Hirokazu Nakajima

Person

  • Tokyo, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor device and manufacturing method thereof

    • Patent number 8,742,499
    • Issue date Jun 3, 2014
    • Murata Manufacturing Co., Ltd.
    • Shizuki Nakajima
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder composition for electronic devices

    • Patent number 8,022,551
    • Issue date Sep 20, 2011
    • Renesas Electronics Corporation
    • Tasao Soga
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Semiconductor device

    • Patent number 7,554,193
    • Issue date Jun 30, 2009
    • Renesas Technology Corp.
    • Yasuo Osone
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device and manufacturing method therefor

    • Patent number 7,511,315
    • Issue date Mar 31, 2009
    • Renesas Technology Corp.
    • Satoru Konishi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device and a method of manufacturing the same

    • Patent number 7,468,294
    • Issue date Dec 23, 2008
    • Hitachi, Ltd.
    • Masashi Yamaura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor module

    • Patent number 7,301,781
    • Issue date Nov 27, 2007
    • Renesas Technology Corp.
    • Satoru Konishi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor device with lead-free solder

    • Patent number 7,259,465
    • Issue date Aug 21, 2007
    • Hitachi, Ltd.
    • Tasao Soga
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Manufacturing method of semiconductor device and semiconductor device

    • Patent number 7,223,636
    • Issue date May 29, 2007
    • Renesas Technology Corp.
    • Yoshihiko Kobayashi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor module

    • Patent number 7,176,579
    • Issue date Feb 13, 2007
    • Renesas Technology Corp.
    • Satoru Konishi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Power amplifier module

    • Patent number 7,154,760
    • Issue date Dec 26, 2006
    • Renesas Technology Corp.
    • Satoru Konishi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electronic device

    • Patent number 7,075,183
    • Issue date Jul 11, 2006
    • Hitachi, Ltd.
    • Tasao Soga
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Semiconductor device and manufacturing the same

    • Patent number 6,989,587
    • Issue date Jan 24, 2006
    • Renesas Technology Corp.
    • Mamoru Ito
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor device

    • Patent number 6,949,835
    • Issue date Sep 27, 2005
    • Renesas Technology Corp.
    • Satoru Konishi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Solder

    • Patent number 6,872,465
    • Issue date Mar 29, 2005
    • Hitachi, Ltd.
    • Tasao Soga
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor device having an elastic resin with a low modulus of...

    • Patent number 6,831,360
    • Issue date Dec 14, 2004
    • Renesas Technology Corp.
    • Masashi Yamaura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor devices

    • Patent number 6,710,263
    • Issue date Mar 23, 2004
    • Renesas Technology Corporation
    • Toshiyuki Kobayashi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

    • Publication number 20100230789
    • Publication date Sep 16, 2010
    • RENESAS TECHNOLOGY CORP.
    • Chiko Yorita
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

    • Publication number 20090194792
    • Publication date Aug 6, 2009
    • Renesas Technology Corp.
    • Satoru Konishi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Manufacturing method of semiconductor device and semiconductor device

    • Publication number 20070105283
    • Publication date May 10, 2007
    • RENESAS TECHNOLOGY CORP.
    • Yoshihiko Kobayashi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor device

    • Publication number 20070040255
    • Publication date Feb 22, 2007
    • Yasuo Osone
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor module

    • Publication number 20070035004
    • Publication date Feb 15, 2007
    • Satoru Konishi
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Solder composition for electronic devices

    • Publication number 20070031279
    • Publication date Feb 8, 2007
    • Renesas Technology Corporation
    • Tasao Soga
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Semiconductor device

    • Publication number 20060267220
    • Publication date Nov 30, 2006
    • Satoru Konishi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor module

    • Publication number 20060171130
    • Publication date Aug 3, 2006
    • RENESAS TECHNOLOGY CORP.
    • Satoru Konishi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Electronic device

    • Publication number 20060145352
    • Publication date Jul 6, 2006
    • Hitachi, Ltd
    • Tasao Soga
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor device and manufacturing method therefor

    • Publication number 20050258452
    • Publication date Nov 24, 2005
    • Satoru Konishi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Manufacturing method of semiconductor device and semiconductor device

    • Publication number 20050101052
    • Publication date May 12, 2005
    • Yoshihiko Kobayashi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor device and a method of manufacturing the same

    • Publication number 20050082683
    • Publication date Apr 21, 2005
    • RENESAS TECHNOLOGY CORP.
    • Masashi Yamaura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor device structural body and electronic device

    • Publication number 20050029666
    • Publication date Feb 10, 2005
    • Yasutoshi Kurihara
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor device

    • Publication number 20040188834
    • Publication date Sep 30, 2004
    • Satoru Konishi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor device

    • Publication number 20040188854
    • Publication date Sep 30, 2004
    • Satoru Konishi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor module

    • Publication number 20040125578
    • Publication date Jul 1, 2004
    • Satoru Konishi
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Semiconductor module

    • Publication number 20040125579
    • Publication date Jul 1, 2004
    • Satoru Konishi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor device and manufacturing the same

    • Publication number 20040113248
    • Publication date Jun 17, 2004
    • Mamoru Ito
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Electronic device

    • Publication number 20040007384
    • Publication date Jan 15, 2004
    • Hitachi, Ltd
    • Tasao Soga
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Solder

    • Publication number 20030224197
    • Publication date Dec 4, 2003
    • Hitachi, Ltd
    • Tasao Soga
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Electronic device

    • Publication number 20020171157
    • Publication date Nov 21, 2002
    • Tasao Soga
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Electronic device

    • Publication number 20020114726
    • Publication date Aug 22, 2002
    • Hitachi, Ltd
    • Tasao Soga
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Electronic device

    • Publication number 20020100986
    • Publication date Aug 1, 2002
    • Hitachi, Ltd
    • Tasao Soga
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Semiconductor device and a method of manufacturing the same

    • Publication number 20020089052
    • Publication date Jul 11, 2002
    • Masashi Yamaura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor devices

    • Publication number 20010023983
    • Publication date Sep 27, 2001
    • Toshiyuki Kobayashi
    • H01 - BASIC ELECTRIC ELEMENTS