Hiromi Fujisawa

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wire bonding method, wire bonding apparatus, and wire bonding contr...
- Patent number 8,042,725
- Issue date Oct 25, 2011
- Kaijo Corporation
- Toru Arahata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire loop, semiconductor device having same and wire bonding method
- Patent number 8,016,182
- Issue date Sep 13, 2011
- Kaijo Corporation
- Mizuho Shirato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire loop, semiconductor device having same and wire bonding method
- Patent number 7,815,095
- Issue date Oct 19, 2010
- Kaijo Corporation
- Hiromi Fujisawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding method, wire bonding apparatus, and wire bonding contr...
- Patent number 7,748,599
- Issue date Jul 6, 2010
- Kaijo Corporation
- Toru Arahata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire loop, semiconductor device having same, wire bonding method an...
- Patent number 7,262,124
- Issue date Aug 28, 2007
- Kaijo Corporation
- Hiromi Fujisawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire loop, semiconductor device having same, wire bonding method an...
- Patent number 6,933,608
- Issue date Aug 23, 2005
- Kaijo Corporation
- Hiromi Fujisawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING METHOD, WIRE BONDING APPARATUS, AND WIRE BONDING CONTR...
- Publication number 20100206940
- Publication date Aug 19, 2010
- KAIJO CORPORATION
- Toru ARAHATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING METHOD, WIRE BONDING APPARATUS, AND WIRE BONDING CONTR...
- Publication number 20100059574
- Publication date Mar 11, 2010
- KAIJO CORPORATION
- Toru ARAHATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire loop, semiconductor device having same and wire bonding method
- Publication number 20060255101
- Publication date Nov 16, 2006
- Mizuho Shirato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire loop, semiconductor device having same and wire bonding method
- Publication number 20060151579
- Publication date Jul 13, 2006
- Hiromi Fujisawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire loop, semiconductor device having same, wire bonding method an...
- Publication number 20050189567
- Publication date Sep 1, 2005
- Hiromi Fujisawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire loop, semiconductor device having same, wire bonding method an...
- Publication number 20040104477
- Publication date Jun 3, 2004
- Hiromi Fujisawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Hiromi Fujisawa

Person

Patents Grantslast 30 patents

Wire bonding method, wire bonding apparatus, and wire bonding contr...

Wire loop, semiconductor device having same and wire bonding method

Wire loop, semiconductor device having same and wire bonding method

Wire bonding method, wire bonding apparatus, and wire bonding contr...

Wire loop, semiconductor device having same, wire bonding method an...

Wire loop, semiconductor device having same, wire bonding method an...

Patents Applicationslast 30 patents

WIRE BONDING METHOD, WIRE BONDING APPARATUS, AND WIRE BONDING CONTR...

WIRE BONDING METHOD, WIRE BONDING APPARATUS, AND WIRE BONDING CONTR...

Wire loop, semiconductor device having same and wire bonding method

Wire loop, semiconductor device having same and wire bonding method

Wire loop, semiconductor device having same, wire bonding method an...

Wire loop, semiconductor device having same, wire bonding method an...