aga
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING SOI WAFER
    • Publication number 20150206790
    • Publication date Jul 23, 2015
    • Shin-Etsu Handotai Co., Ltd.
    • Hiroji Aga
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING SOI WAFER
    • Publication number 20150064875
    • Publication date Mar 5, 2015
    • Shin-Etsu Handotai Co., Ltd.
    • Hiroji Aga
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING BONDED SOI WAFER
    • Publication number 20150017783
    • Publication date Jan 15, 2015
    • SHINE-ETSU HANDOTAI CO., LTD.
    • Norihiro Kobayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING SOI WAFER
    • Publication number 20140329372
    • Publication date Nov 6, 2014
    • Shin-Etsu Handotai Co., Ltd.
    • Hiroji Aga
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING A BONDED SOI WAFER
    • Publication number 20140322895
    • Publication date Oct 30, 2014
    • Shin-Etsu Handotai Co., Ltd.
    • Norihiro Kobayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR CALCULATING WARPAGE OF BONDED SOI WAFER AND METHOD FOR M...
    • Publication number 20140186977
    • Publication date Jul 3, 2014
    • Shin-Etsu Handotai Co., Ltd.
    • Isao Yokokawa
    • G01 - MEASURING TESTING
  • Information Patent Application

    METHOD FOR MANUFACTURING BONDED WAFER AND BONDED SOI WAFER
    • Publication number 20140097523
    • Publication date Apr 10, 2014
    • Shin-Etsu Handotai Co., Ltd.
    • Hiroji Aga
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING SOI WAFER
    • Publication number 20130316522
    • Publication date Nov 28, 2013
    • Shin-Etsu Handotai Co., Ltd.
    • Hiroji Aga
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING BONDED WAFER
    • Publication number 20130102126
    • Publication date Apr 25, 2013
    • Shin-Etsu Handotai Co., Ltd.
    • Hiroji Aga
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR PRODUCING BONDED WAFER
    • Publication number 20120244679
    • Publication date Sep 27, 2012
    • Shin-Etsu Handotai Co., Ltd.
    • Satoshi Oka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING SOI WAFER
    • Publication number 20110281420
    • Publication date Nov 17, 2011
    • Shin-Etsu Handotai Co., Ltd.
    • Hiroji Aga
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING SOI WAFER
    • Publication number 20110223740
    • Publication date Sep 15, 2011
    • Shin-Etsu Handotai Co., Ltd.
    • Tohru Ishizuka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING BONDED WAFER
    • Publication number 20110151643
    • Publication date Jun 23, 2011
    • Shin-Etsu Handotai Co., Ltd.
    • Norihiro Kobayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING BONDED WAFER
    • Publication number 20110104870
    • Publication date May 5, 2011
    • Shin-Etsu Handotai Co., Ltd.
    • Norihiro Kobayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING BONDED WAFER
    • Publication number 20100120223
    • Publication date May 13, 2010
    • Shin-Etsu Handotai Co., Ltd.
    • Norihiro Kobayashi
    • H01 - BASIC ELECTRIC ELEMENTS