Hiroki UCHIDA

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Speech providing device, speech reproducing device, speech providin...
- Patent number 11,134,356
- Issue date Sep 28, 2021
- Yamaha Corporation
- Jun Usui
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Voice providing device and voice providing method
- Patent number 10,820,132
- Issue date Oct 27, 2020
- Yamaha Corporation
- Miho Kyoya
- A63 - SPORTS GAMES AMUSEMENTS
Information Patent Grant
Cooling device and electronic device
- Patent number 10,470,337
- Issue date Nov 5, 2019
- Fujitsu Limited
- Hiroki Uchida
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Loop heat pipe and electronic equipment using the same
- Patent number 9,696,096
- Issue date Jul 4, 2017
- Fujitsu Limited
- Hiroki Uchida
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling device using loop type heat pipe
- Patent number 9,464,849
- Issue date Oct 11, 2016
- Fujitsu Limited
- Hiroki Uchida
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Loop heat pipe system and information processing apparatus
- Patent number 9,455,212
- Issue date Sep 27, 2016
- Fujitsu Limited
- Hiroki Uchida
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Loop heat pipe, and electronic apparatus including loop heat pipe
- Patent number 8,780,560
- Issue date Jul 15, 2014
- Fujitsu Limited
- Susumu Ogata
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Loop heat pipe and electronic apparatus
- Patent number 8,705,236
- Issue date Apr 22, 2014
- Fujitsu Limited
- Hiroki Uchida
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic apparatus
- Patent number 7,978,470
- Issue date Jul 12, 2011
- Fujitsu Limited
- Hiroki Uchida
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat transfer sheet, heat transfer structural body and manufacturin...
- Patent number 7,610,678
- Issue date Nov 3, 2009
- Fujitsu Limited
- Hideshi Tokuhira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a printed circuit board for electronic dev...
- Patent number 7,604,152
- Issue date Oct 20, 2009
- Fujitsu Limited
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat-absorbing member, cooling device, and electronic apparatus
- Patent number 7,551,435
- Issue date Jun 23, 2009
- Fujitsu Limited
- Jun Taniguchi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic apparatus
- Patent number 7,502,227
- Issue date Mar 10, 2009
- Fujitsu Limited
- Hiroki Uchida
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling structure for electronic equipment
- Patent number 7,155,914
- Issue date Jan 2, 2007
- Fujitsu Limited
- Minoru Ishinabe
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Solder paste and terminal-to-terminal connection structure
- Patent number 6,867,378
- Issue date Mar 15, 2005
- Fujitsu Limited
- Hiroki Uchida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for designing printed-circuit board
- Patent number 6,662,345
- Issue date Dec 9, 2003
- Fujitsu Limited
- Hiroki Uchida
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solder paste and electronic device
- Patent number 6,596,094
- Issue date Jul 22, 2003
- Fujitsu Limited
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump forming method, electronic component mounting method, a...
- Patent number 6,461,953
- Issue date Oct 8, 2002
- Fujitsu Limited
- Seiki Sakuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for setting heating condition in heating furnace and ther...
- Patent number 6,275,750
- Issue date Aug 14, 2001
- Fujitsu Limited
- Hiroki Uchida
- G05 - CONTROLLING REGULATING
Information Patent Grant
Electronic apparatus, housing for electronic apparatus and housing...
- Patent number 5,872,699
- Issue date Feb 16, 1999
- Fujitsu Limited
- Kota Nishii
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Process and apparatus and panel heater for soldering electronic com...
- Patent number 5,770,835
- Issue date Jun 23, 1998
- Fujitsu Limited
- Seiki Sakuyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process and apparatus for soldering electronic components to printe...
- Patent number 5,607,609
- Issue date Mar 4, 1997
- Fujitsu Ltd.
- Seiki Sakuyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Voice Providing Device and Voice Providing Method
- Publication number 20200037098
- Publication date Jan 30, 2020
- Yamaha Corporation
- Miho KYOYA
- A63 - SPORTS GAMES AMUSEMENTS
Information Patent Application
Speech Providing Device, Speech Reproducing Device, Speech Providin...
- Publication number 20190261123
- Publication date Aug 22, 2019
- Yamaha Corporation
- Jun USUI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
COOLING DEVICE AND ELECTRONIC DEVICE
- Publication number 20190159360
- Publication date May 23, 2019
- Fujitsu Limited
- Hiroki Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVE CONTROLLING APPARATUS, ELECTRONIC DEVICE, COMPUTER-READABLE R...
- Publication number 20180024638
- Publication date Jan 25, 2018
- Fujitsu Limited
- Yasuhiro ENDO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EVAPORATOR, COOLING DEVICE, AND ELECTRONIC APPARATUS
- Publication number 20140318167
- Publication date Oct 30, 2014
- Fujitsu Limited
- Hiroki Uchida
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COOLING DEVICE USING LOOP TYPE HEAT PIPE
- Publication number 20130312939
- Publication date Nov 28, 2013
- Fujitsu Limited
- Hiroki Uchida
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LOOP HEAT PIPE AND ELECTRONIC EQUIPMENT USING THE SAME
- Publication number 20130233521
- Publication date Sep 12, 2013
- Fujitsu Limited
- Hiroki Uchida
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LOOP HEAT PIPE AND ELECTRONIC APPARATUS
- Publication number 20130160974
- Publication date Jun 27, 2013
- Fujitsu Limited
- Hiroki UCHIDA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LOOP HEAT PIPE AND ELECTRONIC APPARATUS
- Publication number 20130083482
- Publication date Apr 4, 2013
- Fujitsu Limited
- Hiroki Uchida
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LOOP HEAT PIPE, AND ELECTRONIC APPARATUS INCLUDING LOOP HEAT PIPE
- Publication number 20130044432
- Publication date Feb 21, 2013
- Fujitsu Limited
- Susumu Ogata
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LOOP HEAT PIPE
- Publication number 20120312506
- Publication date Dec 13, 2012
- Fujitsu Limited
- Hiroki UCHIDA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LOOP HEAT PIPE SYSTEM AND INFORMATION PROCESSING APPARATUS
- Publication number 20120227954
- Publication date Sep 13, 2012
- Fujitsu Limited
- Hiroki UCHIDA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLING APPARATUS AND ELECTRONIC APPARATUS
- Publication number 20120137718
- Publication date Jun 7, 2012
- FUJITSU LIMITED
- Hiroki UCHIDA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LOOP HEAT PIPE AND STARTUP METHOD FOR THE SAME
- Publication number 20120132402
- Publication date May 31, 2012
- FUJITSU LIMITED
- Shigenori Aoki
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20090052135
- Publication date Feb 26, 2009
- Fujitsu Limited
- Hiroki Uchida
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Heat-absorbing member, cooling device, and electronic apparatus
- Publication number 20080055860
- Publication date Mar 6, 2008
- FUJITSU LIMITED
- Jun Taniguchi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for manufacturing a printed circuit board for electronic dev...
- Publication number 20070090171
- Publication date Apr 26, 2007
- FUJITSU LIMITED
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat exchanger for liquid cooling
- Publication number 20070000655
- Publication date Jan 4, 2007
- FUJITSU LIMITED
- Hiroki Uchida
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic apparatus
- Publication number 20060133032
- Publication date Jun 22, 2006
- FUJITSU LIMITED
- Hiroki Uchida
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Radiating fin and method for manufacturing the same
- Publication number 20060065970
- Publication date Mar 30, 2006
- FUJITSU LIMITED
- Hiroki Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic apparatus
- Publication number 20060038285
- Publication date Feb 23, 2006
- FUJITSU LIMITED
- Hideshi Tokuhira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat transfer sheet, heat transfer structural body and manufacturin...
- Publication number 20060037741
- Publication date Feb 23, 2006
- FUJITSU LIMITED
- Hideshi Tokuhira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling structure for electronic equipment
- Publication number 20060005549
- Publication date Jan 12, 2006
- FUJITSU LIMITED
- Minoru Ishinabe
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
Solder paste and terminal-to-terminal connection structure
- Publication number 20030066681
- Publication date Apr 10, 2003
- FUJITSU LIMITED
- Hiroki Uchida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for designing printed-circuit board
- Publication number 20020144228
- Publication date Oct 3, 2002
- FUJITSU LIMITED
- Hiroki Uchida
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Solder paste and electronic device
- Publication number 20020102432
- Publication date Aug 1, 2002
- FUJITSU LIMITED
- Masayuki Ochiai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Hiroki UCHIDA

Person

Patents Grantslast 30 patents

Speech providing device, speech reproducing device, speech providin...

Voice providing device and voice providing method

Cooling device and electronic device

Loop heat pipe and electronic equipment using the same

Cooling device using loop type heat pipe

Loop heat pipe system and information processing apparatus

Loop heat pipe, and electronic apparatus including loop heat pipe

Loop heat pipe and electronic apparatus

Electronic apparatus

Heat transfer sheet, heat transfer structural body and manufacturin...

Method for manufacturing a printed circuit board for electronic dev...

Heat-absorbing member, cooling device, and electronic apparatus

Electronic apparatus

Cooling structure for electronic equipment

Solder paste and terminal-to-terminal connection structure

Method and apparatus for designing printed-circuit board

Solder paste and electronic device

Solder bump forming method, electronic component mounting method, a...

Apparatus for setting heating condition in heating furnace and ther...

Electronic apparatus, housing for electronic apparatus and housing...

Process and apparatus and panel heater for soldering electronic com...

Process and apparatus for soldering electronic components to printe...

Patents Applicationslast 30 patents

Voice Providing Device and Voice Providing Method

Speech Providing Device, Speech Reproducing Device, Speech Providin...

COOLING DEVICE AND ELECTRONIC DEVICE

DRIVE CONTROLLING APPARATUS, ELECTRONIC DEVICE, COMPUTER-READABLE R...

EVAPORATOR, COOLING DEVICE, AND ELECTRONIC APPARATUS

COOLING DEVICE USING LOOP TYPE HEAT PIPE

LOOP HEAT PIPE AND ELECTRONIC EQUIPMENT USING THE SAME

LOOP HEAT PIPE AND ELECTRONIC APPARATUS

LOOP HEAT PIPE AND ELECTRONIC APPARATUS

LOOP HEAT PIPE, AND ELECTRONIC APPARATUS INCLUDING LOOP HEAT PIPE

LOOP HEAT PIPE

LOOP HEAT PIPE SYSTEM AND INFORMATION PROCESSING APPARATUS

COOLING APPARATUS AND ELECTRONIC APPARATUS

LOOP HEAT PIPE AND STARTUP METHOD FOR THE SAME

ELECTRONIC APPARATUS

Heat-absorbing member, cooling device, and electronic apparatus

Method for manufacturing a printed circuit board for electronic dev...

Heat exchanger for liquid cooling

Electronic apparatus

Radiating fin and method for manufacturing the same

Electronic apparatus

Heat transfer sheet, heat transfer structural body and manufacturin...

Cooling structure for electronic equipment

Solder paste and terminal-to-terminal connection structure

Method and apparatus for designing printed-circuit board

Solder paste and electronic device