Hiromasa HASHIMOTO

Person

Nishigo-mura, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for selecting template assembly, method for polishing workpi...
- Patent number 11,731,236
- Issue date Aug 22, 2023
- Shin-Etsu Handotai Co., Ltd.
- Kazuya Sato
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing wafer and polishing apparatus
- Patent number 10,744,615
- Issue date Aug 18, 2020
- Shin-Etsu Handotai Co., Ltd.
- Kazuya Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for evaluating surface defects of substrate to be bonded
- Patent number 10,707,140
- Issue date Jul 7, 2020
- Shin-Etsu Handotai Co., Ltd.
- Kazuya Sato
- G01 - MEASURING TESTING
Information Patent Grant
Method for polishing silicon wafer
- Patent number 10,460,947
- Issue date Oct 29, 2019
- Shin-Etsu Handotai Co., Ltd.
- Masanao Sasaki
- B24 - GRINDING POLISHING
Information Patent Grant
Method of producing polishing head and polishing apparatus
- Patent number 10,293,460
- Issue date May 21, 2019
- Shin-Etsu Handotai Co., Ltd.
- Hiromasa Hashimoto
- B24 - GRINDING POLISHING
Information Patent Grant
Method for producing mirror-polished wafer
- Patent number 9,748,089
- Issue date Aug 29, 2017
- Shin-Etsu Handotai Co., Ltd.
- Hiromasa Hashimoto
- B24 - GRINDING POLISHING
Information Patent Grant
Method for producing silicon wafer
- Patent number 9,425,056
- Issue date Aug 23, 2016
- Shin-Etsu Handotai Co., Ltd.
- Takuya Sasaki
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head and polishing apparatus
- Patent number 9,278,425
- Issue date Mar 8, 2016
- Shin-Etsu Handotai Co., Ltd.
- Hiromasa Hashimoto
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head and polishing apparatus
- Patent number 8,636,561
- Issue date Jan 28, 2014
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head and polishing apparatus having the same
- Patent number 8,021,210
- Issue date Sep 20, 2011
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head, polishing apparatus and polishing method for semico...
- Patent number 7,740,521
- Issue date Jun 22, 2010
- Shin-Etsu Handotai Co., Ltd.
- Hiromasa Hashimoto
- B24 - GRINDING POLISHING
Information Patent Grant
Process for manufacturing semiconductor wafer and semiconductor wafer
- Patent number 6,729,941
- Issue date May 4, 2004
- Shin-Etsu Handotai & Co., Ltd.
- Junichi Ueno
- B24 - GRINDING POLISHING
Information Patent Grant
Backing pad and method for polishing semiconductor wafer therewith
- Patent number 5,788,560
- Issue date Aug 4, 1998
- Shin-Etsu Handotai Co., Ltd.
- Hiromasa Hashimoto
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing machine and method of dissipating heat therefrom
- Patent number 5,718,620
- Issue date Feb 17, 1998
- Shin-Etsu Handotai
- Kohichi Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Method of polishing semiconductor wafers and apparatus therefor
- Patent number 5,584,746
- Issue date Dec 17, 1996
- Shin-Etsu Handotai Co., Ltd.
- Kouichi Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing member and wafer polishing apparatus
- Patent number 5,564,965
- Issue date Oct 15, 1996
- Shin-Etsu Handotai Co., Ltd.
- Kouichi Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 5,549,502
- Issue date Aug 27, 1996
- Fujikoshi Machinery Corp.
- Kohichi Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing machine and method of dissipating heat therefrom
- Patent number 5,400,547
- Issue date Mar 28, 1995
- Shin-Etsu Handotai Co., Ltd.
- Kohichi Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Method of chucking semiconductor wafers
- Patent number 5,335,457
- Issue date Aug 9, 1994
- Shin-Etsu Handotai Co., Ltd.
- Akira Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic wafer lapping apparatus
- Patent number 5,333,413
- Issue date Aug 2, 1994
- Shin-Etsu Handotai Co., Ltd.
- Hiromasa Hashimoto
- B24 - GRINDING POLISHING
Information Patent Grant
Automatic wafer lapping apparatus
- Patent number 5,174,067
- Issue date Dec 29, 1992
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Method for preparing a semiconductor wafer
- Patent number 5,157,877
- Issue date Oct 27, 1992
- Shin-Etsu Handotai Co., Ltd.
- Hiromasa Hashimoto
- B24 - GRINDING POLISHING
Information Patent Grant
Foam backing for use with semiconductor wafers
- Patent number 5,101,602
- Issue date Apr 7, 1992
- Shin-Etsu Handotai Co., Ltd.
- Hiromasa Hashimoto
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR EVALUATING SURFACE DEFECTS OF SUBSTRATE TO BE BONDED
- Publication number 20190181059
- Publication date Jun 13, 2019
- Shin-Etsu Handotai Co., Ltd.
- Kazuya SATO
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR SELECTING TEMPLATE ASSEMBLY, METHOD FOR POLISHING WORKPI...
- Publication number 20190126431
- Publication date May 2, 2019
- Shin-Etsu Handotai Co., Ltd.
- Kazuya SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE POLISHING APPARATUS
- Publication number 20190001463
- Publication date Jan 3, 2019
- Shin-Etsu Handotai Co., Ltd.
- Hiromasa HASHIMOTO
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR POLISHING WAFER AND POLISHING APPARATUS
- Publication number 20180290261
- Publication date Oct 11, 2018
- Shin-Etsu Handotai Co., Ltd.
- Kazuya SATO
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR POLISHING SILICON WAFER
- Publication number 20170345662
- Publication date Nov 30, 2017
- Shin-Etsu Handotai Co., Ltd.
- Masanao SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING MIRROR-POLISHED WAFER
- Publication number 20160217998
- Publication date Jul 28, 2016
- Shin-Etsu Handotai Co., Ltd.
- Hiromasa HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING POLISHING HEAD AND POLISHING APPARATUS
- Publication number 20160101503
- Publication date Apr 14, 2016
- Shin-Etsu Handotai Co., Ltd.
- Hiromasa HASHIMOTO
- B24 - GRINDING POLISHING
Information Patent Application
WORKPIECE POLISHING APPARATUS
- Publication number 20160082567
- Publication date Mar 24, 2016
- SHIN-ETSU HANDOTAI CO.,LTD.
- Hiromasa HASHIMOTO
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR PRODUCING SILICON WAFER
- Publication number 20130316521
- Publication date Nov 28, 2013
- Shin-Etsu Handotai Co., Ltd.
- Takuya Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING HEAD AND POLISHING APPARATUS
- Publication number 20120289129
- Publication date Nov 15, 2012
- FUJIKOSHI MACHINERY CORP.
- Hiromasa Hashimoto
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD AND POLISHING APPARATUS
- Publication number 20110136414
- Publication date Jun 9, 2011
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR MANUFACTURING POLISHING HEAD AND POLISHING APPARATUS
- Publication number 20110070813
- Publication date Mar 24, 2011
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD AND POLISHING APPARATUS HAVING THE SAME
- Publication number 20100291838
- Publication date Nov 18, 2010
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Application
Polishing Head, Polishing Apparatus and Polishing Method for Semico...
- Publication number 20080254720
- Publication date Oct 16, 2008
- Shin-Etsu Handotai Co., Ltd.
- Hiromasa Hashimoto
- B24 - GRINDING POLISHING
Information Patent Application
Process for manufacturing semiconductor wafer and semiconductor wafer
- Publication number 20040224519
- Publication date Nov 11, 2004
- SHIN-ETSU HANDOTAI CO., LTD.
- Junichi Ueno
- B24 - GRINDING POLISHING
Information Patent Application
Method for producing semiconductor wafer and semiconductor wafer
- Publication number 20020137313
- Publication date Sep 26, 2002
- Junichi Ueno
- B24 - GRINDING POLISHING

Hiromasa HASHIMOTO

Person

Patents Grantslast 30 patents

Method for selecting template assembly, method for polishing workpi...

Method for polishing wafer and polishing apparatus

Method for evaluating surface defects of substrate to be bonded

Method for polishing silicon wafer

Method of producing polishing head and polishing apparatus

Method for producing mirror-polished wafer

Method for producing silicon wafer

Polishing head and polishing apparatus

Polishing head and polishing apparatus

Polishing head and polishing apparatus having the same

Polishing head, polishing apparatus and polishing method for semico...

Process for manufacturing semiconductor wafer and semiconductor wafer

Backing pad and method for polishing semiconductor wafer therewith

Polishing machine and method of dissipating heat therefrom

Method of polishing semiconductor wafers and apparatus therefor

Polishing member and wafer polishing apparatus

Polishing apparatus

Polishing machine and method of dissipating heat therefrom

Method of chucking semiconductor wafers

Automatic wafer lapping apparatus

Automatic wafer lapping apparatus

Method for preparing a semiconductor wafer

Foam backing for use with semiconductor wafers

Patents Applicationslast 30 patents

METHOD FOR EVALUATING SURFACE DEFECTS OF SUBSTRATE TO BE BONDED

METHOD FOR SELECTING TEMPLATE ASSEMBLY, METHOD FOR POLISHING WORKPI...

WORKPIECE POLISHING APPARATUS

METHOD FOR POLISHING WAFER AND POLISHING APPARATUS

METHOD FOR POLISHING SILICON WAFER

METHOD FOR PRODUCING MIRROR-POLISHED WAFER

METHOD OF PRODUCING POLISHING HEAD AND POLISHING APPARATUS

WORKPIECE POLISHING APPARATUS

METHOD FOR PRODUCING SILICON WAFER

POLISHING HEAD AND POLISHING APPARATUS

POLISHING HEAD AND POLISHING APPARATUS

METHOD FOR MANUFACTURING POLISHING HEAD AND POLISHING APPARATUS

POLISHING HEAD AND POLISHING APPARATUS HAVING THE SAME

Polishing Head, Polishing Apparatus and Polishing Method for Semico...

Process for manufacturing semiconductor wafer and semiconductor wafer

Method for producing semiconductor wafer and semiconductor wafer