Hiroki Kamiya

Person

Nagoya-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Reflow device and method for manufacturing substrate using the refl...
- Patent number 11,090,751
- Issue date Aug 17, 2021
- Denso Corporation
- Masayasu Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component-embedded board device and faulty wiring detecting method...
- Patent number 7,889,510
- Issue date Feb 15, 2011
- Denso Corporation
- Satoshi Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate and method of manufacturing the same
- Patent number 7,879,656
- Issue date Feb 1, 2011
- Denso Corporation
- Hiroki Kamiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate and method of manufacturing the same
- Patent number 7,834,441
- Issue date Nov 16, 2010
- Denso Corporation
- Hiroki Kamiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Card edge connector and method of manufacturing the same
- Patent number 7,748,988
- Issue date Jul 6, 2010
- Denso Corporation
- Masashi Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Card edge connector and method of manufacturing the same
- Patent number 7,628,654
- Issue date Dec 8, 2009
- Nippon Soken, Inc.
- Masashi Hori
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REFLOW DEVICE AND METHOD FOR MANUFACTURING SUBSTRATE USING THE REFL...
- Publication number 20190262924
- Publication date Aug 29, 2019
- DENSO CORPORATION
- Masayasu YAMAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer substrate and method of manufacturing the same
- Publication number 20100175250
- Publication date Jul 15, 2010
- DENSO CORPORATION
- Hiroki Kamiya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Card edge connector and method of manufacturing the same
- Publication number 20090191764
- Publication date Jul 30, 2009
- NIPPON SOKEN, INC.
- Masashi Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Card edge connector and method of manufacturing the same
- Publication number 20090191760
- Publication date Jul 30, 2009
- NIPPON SOKEN, INC.
- Masashi Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer substrate and method of manufacturing the same
- Publication number 20080136013
- Publication date Jun 12, 2008
- DENSO CORPORATION
- Hiroki Kamiya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multilayer board
- Publication number 20080017409
- Publication date Jan 24, 2008
- DENSO CORPORATION
- Satoshi Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component-embedded board device and faulty wiring detecting method...
- Publication number 20070263369
- Publication date Nov 15, 2007
- DENSO CORPORATION
- Satoshi Takeuchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Hiroki Kamiya

Person

Patents Grantslast 30 patents

Reflow device and method for manufacturing substrate using the refl...

Component-embedded board device and faulty wiring detecting method...

Multilayer substrate and method of manufacturing the same

Multilayer substrate and method of manufacturing the same

Card edge connector and method of manufacturing the same

Card edge connector and method of manufacturing the same

Patents Applicationslast 30 patents

REFLOW DEVICE AND METHOD FOR MANUFACTURING SUBSTRATE USING THE REFL...

Multilayer substrate and method of manufacturing the same

Card edge connector and method of manufacturing the same

Card edge connector and method of manufacturing the same

Multilayer substrate and method of manufacturing the same

Multilayer board

Component-embedded board device and faulty wiring detecting method...