Hirokazu Noma

Person

Yasu-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of measuring physical properties, method of evaluating membe...
- Patent number 12,130,247
- Issue date Oct 29, 2024
- Resonac Corporation
- Hirokazu Noma
- G01 - MEASURING TESTING
Information Patent Grant
Via for electrical contact passing through layers of optical wavegu...
- Patent number 9,772,462
- Issue date Sep 26, 2017
- International Business Machines Corporation
- Hirokazu Noma
- G02 - OPTICS
Information Patent Grant
Circuit board formation using organic substrates
- Patent number 9,760,002
- Issue date Sep 12, 2017
- International Business Machines Corporation
- Hiroyuki Mori
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Interfacial alloy layer for improving electromigration (EM) resista...
- Patent number 9,698,119
- Issue date Jul 4, 2017
- International Business Machines Corporation
- Hirokazu Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board formation using organic substrates
- Patent number 9,684,237
- Issue date Jun 20, 2017
- International Business Machines Corporation
- Hiroyuki Mori
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Interfacial alloy layer for improving electromigration (EM) resista...
- Patent number 9,391,034
- Issue date Jul 12, 2016
- International Business Machines Corporation
- Hirokazu Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for electrical contact passing through layers of optical wavegu...
- Patent number 9,354,408
- Issue date May 31, 2016
- International Business Machines Corporation
- Hirokazu Noma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and manufacturing method therefor
- Patent number 7,484,293
- Issue date Feb 3, 2009
- International Business Machines Corporation
- Yoshiyuki Yamaji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MEASURING PHYSICAL PROPERTIES, METHOD OF EVALUATING MEMBE...
- Publication number 20250003902
- Publication date Jan 2, 2025
- Resonac Corporation
- Hirokazu NOMA
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MEASURING PHYSICAL PROPERTIES, METHOD OF EVALUATING MEMBE...
- Publication number 20230204530
- Publication date Jun 29, 2023
- Showa Denko Materials Co., Ltd.
- Hirokazu NOMA
- G01 - MEASURING TESTING
Information Patent Application
INTERFACIAL ALLOY LAYER FOR IMPROVING ELECTROMIGRATION (EM) RESISTA...
- Publication number 20160260681
- Publication date Sep 8, 2016
- International Business Machines Corporation
- Hirokazu Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FOR ELECTRICAL CONTACT PASSING THROUGH LAYERS OF OPTICAL WAVEGU...
- Publication number 20160246017
- Publication date Aug 25, 2016
- International Business Machines Corporation
- Hirokazu Noma
- G02 - OPTICS
Information Patent Application
CIRCUIT BOARD FORMATION USING ORGANIC SUBSTRATES
- Publication number 20160081187
- Publication date Mar 17, 2016
- International Business Machines Corporation
- Hiroyuki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD FORMATION USING ORGANIC SUBSTRATES
- Publication number 20160057857
- Publication date Feb 25, 2016
- International Business Machines Corporation
- Hiroyuki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VIA FOR ELECTRICAL CONTACT PASSING THROUGH LAYERS OF OPTICAL WAVEGU...
- Publication number 20150338589
- Publication date Nov 26, 2015
- International Business Machines Corporation
- Hirokazu Noma
- G02 - OPTICS
Information Patent Application
INTERFACIAL ALLOY LAYER FOR IMPROVING ELECTROMIGRATION (EM) RESISTA...
- Publication number 20140061889
- Publication date Mar 6, 2014
- International Business Machines Corporation
- Hirokazu Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20090047755
- Publication date Feb 19, 2009
- International Business Machines Corporation
- Yoshiyuki Yamaji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Package and Manufacturing Method Therefor
- Publication number 20070145551
- Publication date Jun 28, 2007
- Yoshiyuki Yamaji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hirokazu Noma

Person

Patents Grantslast 30 patents

Method of measuring physical properties, method of evaluating membe...

Via for electrical contact passing through layers of optical wavegu...

Circuit board formation using organic substrates

Interfacial alloy layer for improving electromigration (EM) resista...

Circuit board formation using organic substrates

Interfacial alloy layer for improving electromigration (EM) resista...

Via for electrical contact passing through layers of optical wavegu...

Semiconductor package and manufacturing method therefor

Patents Applicationslast 30 patents

METHOD OF MEASURING PHYSICAL PROPERTIES, METHOD OF EVALUATING MEMBE...

METHOD OF MEASURING PHYSICAL PROPERTIES, METHOD OF EVALUATING MEMBE...

INTERFACIAL ALLOY LAYER FOR IMPROVING ELECTROMIGRATION (EM) RESISTA...

VIA FOR ELECTRICAL CONTACT PASSING THROUGH LAYERS OF OPTICAL WAVEGU...

CIRCUIT BOARD FORMATION USING ORGANIC SUBSTRATES

CIRCUIT BOARD FORMATION USING ORGANIC SUBSTRATES

VIA FOR ELECTRICAL CONTACT PASSING THROUGH LAYERS OF OPTICAL WAVEGU...

INTERFACIAL ALLOY LAYER FOR IMPROVING ELECTROMIGRATION (EM) RESISTA...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

Semiconductor Package and Manufacturing Method Therefor